SOD110 footprint
Abstract: MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods
Text: Philips Semiconductors Mounting and Soldering General MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
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MSA426
SOD110 footprint
MSA430
SOD523 footprint
MSA428
sot23 footprint
SC-76
flux. PHILIPS
AN-450 surface mounting methods
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Untitled
Abstract: No abstract text available
Text: Process Colors Series 880 and 900 Instructions for Use Information Folder 1.8 December 2013 Replaces Information Folder 1.8 dated July 2010 Description 3M Process Colors Series 880I, 880N and 990 have been developed to provide maximum durability, color-fastness and adhesion to reflective sheeting when used in the processing of traffic control signs.
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Abstract: No abstract text available
Text: Application Note Application of TIM Application of thermal interface material onto Vincotech's modules Application Note no.: AN_2013-10_002 Table of Contents 1 A bs tr ac t . 4
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A190
Abstract: E81956 screen emulsion
Text: Application Specification Modular Jack Surface Mount Printed Circuit PC Board Assemblies NOTE i 114- 6040 09 NOV 09 Rev D All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.
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S2082
Abstract: Soldering guidelines pin in paste CR-14 gold embrittlement
Text: S2082 Surface Mounting Instructions CR-9, 11, 12, 13, 14 Ceramic 16 and 24 PIN Packages Board and Solder Footprint Guidelines Application Note Recommended Mounting Solder footprints Cont’d For optimal performance of surface mount switches and attenuators in ceramic packages, grounding is critical. The
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packag80
S2082
Soldering guidelines pin in paste
CR-14
gold embrittlement
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marking code SMD Transistor 2ak
Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written
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C10535EJ9V0IF00
marking code SMD Transistor 2ak
smd code marking NEC g
TRANSISTOR SMD MARKING CODE 3401
transistor 5dx smd
fairy liquid
marking code AE SMD Transistor
UPD65013
1.6/SmD TRANSISTOR av
Ultrasonic humidifier circuit
koki solder paste
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Untitled
Abstract: No abstract text available
Text: Surface-Mount DIPLOMATE* Dual Leaf DL Dual In-Line Package (DIP) Socket .300 in. and .600 in. Centerline NOTE i Application Specification 114-1044 25 JUN 12 Rev C All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches].
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M9627
Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
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C10535EJ8V0IF00
M9627
uPC451g
SMD 6PIN IC MARKING CODE
PR-53365
NIHON SMD MARKING codes
sealed relay ge mil 7451
UPD65013
smd code marking NEC g
GE4F
tanaka AL wire
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GE4F
Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written
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GE4F
UPD65013
74022a
SMD BGA 672 DRAWING
ULF-210R
TRANSISTOR SMD MARKING CODE 352
UPD7514
UPC451G2
smd TRANSISTOR code YW
UPD74HC00
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SAC405
Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’
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heraeus pd944
Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed
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heraeus pd944
heraeus pd945
Amicon d125f
D125F3
PD945
PD944
AMICON
D125F
AmiconD125F
TSSOP footprint
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heraeus
Abstract: Heraeus paste profile sl dielectric thinners W. HUGHES cool compiled 5007 resistivity wire in 5007 screen emulsion
Text: Conductors C 5007 Cadmium-Free & Bondable Au Conductor Paste Description: C 5007 is a wire bondable gold conductor, containing a mixed bonded Au formulation. It is entirely free of Cadmium and may therefore be classified as non-harmful & non-toxic. It offers excellent aged wire bond adhesion and contact
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IPC-7711
Abstract: JEDEC J-STD-033b IPC 7721 J-STD-033b.1 JEDEC J-STD-033b.1 paste profile IPC7711 IPC-7721 thermal pcb guidelines to48c
Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 15 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.
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Abstract: No abstract text available
Text: 3 Void Polyester Label Products FMV02 • FMV12 • FMV22 • FMV32 • FMV0E Technical Data February, 2007 Product Description 3M Void Polyester Label Products are tamper-indicating stocks designed to provide a “void” message in the facestock when removal is attempted. These void polyester
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FMV02
FMV12
FMV22
FMV32
P1410
P1410
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js sot23
Abstract: No abstract text available
Text: Product specification Philips Semiconductors Small-signal Field-effect Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
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bc 339
Abstract: No abstract text available
Text: Philips Semiconductors RF Wideband Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This Is the best high-voiume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
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sot59
Abstract: No abstract text available
Text: Philips Sem iconductors Small-signal Transistors General M O U NTIN G AND SOLDERING Screen printing M ounting m ethods This is the best high-volum e production m ethod of solder paste application. An em ulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
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OT323.
OT223.
sot59
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Untitled
Abstract: No abstract text available
Text: ti/ca /Electronics 7400 Series Surface Mount Technology SMT Dual In-Line Package (DIP) Switch , .100 Centerline A p p lica tio n S p e cification 114-1120 23 MAR 00 Rev B All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
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smd 27E
Abstract: tlc271 smd S7E SMD TRANSISTOR Diamond SA calibration of phototransistor Optek Technology OPC216 OPC600L OPC8320 TLC271
Text: OPTEK TECHNOLOGY INC S7E HYBRIDS A SSE M B LIE S CAPABILITIES D • fc,7^fiSflO 00007=12 b ■ -p a z -S I 0 OPTEK If size is a prime concern in the selection of an optoelectronic assembly look to the Optek hybrid line. The use of a hybrid assembly can save the design engineer from 30 to 8 0 % in
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OPC8320
smd 27E
tlc271 smd
S7E SMD TRANSISTOR
Diamond SA
calibration of phototransistor
Optek Technology
OPC216
OPC600L
TLC271
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Untitled
Abstract: No abstract text available
Text: — — • a ilM A p p lica tio n S p e cificatio n 114-1135 7500 Series Low-Profile SMT Surface Mount Technology DIP (Dual In-Line Package) Switch 06 OCT 99 Rev A A ll numerical values are In metric units [with U. S. customary units in brackets]. Dimensions are in millimeters [and
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kester Re SOLDER PASTE
Abstract: No abstract text available
Text: — — • a ilM A p p lica tio n S p e cificatio n 7300 Series Right-Angle Gull-Wing SMT Surface Mount Technology DIP (Dual In-Line Package) Switch 114-1133 06 OCT 99 Rev A A ll numerical values are In metric units [with U. S. customary units in brackets]. Dimensions are in millimeters [and
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
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Untitled
Abstract: No abstract text available
Text: Philip» Semiconductors Mounting instructions SOT223 TAPE and REEL PACKING SOT223 Tape and reel packing meets the feed requirements of automatic pick and place equipment (packing conforms to IEC publication 286). The tape is an ideal shipping container, making handling easy and providing secure
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OT223
OT223)
OT223
7777K
OT186;
OT263;
T0220AB
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