HG-2
Abstract: 3060A 7471A AES chips E.04
Text: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04
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Original
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6010B
HG-2
3060A
7471A
AES chips
E.04
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PDF
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DSA0090625.txt
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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599R2GYW-CC
DS-35-07-0235
HD-R/RD013
DSA0090625.txt
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PDF
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k2950
Abstract: IR 16713
Text: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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540R2GY-CC
DS-35-07-0235
HD-R/RD013
k2950
IR 16713
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PDF
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Untitled
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP REV:A / 1 520MY8C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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520MY8C-f2
DS-35-05-0057
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PDF
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Untitled
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP REV:A / 1 520CG6C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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520CG6C-f2
DS-35-08-0354
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PDF
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PA 0016
Abstract: 520LB7C D4463
Text: 5.0 mm DIA LED LAMP REV:A / 1 520LB7C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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520LB7C-F2
-400V
DS-35-07-0016
HD-R/RD013
PA 0016
520LB7C
D4463
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PDF
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d4515
Abstract: LED highlight
Text: 5.0 mm DIA LED LAMP REV:A / 0 520PG2C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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Original
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520PG2C-F2
-400V
DS-35-08-0395
mm8-12-24
d4515
LED highlight
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PDF
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Untitled
Abstract: No abstract text available
Text: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Materials: Features Dimensions : 12mmX12mmX1.2mm Package : Ceramics High power lighting. Encapsulating resin : Silicone resin
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12X12mm
KT-1213WG9SX9/10
12mmX12mmX1
DSAK1042
OCT/07/2011
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PDF
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JESD22-A120
Abstract: No abstract text available
Text: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Materials: z Dimensions : 12mmX12mmX1.2mm Package : Ceramics z High power lighting. Encapsulating resin : Silicone resin
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Original
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12X12mm
KT-1213WG9SX9/10
12mmX12mmX1
DSAK1042
OCT/07/2011
JESD22-A120
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PDF
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SB2336E-G
Abstract: No abstract text available
Text: SB2336E-G Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SB2336E-G
100pF,
KSD-O8V005-003
SB2336E-G
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PDF
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SSB2336
Abstract: No abstract text available
Text: SSB2336E-GD2 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SSB2336E-GD2
100pF,
KSD-O8V022-002
SSB2336
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SW2336E-H
100pF,
KSD-O8V001-004
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PDF
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isopropyl alcohol
Abstract: B589
Text: SY2336-HA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SY2336-HA
KSD-O8V023-002
isopropyl alcohol
B589
|
PDF
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Untitled
Abstract: No abstract text available
Text: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SY2336-GA
KSD-O8V026-003
SY2336-GA
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PDF
|
|
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Untitled
Abstract: No abstract text available
Text: SSB2336E-GD3 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SSB2336E-GD3
100pF,
KSD-O8V025-002
|
PDF
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Untitled
Abstract: No abstract text available
Text: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SA2336-GA
KSD-O8V031-001
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PDF
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Untitled
Abstract: No abstract text available
Text: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SA2336-GA
KSD-O8V031-000
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PDF
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B1588
Abstract: No abstract text available
Text: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SY2336-GA
KSD-O8V026-004
B1588
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin
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Original
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SW2336E-H
100pF,
KSD-O8V001-003
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PDF
|
Untitled
Abstract: No abstract text available
Text: WT-U3A8TW-8538 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag 220x240mm
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Original
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WT-U3A8TW-8538
81-1A
220x240mm
1000pcs
30sec,
01-Feb-2013
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PDF
|
Untitled
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
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Original
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NEX-130CT
8200T
Q3-6646)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WT-U3A8TW-8539 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin Cool White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag
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Original
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WT-U3A8TW-8539
81-1A
220x240mm
1000pcs
30sec,
01-Feb-2013
|
PDF
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Q3-6646
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
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Original
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NEX-130CT
8200T
Q3-6646)
Q3-6646
|
PDF
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Untitled
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
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Original
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NEX-130CT
8200T
Q3-6646)
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PDF
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