Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    RHODORSIL COMPOUND 5 Search Results

    RHODORSIL COMPOUND 5 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    LM5111-2MYX/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-1MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-2MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-4M/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-SOIC Visit Texas Instruments Buy

    RHODORSIL COMPOUND 5 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    RHODORSIL

    Abstract: unial BICC BX13 AN4505 AN4505-5 RHODORSIL COMPOUND 5 oil bicc
    Text: AN4505 Application Note AN4505 Heatsink Issues For IGBT Modules Application Note Replaces March 2001 version, AN4505-5.0 AN4505-5.1 July 2002 The maximum permissible junction temperature Tjmax of an IGBT is fixed and a suitable heatsink must be selected to keep


    Original
    AN4505 AN4505 AN4505-5 RHODORSIL unial BICC BX13 RHODORSIL COMPOUND 5 oil bicc PDF

    BX13

    Abstract: copper bus bar torque RHODORSIL COMPOUND 5 busbar bolt torque value oil bicc RHODORSIL COMPOUND 7
    Text: device clam ping and m odule m ounting D isc D evice C la m p in g R e c o m m e n d a tio n s The Forward Voltage Drop and Thermal Resistance of a disc hockey puck semiconductor is affected by the clamping force that is applied to the device. This is because, unlike stud type


    OCR Scan
    130x140mm 190x140mm AN4505. BX13 copper bus bar torque RHODORSIL COMPOUND 5 busbar bolt torque value oil bicc RHODORSIL COMPOUND 7 PDF

    RHODORSIL COMPOUND 5

    Abstract: AN4839 DCR1674SZ 3M Touch Systems disc thyristor
    Text: AN4839 Application Note TGD-1X AN4839 Clamping Of Power Semiconductors Application Note Replaces September 2000 version, AN4839-3.0 AN4839-3.1 July 2002 0.40 Thermal resistance - ˚C cm2/W 0.35 10.5 10.0 D.C. thermal resistance, Rth(j-hs) - (˚C/W) The Forward Voltage Drop and Thermal Resistance of a disc


    Original
    AN4839 AN4839 AN4839-3 RHODORSIL COMPOUND 5 DCR1674SZ 3M Touch Systems disc thyristor PDF