QFP80
Abstract: No abstract text available
Text: QFP80-P-1414-0.65 Unit : mm 16.0±0.3
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QFP80-P-1414-0
825TYP
QFP80
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QFP80-P-1420-0
Abstract: No abstract text available
Text: QFP80—P —1420—0.65D Unii;! nn Jan,2007
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QFP80-P-1420-0
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QFP80
Abstract: QFP80-P-1420-0 575TYP
Text: EX o i +0i 15 U. l-o. i ' 2, 7*1±0, 2 3, 15MAX H QFP80-P-1420-0.65D Unit nn
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QFP80-P-1420-0
575TYP
QFP80
575TYP
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QFP80-P
Abstract: No abstract text available
Text: QFP80-P-1414-0.65-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.85 TYP. 3/Nov. 28, 1996
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QFP80-P-1414-0
QFP80-P
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QFP80-G1
Abstract: QFP80
Text: PACKAGE DIMENSIONS QFP80-G1 0 ~ 10º 16.0±0.4 14.0±0.3 41 40 80 21 14.0±0.3 61 16.0 ±0.4 60 20 0.3±0.1 0.12 1.4±0.1 +0.10 0.15 - 0.05 0.65 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP80-G1
QFP80-G1
QFP80
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QFP80
Abstract: QFP80-P
Text: QFP80-P-1414-0.65-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP80-P-1414-0
QFP80
QFP80-P
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP80 package SOT496-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP80
OT496-1
OT496-1
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PRQP0080JD-A
Abstract: No abstract text available
Text: JEITA Package Code P-QFP80-14x14-0.65 RENESAS Code PRQP0080JD-A Previous Code FP-80Q/FP-80QV MASS[Typ.] 1.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 60 41 61 40 bp c c1 HE Reference Symbol
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P-QFP80-14x14-0
PRQP0080JD-A
FP-80Q/FP-80QV
PRQP0080JD-A
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PRQP0080JC-F
Abstract: P-QFP80-14X14-0 QFP80 PQFP80
Text: JEITA Package Code P-QFP80-14x14-0.65 RENESAS Code PRQP0080JC-F Previous Code FP-80P/FP-80PV MASS[Typ.] 1.2g HD *1 D 60 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 41 61 40 bp c c1 HE *2 E b1 Reference
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P-QFP80-14x14-0
PRQP0080JC-F
FP-80P/FP-80PV
x14-0
PRQP0080JC-F
QFP80
PQFP80
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PDF
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QFP80
Abstract: 14X14
Text: SANYO Semiconductor Quad Flat Package 80Pin Plastic QFP80 14X14 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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80Pin
QFP80
14X14)
ED-7303A)
QFP80
14X14
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80P6S-A
Abstract: PRQP0080JA-A P-QFP80-14X14-0
Text: JEITA Package Code P-QFP80-14x14-0.65 RENESAS Code PRQP0080JA-A Previous Code 80P6S-A MASS[Typ.] 1.1g HD *1 D 60 41 61 40 HE ZE *2 E NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference Symbol
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P-QFP80-14x14-0
PRQP0080JA-A
80P6S-A
80P6S-A
PRQP0080JA-A
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P-QFP80-14X14-0
Abstract: QFP80 PRQP0080JB-A
Text: JEITA Package Code P-QFP80-14x14-0.65 RENESAS Code PRQP0080JB-A Previous Code FP-80A/FP-80AV MASS[Typ.] 1.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 60 41 61 40 bp c c1 HE *2 E b1 Reference
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P-QFP80-14x14-0
PRQP0080JB-A
FP-80A/FP-80AV
QFP80
PRQP0080JB-A
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80p6n
Abstract: QFP80 PRQP0080GB-B
Text: JEITA Package Code P-QFP80-14x20-0.80 RENESAS Code PRQP0080GB-B Previous Code 80P6N-C MASS[Typ.] 1.6g HD *1 D 64 41 65 HE NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. ZE *2 E 40 80 Reference Symbol
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P-QFP80-14x20-0
PRQP0080GB-B
80P6N-C
80p6n
QFP80
PRQP0080GB-B
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80p6n
Abstract: QFP80 ZD MARK 22 PRQP0080GB-A
Text: JEITA Package Code P-QFP80-14x20-0.80 RENESAS Code PRQP0080GB-A Previous Code 80P6N-A MASS[Typ.] 1.6g HD *1 D 64 41 65 HE NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. ZE *2 E 40 Reference Symbol
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P-QFP80-14x20-0
PRQP0080GB-A
80P6N-A
80p6n
QFP80
ZD MARK 22
PRQP0080GB-A
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PQFP80
Abstract: P-QFP80-1414-0
Text: Units m P-QFP80-1414-0.65B 17, 2+0, 2 14, 0+0, 1 60 41 filli CL >in oo OJ O 40 O OJ o +1 o Ö -H OJ l< o mm m F 8QC^ i 21 20 O, 825TYP o, 32-8:! » m n ?v r- o, 8±0JL Mar,2001
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P-QFP80-1414-0
825TYP
Ttna40
PQFP80
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FP 80
Abstract: fp80v PRQP0080GD-A FP-80
Text: JEITA Package Code P-QFP80-14x20-0.80 RENESAS Code PRQP0080GD-A Previous Code FP-80/FP-80V MASS[Typ.] 1.8g HD *1 D 64 41 65 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 40 bp c c1 HE ZE *2 E b1 Terminal cross section
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P-QFP80-14x20-0
PRQP0080GD-A
FP-80/FP-80V
FP 80
fp80v
PRQP0080GD-A
FP-80
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QFP80
Abstract: 60i2 80P6S-A
Text: 80P6S-A Plastic 80pin 14✕14mm body QFP EIAJ Package Code QFP80-P-1414-0.65 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code HD 61 b2 80 ME D 1 60 I2 HE E Recommended Mount Pad Symbol 41 20 21 A 40 c F A2 L1 e A A1 A2 b c D E e HD HE L L1 y A1 b y L
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80P6S-A
80pin
QFP80-P-1414-0
QFP80
60i2
80P6S-A
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QFP40
Abstract: ht 20*20
Text: Overview O rd e rin g C od e_D e s c rip tio n _ IC -B o d y S ize_ IC -D im . total _ P age N o. IC198-044-200x QFP40 0.8 pitch 1 0 x 10 13.2 x 13.2 ht. 2.45 max. 23 IC198-080-100X QFP80 0.8 pitch 14x20 16.8x22 .8
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IC198-044-200x
IC198-080-100X
IC198-080-200x
IC198-080-21
IC198-100-200x
IC198-1001-210x
IC198A-1000-100x
IC198-112-21
IC198-128-200x
IC198-208-210x
QFP40
ht 20*20
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Untitled
Abstract: No abstract text available
Text: QFP80-P-1414-0.65-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.85 TYP. 3 版/96.11.28
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QFP80-P-1414-0
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jedec QFP80
Abstract: QFP80
Text: PDF: 2000 Feb 17 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 14 x 2.67 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A
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QFP80:
OT496-1
jedec QFP80
QFP80
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ZD 103
Abstract: MS-022 QFP80
Text: PDF: 2002 Oct 09 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A
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QFP80:
OT496-1
135E06
MS-022
ED-7311EE
ZD 103
MS-022
QFP80
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PDF
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jedec QFP80
Abstract: sot496 QFP80 0.65
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads; body 14 x 14 x 2.67 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 A 3 A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A D B HD v M B 5 10 mm
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QFP80:
OT496-1
OT496-1
jedec QFP80
sot496
QFP80 0.65
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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QFP80:
OT496-1
135E06
MS-022
ED-7311EE
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PDF
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QFP80
Abstract: QFP-80 14X14 QFP80 0.65
Text: SANYO Semiconductor Quad Flat Package 80Pin Plastic QFP80 14X14 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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80Pin
QFP80
14X14)
ED-7303A
QFP80
QFP-80
14X14
QFP80 0.65
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