SG-BGA-6209 Search Results
SG-BGA-6209 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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SG-BGA-6209 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6209 | Ironwood Electronics | GHz BGA Sockets-0.8mm; IC Size X (mm): 15; IC Size Y (mm): 15; IC Array X: 18; IC Array Y: 18; Max Pincount: 324; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 0.132; Max Package Code: BGA324; Backing Plate: NO; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) | Original |