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    QFN-44 PACKAGE FOOTPRINT Search Results

    QFN-44 PACKAGE FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    QFN-44 PACKAGE FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    OFDM transceiver 800mhz

    Abstract: No abstract text available
    Text: TQP8M9013 ½ W High Linearity 5V 2-Stage Amplifier Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE 24-pin 4x4mm leadless QFN package GND / NC NC 700-3800 MHz 29.5 dB Gain @ 2140 MHz +28 dBm P1dB +44 dBm Output IP3 2.9 dB Noise Figure


    Original     		PDF TQP8M9013 24-pin TQP8M9013 OFDM transceiver 800mhz

    ofdm transceiver 900mhz

    Abstract: 433 mhz rf power amplifier module efficiency 04023J2R2BBS
    Text: TQP8M9013 ½ W High Linearity 5V 2-Stage Amplifier Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE 24-pin 4x4mm leadless QFN package GND / NC NC 700-3800 MHz 29.5 dB Gain @ 2140 MHz +28 dBm P1dB +44 dBm Output IP3 2.9 dB Noise Figure


    Original     		PDF TQP8M9013 24-pin TQP8M9013 ofdm transceiver 900mhz 433 mhz rf power amplifier module efficiency 04023J2R2BBS

    TQP8M9013

    Abstract: ofdm transceiver 900mhz 04023J2R2BBS 04023J1R0BBS LL1608-FSL2N7S
    Text: TQP8M9013 ½ W High Linearity 5V 2-Stage Amplifier Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE 24-pin 4x4mm leadless QFN package GND / NC NC 700-3800 MHz 29.5 dB Gain @ 2140 MHz +28 dBm P1dB +44 dBm Output IP3 2.9 dB Noise Figure


    Original     		PDF TQP8M9013 24-pin TQP8M9013 ofdm transceiver 900mhz 04023J2R2BBS 04023J1R0BBS LL1608-FSL2N7S

    04023J1R0BBS

    Abstract: 8M9013 ofdm transceiver 900mhz 04023J2R2BBS LL1608-FSL2N7S TQP8M9013 power amplifier transceiver 4G LTE AH125 04023J0R5BBS 433 mhz rf power amplifier module efficiency
    Text: TQP8M9013 ½ W High Linearity 5V 2-Stage Amplifier Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE 24-pin 4x4mm leadless QFN package GND / NC NC 700-3800 MHz 29.5 dB Gain @ 2140 MHz +28 dBm P1dB +44 dBm Output IP3 2.9 dB Noise Figure


    Original     		PDF TQP8M9013 24-pin TQP8M9013 04023J1R0BBS 8M9013 ofdm transceiver 900mhz 04023J2R2BBS LL1608-FSL2N7S power amplifier transceiver 4G LTE AH125 04023J0R5BBS 433 mhz rf power amplifier module efficiency

    Untitled

    Abstract: No abstract text available
    Text: HI-3588A ARINC 429 Receiver with SPI Interface December 2007 GENERAL DESCRIPTION IN 44 - Pin Plastic 7mm x 7mm Chip-Scale Package QFN PR EL • · · · · · · · ARINC specification 429 compliant 3.3V or 5.0V logic supply operation On-chip analog line receiver connects directly to


    Original     		PDF RINA-40 RINB-40 HI-3588A HI-3588A 44-PIN 44PQS

    3588A

    Abstract: 44PCS
    Text: HI-3588A ARINC 429 Receiver with SPI Interface August 2007 GENERAL DESCRIPTION IN 44 - Pin Plastic 7mm x 7mm Chip-Scale Package QFN PR EL • · · · · · · · ARINC specification 429 compliant 3.3V or 5.0V logic supply operation On-chip analog line receiver connects directly to


    Original     		PDF RINA-40 RINB-40 HI-3588A HI-3588A 44-PIN 44PQS 3588A 44PCS

    3588A

    Abstract: HI-3588A ARINC 429, Receiver
    Text: HI-3588A ARINC 429 Receiver with SPI Interface September 2007 GENERAL DESCRIPTION IN 44 - Pin Plastic 7mm x 7mm Chip-Scale Package QFN PR EL • · · · · · · · ARINC specification 429 compliant 3.3V or 5.0V logic supply operation On-chip analog line receiver connects directly to


    Original     		PDF RINA-40 RINB-40 HI-3588A HI-3588A 44-PIN 44PQS 3588A ARINC 429, Receiver

    Untitled

    Abstract: No abstract text available
    Text: HI-3588A ARINC 429 Receiver with SPI Interface July 2007 GENERAL DESCRIPTION IN 44 - Pin Plastic 7mm x 7mm Chip-Scale Package QFN PR EL • · · · · · · · ARINC specification 429 compliant 3.3V or 5.0V logic supply operation On-chip analog line receiver connects directly to


    Original     		PDF RINA-40 RINB-40 HI-3588A HI-3588A 44-PIN 44PQS

    3588A

    Abstract: No abstract text available
    Text: HI-3588A ARINC 429 Receiver with SPI Interface February 2008 GENERAL DESCRIPTION IN 44 - Pin Plastic 7mm x 7mm Chip-Scale Package QFN PR EL • · · · · · · · ARINC specification 429 compliant 3.3V or 5.0V logic supply operation On-chip analog line receiver connects directly to


    Original     		PDF RINA-40 RINB-40 HI-3588A HI-3588A 44-PIN 44PQS 3588A

    PM-DB2725EX

    Abstract: PM-DB2745S PM-DB2762 PM-DB2745L PM-DB2727 PM-DB2725 PM-DB2745D PM-DB2791 HI-6121 SMD code sa
    Text: Miltary Selector Guide 2012_R2:Layout 1 1/12/12 5:46 PM Page 1 IC PACKAGES 6 Package Material SMD QFN-44 Plastic Y I, T, M 0.276 x 0.276 x 0.039 7.0 x 7.0 x 1.0 ESOIC-20 Plastic Y I, T, M 0.504 x 0.407 x 0.0975 (12.79 x 10.325 x 2.481) 2 3 Dimensions in inches7


    Original     		PDF PM-DB2791S PM-DB2795S PM-DB2798S PM-DB2762 PM-DB2766 PM-DB27101 PM-DB2702 PM-DB2742 PM-DB2742L PM-DB2742S PM-DB2725EX PM-DB2745S PM-DB2745L PM-DB2727 PM-DB2725 PM-DB2745D PM-DB2791 HI-6121 SMD code sa

    qfn 44 PACKAGE footprint

    Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
    Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The


    Original     		PDF AN-002 ML6652 AN-002 ML6652CM/EM QFN/LPCC44 ML6652. ML6652CH/EH qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 eco solder paste

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    TOSHIBA 8879

    Abstract: QFN-20 footprint
    Text: Selection Guide SEMTECH WIRELESS & SENSING PRODUCTS Touch Interface Solutions Digitally Enhanced Human Sensing for Smarter and Robust Applications S Multi-touch Low Power Robust ESD Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver


    Original     		PDF SX9300* SX9300 Wireles879* TouchSG-0612 TOSHIBA 8879 QFN-20 footprint

    2X15

    Abstract: PJBZ5200Q PJBZ5221Q PJBZ5222Q PJBZ5223Q SC75
    Text: PJBZ5200Q SERIES 500mW ZENERS IN QFN 1.2x1.5 mm² PACKAGE PRELIMINARY This new PANJIT Zener family comes in a very small package that only uses 1.8 sq mm PCB area. With a maximum power dissipation rating of 500mW, the PJBZ5200Q Series is an industry first. It's superior power-footprint ratio


    Original     		PDF PJBZ5200Q 500mW 500mW, 278mW PJBZ5257Q PJBZ5258Q PJBZ5259Q 2X15 PJBZ5221Q PJBZ5222Q PJBZ5223Q SC75

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    isl24007

    Abstract: ISL24005 ISL24016 ISL24813 ISL24822 isl248 ISL24821 ISL29010 ISL78010 APPLICATION NOTES ISL24008
    Text: Display ICs 8 2008 P RODUCT S ELECTION GUIDE Display ICs pg. 8-1 VCOM and Gamma Buffers (pg. 8-2) Integrated DC/DC Regulators (pg. 8-4) Programmable VCOM Amplifiers (pg. 8-2) Ambient Light Sensors (pg. 8-5) OLED Power ICs (pg. 8-6) Level Shifters (pg. 8-7)


    Original     		PDF 1-888-INTERSIL isl24007 ISL24005 ISL24016 ISL24813 ISL24822 isl248 ISL24821 ISL29010 ISL78010 APPLICATION NOTES ISL24008

    KSZ8864RMN

    Abstract: cmos 4190 64-pinQFN ksz8864
    Text: KSZ8864RMN Product Brief Low-Power, Integrated 10/100BASE-T/TX 4-Port Switch Description The KSZ8864RMN is low-power, integrated 10/100BaseT/TX 4-port Layer-2 switch on a chip IC, in industry’s smallest footprint. Supporting flexible MAC interface configurations and housed in 64-pin QFN package, the


    Original     		PDF KSZ8864RMN 10/100BASE-T/TX KSZ8864RMN 10/100BaseT/TX 64-pin M9999-102910 cmos 4190 64-pinQFN ksz8864

    Untitled

    Abstract: No abstract text available
    Text: CY8C20xx7/S 1.8 V CapSense Controller with SmartSense Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors Features • ■ QuietZone™ Controller ❐ Patented Capacitive Sigma Delta PLUS CSD PLUS™


    Original     		PDF CY8C20xx7/S

    Untitled

    Abstract: No abstract text available
    Text: HI-3598, HI-3599 Octal ARINC 429 Receivers with Label Recognition and SPI Interface May 2009 GENERAL DESCRIPTION The Serial Peripheral Interface minimizes the number of host interface signals, providing a small footprint device which can be interfaced to a wide variety of industrystandard microcontrollers supporting SPI. Alternatively,


    Original     		PDF HI-3598, HI-3599 RIN8B-40 RIN8A-40 HI-3598 HI-3599 44-PIN 44PCS

    ISL24007

    Abstract: isl24822 ISL24005 ISL24813 isl248 ISL24821 ISL97656 EL7583 EL5120 EL5210
    Text: Display ICs 8 2009 P RODUCT S ELECTION GUIDE Display ICs pg. 8-1 VCOM and Gamma Buffers (pg. 8-2) LCD Display Power (pg. 8-4) Programmable VCOM Amplifiers (pg. 8-2) Ambient Light Sensors (pg. 8-6) OLED Power ICs (pg. 8-7) Level Shifters (pg. 8-8) LCD and LED


    Original     		PDF 1-888-INTERSIL ISL24010 ISL24011 EL5000A ISL24016 ISL24017 ISL24007 isl24822 ISL24005 ISL24813 isl248 ISL24821 ISL97656 EL7583 EL5120 EL5210

    HI-3599

    Abstract: HI-3599PST HI-3598 HI-3599PCT-40
    Text: HI-3598, HI-3599 Octal ARINC 429 Receivers with Label Recognition and SPI Interface June 2008 GENERAL DESCRIPTION The Serial Peripheral Interface minimizes the number of host interface signals, providing a small footprint device which can be interfaced to a wide variety of industrystandard microcontrollers supporting SPI. Alternatively,


    Original     		PDF HI-3598, HI-3599 RIN8B-40 RIN8A-40 HI-3598 HI-3599 44-PIN 44PCS HI-3599PST HI-3599PCT-40