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    QFP PACKAGE WEIGHT Search Results

    QFP PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    QFP PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
    Text: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –


    Original     		16-BIT 100P6S-A QFP100-P-1420-0 100pin 1420mm LQFP100-P-1414-0 1414mm 100P6Q-A 128pin 100P6S-A LQFP128-P-1420-0 128P6Q-A PDF

    100P6S-A

    Abstract: QFP100-P-1420-0
    Text: Under development This document is under development and its contents are subject to change. M16C/6N5 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material


    Original     		M16C/6N5 100P6S-A QFP100-P-1420-0 100pin 1420mm 100P6S-A PDF

    100P6S-A

    Abstract: QFP100-P-1420-0
    Text: Under development This document is under development and its contents are subject to change. M16C/6N4 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material


    Original     		M16C/6N4 100P6S-A QFP100-P-1420-0 100pin 1420mm 100P6S-A PDF

    QFP64-P-1414-0

    Abstract: SDIP64-P-750-1
    Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D


    Original     		64P6N-A 64pin 1414mm QFP64-P-1414-0 64P4B LQFP64-P-1414-0 SDIP64-P-750-1 PDF

    QFP64-P-1414-0

    Abstract: SDIP64-P-750-1 3804 f
    Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1


    Original     		64P6N-A 64pin 1414mm QFP64-P-1414-0 64P4B 750mil SDIP64-P-750-1 3804 f PDF

    MO-235 FOOTPRINT

    Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
    Text: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of


    Original     		SC-100 MO-235 MO-235 FOOTPRINT die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc PDF

    SLLA229

    Abstract: No abstract text available
    Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package


    Original     		PCI1510 SLLA229 144-terminal 209-terminal 16-bit TPS2211A SLLA229 PDF

    144-TERMINAL

    Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
    Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package


    Original     		PCI1510 SLLA229 144-terminal 209-terminal 16-bit TPS2211A 82365SL PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU PDF

    MD 202

    Abstract: 100P6S-A LQFP100-P-1414-0 QFP100-P-1420-0 MEB2 JEDEC Code
    Text: Mitsubishi microcomputers M16C / 62 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code – 81 1 b2 100 ME HD D 80 I2 Recommended Mount Pad


    Original     		16-BIT 100P6S-A QFP100-P-1420-0 100pin 1420mm LQFP100-P-1414-0 1414mm 100P6Q-A MD 202 100P6S-A MEB2 JEDEC Code PDF

    315HZ

    Abstract: Teac head Dolby NR LCT-7001 CXA2559Q CXA2560Q CXA2561Q F120 MTT150 A-bex TCC-130
    Text: CXA2559Q Playback Equalizer Amplifier with Music Sensor Description The CXA2559Q is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP


    Original     		CXA2559Q CXA2559Q 40-pin CXA2561Q) CXA2560Q) 40PIN QFP-40P-L01 QFP040-P-0707 315HZ Teac head Dolby NR LCT-7001 CXA2560Q CXA2561Q F120 MTT150 A-bex TCC-130 PDF

    ghk diode

    Abstract: 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK INTEL PB-FREE
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X ghk diode 82365SL PCI1520 PCI1520GHK PCI1520IGHK PCI1520IPDV PCI1520IZHK INTEL PB-FREE PDF

    On ghk diode

    Abstract: ghk diode 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X On ghk diode ghk diode 82365SL PCI1520 PCI1520GHK PCI1520IGHK PCI1520IPDV PCI1520IZHK PDF

    430TX

    Abstract: 82365SL PCI1420 PCI1420GHK PCI1420PDV PCI1420PDVG4
    Text: PCI1420 GHK/PDV www.ti.com SLLA228 – MONTH 2003 PC Card Controllers FEATURES • • • • • • • • • Fully compatible with the Intel 430TX Mobile Triton II chipset A 208-pin Low-Profile QFP (PDV), 209-terminal MicroStar BGA™ package (GHK), or the 209-terminal lead-free (Pb,


    Original     		PCI1420 SLLA228 430TX 208-pin 209-terminal 16-bit TPS2206/2216 430TX 82365SL PCI1420GHK PCI1420PDV PCI1420PDVG4 PDF

    car ignition circuit diagram immobiliser

    Abstract: HC11EA9 MC68HC916P1 68hc912b32 pinout HC11K4 HC11KA2 HC11KA4 HC11KW1 HC11P2 HC11A8
    Text: Cover Customer E.M.U. Rev. 6 Page 1 Table of Contents World-wide Capability 3 Motorola Technical training 4 MCU Quick Reference Tables 5–15 Family Selector Guides 68HC05Bx 68HC05BDx/BSx 68HC05Cx 68HC05Dx 68HC05Ex 68HC05Fx 68HC05Gx/Hx 68HC05Jx 68HC05JP/JJx


    Original     		68HC05Bx 68HC05BDx/BSx 68HC05Cx 68HC05Dx 68HC05Ex 68HC05Fx 68HC05Gx/Hx 68HC05Jx 68HC05JP/JJx 68HC05Kx car ignition circuit diagram immobiliser HC11EA9 MC68HC916P1 68hc912b32 pinout HC11K4 HC11KA2 HC11KA4 HC11KW1 HC11P2 HC11A8 PDF

    MD 202

    Abstract: 100P6S-A LQFP100-P-1414-0 QFP100-P-1420-0
    Text: Under development Preliminary specification Specifications in this manual are tentative and subject to change. M32C/80 Group Package Dimensions Package Dimensions MMP Plastic 100pin 14✕14mm body LQFP Weight g 0.63 JEDEC Code – Lead Material Cu Alloy MD


    Original     		M32C/80 100pin 1414mm LQFP100-P-1414-0 100P6Q-A 100P6S-A QFP100-P-1420-0 1420mm MD 202 100P6S-A PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    100P6S-A

    Abstract: QFP100-P-1420-0
    Text: 30 1 31 100 e HD D y EIAJ Package Code QFP100-P-1420-0.65 50 81 b 80 JEDEC Code – 51 E F Weight g 1.58 A Detail F Lead Material Alloy 42 L1 c L b2 I2 MD ME A A1 A2 b c D E e HD HE L L1 y Mar.’98 Dimension in Millimeters Min Nom Max – – 3.05 0.1 0.2


    Original     		QFP100-P-1420-0 100pin 100P6S-A 100P6S-A PDF

    TQFP100 footprint

    Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) QFP160 OT322-1) TQFP100 footprint TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48 PDF

    LQFP32

    Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave


    Original     		SSOP16 OT369-1) SSOP20 OT266-1) QFP52 OT379-1) QFP100 OT317-1, OT317-2 OT382-1) LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64 PDF

    MSM5238

    Abstract: LCD OKI 19 oki lcd driver QFP44-P-910-0 MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 32-bit shift register
    Text: E2B0027-27-Y2 ¡ Semiconductor MSM5238 ¡ Semiconductor This version: Nov. 1997 MSM5238 Previous version: Mar. 1996 32-DOT LCD COMMON DRIVER GENERAL DESCRIPTION The MSM5238 is a dot matrix LCD common driver LSI which is fabricated using low power CMOS metal gate technology. The scanning signal in one matrix display frame can be divided


    Original     		E2B0027-27-Y2 MSM5238 32-DOT MSM5238 32-bit QFP44-P-910-0 LCD OKI 19 oki lcd driver MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 32-bit shift register PDF

    MSM5839B

    Abstract: DO20 DO40 MSM5238
    Text: E2B0022-27-Y2 ¡ Semiconductor MSM5839B ¡ Semiconductor This version: MSM5839B Nov. 1997 Previous version: Mar. 1996 40-DOT SEGMENT DRIVER GENERAL DESCRIPTION The MSM5839B is a dot matrix LCD segment driver LSI which is fabricated using low power CMOS metal gate technology. This LSI consists of two 20-bit shift registers, two 20-bit latches,


    Original     		E2B0022-27-Y2 MSM5839B 40-DOT MSM5839B 20-bit 40-bit DO20 DO40 MSM5238 PDF

    Untitled

    Abstract: No abstract text available
    Text: E2B0027-27-Y2 O K I Semiconductor MSM5238 This version: Nov. 1997 Previous version: Mar. 1996 32-DOT LCD COMMON DRIVER GENERAL DESCRIPTION The MSM5238 is a dot matrix LCD common driver LSI which is fabricated using low power CMOS metal gate technology. The scanning signal in one m atrix display frame can be divided


    OCR Scan     		E2B0027-27-Y2 MSM5238 32-DOT MSM5238 32-bit PDF

    LQFP64. footprint

    Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) QFP160 OT322-1) LQFP64. footprint dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64 PDF

    3 input or gates TTL

    Abstract: cmos XOR Gates Nand gate Crystal Oscillator 4-input nand gates ttl XOR GATES "resistor set oscillator" dip TTL XOR Gates 5D208 cmos XOR schmitt trigger toggle nand
    Text: HT3A CMOS Low Cost Gate Array General Features • • • • • • • • 5µm LOVAG CMOS technology Operating voltage: 2.0V~4.8V Input/Output CMOS compatible High noise immunity Six array bases cover the range from 212~890 gates Enhanced reliability


    Original     		HTA3000 HT3A000 HT3A100 HT3A200 HT3A300 HT3A400 3 input or gates TTL cmos XOR Gates Nand gate Crystal Oscillator 4-input nand gates ttl XOR GATES "resistor set oscillator" dip TTL XOR Gates 5D208 cmos XOR schmitt trigger toggle nand PDF