Oscilloscope
Abstract: QFP 0.3mm pitch
Text: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm
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DOD-5011)
Oscilloscope
QFP 0.3mm pitch
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0.3mm qfp
Abstract: No abstract text available
Text: MicroGripper 0.5-0.3mm MicroGripper Industry's smallest gripper simplifies testing of High-Performance Integrated Circuits w w w w w w w Used on a variety of QFP & SOIC chip packages Connects to devices with lead pitches as small as 0.3mm Reduces chance of shorting with smallest wire tip diameter 0.08mm
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10/pkg.
0.3mm qfp
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QFP 0.3mm pitch
Abstract: IPC-4101 345C BOX21151 IPC4553 SF-QFE80SC-L-01F
Text: RoHS COMPLIANT Emulates QFP package: 12.0mm body 14.0mm Tip to Tip 0.5mm pitch 13.2mm [0.520"] PAD DETAIL 0.5mm Top View 19 0.5mm =9.5mm 0.3mm 12.2mm [0.480"] 13.2mm [0.520"] 0.46mm±0.03mm dia. 0.1mm rad. 1.27mm typ. 2 6.4mm 0.250" 1 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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IPC4553
o6/83/98,
SF-QFE80SC-L-01F
BOX21151
SF-QFE080SC-L-01F
QFP 0.3mm pitch
IPC-4101
345C
IPC4553
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Untitled
Abstract: No abstract text available
Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact
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Untitled
Abstract: No abstract text available
Text: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount ing. Poor contact may result if the socket contacts
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QFP lead pitch 0.3mm
Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration
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Sep2009
ISO9001
50x50mm
QFP lead pitch 0.3mm
BGA and QFP Package mounting
QFP 0.3mm pitch
particle
0.3mm pitch BGA
bga socket
material for chip resistors
8 soic pcb footprint
qfp 100 SOCKET
BGA and QFP Package
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SF-QFJ256SA-L-01
Abstract: No abstract text available
Text: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.
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FR4/G10
SF-QFJ256SA-L-01
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SF-QFJ256SC-L-01
Abstract: qfp 0.3mm pitch
Text: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.
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FR4/G10
SF-QFJ256SC-L-01
qfp 0.3mm pitch
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QFP 0.3mm pitch
Abstract: SF-QFE256SB-L-01
Text: Detail A 39.37mm 1.550 37.08mm 1.460 0.5mm Top View 37.08mm 1.460 39.37mm 1.550 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 1 6.35mm 0.250 Side View 0.5mm. pitch B A DETAIL A 1 2 Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over
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FR4/G10
SF-QFE256SB-L-01
SF-QFE256SB-L-02
QFP 0.3mm pitch
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Untitled
Abstract: No abstract text available
Text: REVISIONS NO. DESCRIPTION Was -B Typo 1 0.30 ±0.05 DATE BY 11/5/96 SDC 2.0 • See Note 6 Ø1.5 +0.1/-0.0 • See Note 1 1.75 A 4.0 R.5 (2) 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ±0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A R1.0 Typical Ø1.5 MIN Notes: 1. 10 sprocket hole pitch cumulative tolerance
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100mm
Q07X07-C
A1030-96-1
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QFP-128
Abstract: 0.3mm qfp CA-QFE128RB-M-S-01
Text: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] 0.3mm [0.012"] Top View 19.56mm [0.770"] 1 Side View 8.61mm [0.339"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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FR4/G10
CA-QFE128RB-M-S-01
QFP-128
0.3mm qfp
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IC201
Abstract: IC201-1604-006 IC217-2404-007 IC248-1284-007 QFP 128 pin Socket IC201-2084-029 IC201-1204-017 IC201-1444-026 IC201-1444-034 IC217-1444-003
Text: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*
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IC200
IC248
10mA/20mV
W564-002-2
IC201-2084-029
IC201-3044-004
IC201
IC201-1604-006
IC217-2404-007
IC248-1284-007
QFP 128 pin Socket
IC201-2084-029
IC201-1204-017
IC201-1444-026
IC201-1444-034
IC217-1444-003
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IC201-0644-003
Abstract: IC201-1004-008 IC201-0644-003 socket 1004 170 IC201-0804-014 IC201-1004-050 IC200 IC201-0644-019 IC201-0644-040 IC201-0804-020
Text: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 064 4 - 019 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*
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IC200
IC248
10mA/20mV
65x19
IC201-1004-050
IC201-1004-016
IC216
65x29
IC201-0644-003
IC201-1004-008
IC201-0644-003 socket
1004 170
IC201-0804-014
IC201-1004-050
IC201-0644-019
IC201-0644-040
IC201-0804-020
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qfp 0.3mm pitch
Abstract: CA-QFE128RB-L-S-01 SF-QFE128RB-L-01
Text: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] Top View 0.3mm [0.012"] 19.56mm [0.770"] 1 8.61mm [0.339"] 3 10.52mm [0.414" plugged] 2 Side View 6.35mm [0.250"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
SF-QFE128RB-L-01
Description20"
CA-QFE128RB-L-S-01
qfp 0.3mm pitch
SF-QFE128RB-L-01
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IC Package Names and Code Designations
Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages
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10-001A
IC Package Names and Code Designations
data sheet IC 7408
7404 not gate ic
MSP 044 THERMISTOR
enplas otq-100-0.5
IC 7404 7406
IC51-1004-809
ic 7404 datasheet
HLP40R
ic 7408
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05Mm
Abstract: No abstract text available
Text: QFP Open Top IC200, IC201, IC218 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage 1,000MQ minimum at 500VDC 500VAC RMS fo r one minute: IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC RMS fo r one minute: IC200-1284-001, IC 201-0804-005,
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IC200,
IC201,
IC218
000MQ
500VDC
500VAC
IC200-2084-009,
IC200-2084-010,
IC201-1004-008
700VAC
05Mm
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PDF
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atmel 404
Abstract: No abstract text available
Text: REVISIONS NO. 2.0 ± 0.15 • See Note 6 0.30 ± 0.05 DESCRIPTION DATE BY 1.5 +0.1/-0.0 DIA 4.0 • See Note 1 A 2.00 MIN 1.75 2.5 0.3 R MAX. 20.2 ± 0.15 • See Note 6 Bo 45 ° 40.4 16.0 44.0 ± 0.3 Ko 10.0 A K1 Ao 0.5 Radius Typical 24.0 SECTION A-A 0.75 R
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100mm
Q1420P-B
14x20
A0113-95-2
atmel 404
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0.3mm qfp
Abstract: SF-QFE176SA-L-01F
Text: A RoHS COMPLIANT compatible target board land dimensions A< 0.935" B> 1.055" 25.3mm sqr. [0.995"] 23.7mm sqr. [0.935"] B 0.3mm pad [0.012"] 1 0.8mm pad [0.030"] 0.5mm typ. 0.46mm [0.018"] 1.27mm typ. [0.050"] 2 6.4mm ± 0.25mm [0.250" ± 0.010"] 4.7mm [0.187"]
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FR4/G10
PCB50µ
SF-QFE176SA-L-01F
0.3mm qfp
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Untitled
Abstract: No abstract text available
Text: REVISIONS NO. 0.30 ± 0.05 DESCRIPTION DATE 2.0 • See Note 6 1.5 +0.1/-0.0 DIA • See Note 1 1.75 A 4.0 R.5 2 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ± 0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A 1.0 Radius Typical 1.5 MIN - All Dimensions in Millimeters Notes:
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100mm
Q07X07-B
A0417-95-2
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Untitled
Abstract: No abstract text available
Text: Ø1.5+0.1/-0.0. 4.0 ±0.1 • See Note 1 0.30 ±0.05 1.75 ±0.1 2.0 ±0.1 Note 6 A R0.MAX. 11.5 ±0.1 Note 6 13.2 2 Bo 24.0 ±0.3 2.0 (2) K1 A R1.0 REF 13.4 (2) Ø1.5 MIN R0.5 Typical Ko Ao 45 ° TYP SECTION A-A 20.0 ±0.1 Ao = 16.50 mm Bo = 16.50 mm Ko = 1.55 mm
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100mm
Q1414P-C
A0808-97-1
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Untitled
Abstract: No abstract text available
Text: REVISIONS Ø1.5 +0.1/-0.0 NO. 2.0 • See Note 6 DESCRIPTION DATE BY 1 SDC 4.0 • See Note 1 0.30 ± 0.05 A 1.75 R0.5 Typical R0.3 MAX 14.2 • See Note 6 13.2 2 B1 2.0 (2) 28.4 Bo 32.0 ± 0.3 Ko 24.0 A K1 0.75 R 13.4 (2) SECTION A-A Ao A1 0.20 ± 0.05
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100mm
Q1414P-B
14x14
T-6312
A1101-96-5
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Untitled
Abstract: No abstract text available
Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble
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100x10
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Untitled
Abstract: No abstract text available
Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble
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100x10
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pitch 0.4mm BGA
Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology
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100x10
100x10-6/k
pitch 0.4mm BGA
BGA and QFP Package mounting
0.4mm pitch BGA
AI2O3
QFP lead pitch 0.3mm
QFP 0.2mm pitch
QFP 0.3mm pitch
Noble resistor
hybrid ic sc ka
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