FPQ-128-0
Abstract: No abstract text available
Text: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device
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PA1048C-128
socket/28
pLSI1048C
ispLSI1048C
pLSI2096
ispLSI2096
FPQ-128-0
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
-or96-128M80-P
128-PGM15047-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
QQ-B-626.
-or96-128M80-P
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
36or96-128M80-P
128-PGM15047-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
96-128M80
-or96-128M80-P
128-PGM15047-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
36hange
-or96-128M80-P
128-PGM15047-30
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MIL-T-10727
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-128M80
96-128M80
-or96-128M80-P
128-PGM15047-30
MIL-T-10727
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Untitled
Abstract: No abstract text available
Text: Pomona Model 5772 & 5772-2 128 Pin EIAJ QFP Test Clip 0.80 mm Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the fine pitch Plastic QFP chip leads. • Interfaces with high density EIAJ QFP surface mount chip leads.
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Goldberg\FlukeDataSheet\d5772
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GP62
Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data
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FDC37C68x/FDC37C93x
FDC37C68x
FDC37C93x.
FDC37C93x
FDC37C68x.
14CLK
39NTIES,
GP62
GP15
126-150
GP61
GP22
GP65
gp6*5
GP10
SA10
SA12
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GP11
Abstract: No abstract text available
Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data
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FDC37C68x/FDC37C93x
FDC37C68x
FDC37C93x.
FDC37C93x
FDC37C68x.
14CLK
FDC37C68x,
GP11
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QFP 128 pin Socket
Abstract: QFP-128 HS2000EPI61HE qfp128 QFP-128 20 x 14 pad
Text: H8S/2655 Group QFP-128 User System Interface Cable HS2655ECH61H User’s Manual Renesas Microcomputer Development Environment System Rev.4.00 2004.1.29 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products
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H8S/2655
QFP-128
HS2655ECH61H
REJ10B0086-0400H
QFP 128 pin Socket
QFP-128
HS2000EPI61HE
qfp128
QFP-128 20 x 14 pad
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HCU04
Abstract: HS2000EPI61HE HS2633ECH61H QFP-128 NQPACK128RD HS2633EPI61HE
Text: H8S/2633 Group QFP-128 User System Interface Cable HS2633ECH61H User’s Manual Renesas Microcomputer Development Environment System Rev.5.00 2004.1.29 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products
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H8S/2633
QFP-128
HS2633ECH61H
REJ10B0085-0500H
HCU04
HS2000EPI61HE
QFP-128
NQPACK128RD
HS2633EPI61HE
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128-PIN
Abstract: 1410Y
Text: 128 PIN QFP PACKAGE OUTLINE - 3.2 MM FOOTPRINT A Min Nominal Max Remarks - - 3.4 Overall Package Height A1 0.05 - 0.5 Standoff A2 2.55 - 3.05 Body Thickness D 23.00 23.20 23.40 X Span D1 19.90 20.00 20.10 X Body Size E 17.00 17.20 17.40 Y Span E1 13.90 14.00
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lead frame
Abstract: No abstract text available
Text: 128 PIN QFP PACKAGE OUTLINE - 3.9 MM FOOTPRINT A Min Nominal Max Remarks - - 3.4 Overall Package Height A1 0.05 - 0.5 Standoff A2 2.55 - 3.05 Body Thickness D 23.70 - 24.10 X Span D1 19.90 - 20.10 X Body Size E 17.70 - 18.10 Y Span E1 13.90 - 14.10 Y Body Size
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rtl8139b
Abstract: RTL8129 RTL8139BL Realtek RTL8029 AS realtek rtl8129 realtek uwb mA759 RTL8029 realtek rtl8029 realtek rtl8139 programming
Text: RTL8139B L Preliminary REALTEK SINGLE CHIP FAST ETHERNET CONTROLLER WITH POWER MANAGEMENT RTL8139B(L) 1. Features: l 128 pins QFP/LQFP environment only. Both need 5-volt l Integrated Fast Ethernet MAC, Physical chip working voltage as power source. l and transceiver in one chip
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RTL8139B
93C56
25MHz
50MHz
128LD
14x20x1
530-ASS-P004
LQ128
RTL8129
RTL8139BL
Realtek RTL8029 AS
realtek rtl8129
realtek uwb
mA759
RTL8029
realtek rtl8029
realtek rtl8139 programming
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Untitled
Abstract: No abstract text available
Text: 128 PIN QFP/QN PACKAGE OUTLINE 3.9 MM FOOTPRINT D D1 3 e b 2 E1 3-D VIEW E 3 5 D1/4 E1/4 R1 TOP VIEW R2 SEE DETAIL "A" 0.25 GAUGE PLANE A2 0°-7° C A SEATING PLANE c L 4 L1 ccc C SIDE VIEW DETAIL "A" (SCALE: 3/1) A1 Min Nominal Max Remarks A ~ ~ 3.40 Overall Package Height
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bd556
Abstract: 68hc705k1 MC68HC05SC21 68hc705j2 68hc05 test board 68HC705E6 M68HC05P9EM pinout of motorola 68hc05 programmer mc68hc705b16 68HCL05
Text: Single–Chip Microcontrollers CSIC In Brief . . . Page M68HC05 CSIC Family . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–2 M68HC08 Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–13 Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–14
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M68HC05
M68HC08
bd556
68hc705k1
MC68HC05SC21
68hc705j2
68hc05 test board
68HC705E6
M68HC05P9EM
pinout of motorola 68hc05
programmer mc68hc705b16
68HCL05
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SERIRQ
Abstract: cross PD6
Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.
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FDC37C67x/FDC37C93x
FDC37C67x
FDC37C93x.
FDC37C93x
FDC37C67x.
SERIRQ
cross PD6
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BR931
Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
Text: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,
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ax 2008 lqfp 48
Abstract: GAd 1501 UPD70* JTAG RENESAS flash memory package suffix SENSOR IC CHIP 0443 16 PIN suffix number RENESAS microcontroller usb booster PG-FP5 TK-78K0 QB-V850MINI
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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X19852EU1V0PF00
ax 2008 lqfp 48
GAd 1501
UPD70* JTAG
RENESAS flash memory package suffix
SENSOR IC CHIP 0443 16 PIN
suffix number RENESAS microcontroller
usb booster
PG-FP5
TK-78K0
QB-V850MINI
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MEC1609
Abstract: SCH5147 os81092 OS81050 mec1308 OS81110 HYC5000 OS81060 SIO1028 SCH5627
Text: CORPORATE PRODUCT OVERVIEW 2010 Providing Mixed-Signal IC solutions that enable connectivity and networking in consumer electronics, automotive infotainment, PC and industrial applications PC SYSTEM + MOST I/O CONTROLLERS USB ETHERNET Digital Cameras, HDTVs, Set-top Boxes,
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sd3-75
Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and
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FDC37C67x/FDC37C93x
FDC37C67x
FDC37C93x.
FDC37C67x
FDC37C93x
FDC37C67x.
sd3-75
cross PD6
GP20
GP25
SA10
SMSC Corporation cross reference
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LQFP-48 footprint
Abstract: Antilock and Braking Systems using CAN protocol 9S12P64 LQFP-48 9S12P128 9S12P96 S12P DEMO9S12PFAME LFSMPBS12PFM LQFP PACKAGE footprint
Text: 16-bit Microcontrollers S12P Family Pushing the boundaries of 16-bit CAN microcontrollers Overview The S12P family of CAN microcontrollers S12P Family Block Diagram MCUs offers the enhanced features of 16-bit performance but at the value of SCI Up to 6 KB RAM
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16-bit
10-ch.
S12XS
10-channel,
12-bit
S12PFAMFS
LQFP-48 footprint
Antilock and Braking Systems using CAN protocol
9S12P64
LQFP-48
9S12P128
9S12P96
S12P
DEMO9S12PFAME
LFSMPBS12PFM
LQFP PACKAGE footprint
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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