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    QFN WEIGHT Search Results

    QFN WEIGHT Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    TPS62110RSARG4 Texas Instruments Adjustable, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS62110RSAR Texas Instruments Adjustable, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS61091RSAR Texas Instruments 3.3-V Output, 500-mA, 96% Efficient Boost Converter, 20uA, QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy

    QFN WEIGHT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389 PDF

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil PDF

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		TB389 PDF

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN PDF

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil PDF

    mc13718

    Abstract: Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR MC13717 Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight
    Text: Freescale Semiconductor Advance Information MC13790/D Rev. 1.1, 11/2004 MC13790 Package Information QFN Package Case 1506-01 QFN–76 MC13790 Ordering Information Integrated Power Management IC Device Operating Temperature Range Package MC13790 TA = –20°C to 70°C


    Original     		MC13790/D MC13790 MC13790 MC13717 MC13790application, MC13790/D mc13718 Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight PDF

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer PDF

    smd code z16

    Abstract: CY22388 CY22389 CY22391 SMD-49 ZZ16 CY22391LTXC-xxx
    Text: CY22388, CY22389, CY22391 Factory Programmable Quad PLL Clock Generator with VCXO Features • 16-/20-pin TSSOP and 32-pin QFN packages ■ 3.3V operation with 2.5V output buffer option ■ Fully integrated phase-locked loops PLLs ■ QFN package Benefits


    Original     		CY22388, CY22389, CY22391 16-/20-pin 32-pin 20-pin 16-pin smd code z16 CY22388 CY22389 CY22391 SMD-49 ZZ16 CY22391LTXC-xxx PDF

    DUAL ROW QFN leadframe

    Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This


    Original     		PDF

    440G

    Abstract: ATXN6077A CYWUSB6935 LR06
    Text: CYWUSB6935 WirelessUSB LR 2.4-GHz DSSS Radio SoC 1.0 Features • 2.4-GHz radio transceiver The CYWUSB6935 is offered in an industrial temperature range 48-pin QFN and a commercial temperature range 48-pin QFN. • Operates in the unlicensed Industrial, Scientific, and


    Original     		CYWUSB6935 CYWUSB6935 48-pin 95-dBm 13-MHz 440G ATXN6077A LR06 PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


    Original     		PDF

    qfn Substrate design guidelines

    Abstract: j-std-001d IPC-SM-782 MO-220 TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid


    Original     		TB389 qfn Substrate design guidelines j-std-001d IPC-SM-782 MO-220 PDF

    J-STD-005

    Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging


    Original     		TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN PDF

    440G

    Abstract: ATXN6077A CYWUSB6935 LR06 zero crossing detector using psoc
    Text: CYWUSB6935 WirelessUSB LR 2.4-GHz DSSS Radio SoC 1.0 Features • 2.4-GHz radio transceiver The CYWUSB6935 is offered in an industrial temperature range 48-pin QFN and a commercial temperature range 48-pin QFN. • Operates in the unlicensed Industrial, Scientific, and


    Original     		CYWUSB6935 CYWUSB6935 48-pin 95-dBm 13-MHz 440G ATXN6077A LR06 zero crossing detector using psoc PDF

    Analog devices marking Information APA

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 Analog devices marking Information APA PDF

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 PDF

    Untitled

    Abstract: No abstract text available
    Text: EMIF08-0402T16 8 lines IPAD low capacitance EMI filter and ESD protection in thin micro QFN Datasheet − production data Features • High efficiency in EMI filtering ■ ESD performances: up to 15 kV ■ Micro QFN 400 µm pitch ■ Low PCB space consuming with narrow


    Original     		EMIF08-0402T16 PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 PDF

    Untitled

    Abstract: No abstract text available
    Text: LUXEON 3020 Hot targeted leading lm/$ QFN with superior lumen maintenance Introduction LUXEON 3020 is the first and only hot color targeted EMC based 3.0mm x 2.0mm QFN delivering up to 155 lm/W with superior lumen maintenance and assurance of ANSI compliance at operating conditions. Make mass production


    Original     		DS209 PDF

    L130

    Abstract: No abstract text available
    Text: LUXEON 3020 Hot targeted leading lm/$ QFN with superior lumen maintenance Introduction LUXEON 3020 is the first and only hot color targeted EMC based 3.0mm x 2.0mm QFN delivering up to 155 lm/W with superior lumen maintenance and assurance of ANSI compliance at operating conditions. Make mass production


    Original     		DS209 L130 PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER


    Original     		TPA3100D2-Q1 SLOS557 PDF