SG-BGA-7089 Search Results
SG-BGA-7089 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
84512-202 |
![]() |
100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array |
![]() |
||
10022671-102LF |
![]() |
528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
![]() |
||
84501-001LF |
![]() |
300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
![]() |
||
55714-102LF |
![]() |
81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
![]() |
||
84520-002LF |
![]() |
400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
![]() |
SG-BGA-7089 Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
---|---|---|---|---|---|---|
SG-BGA-7089 | Ironwood Electronics | High Density GHz BGA Sockets; Max Pincount: 256; Top Pitch (mm): 0.4; IC Array X: 16; IC Array Y: 16; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1; IC Size X (mm): 7; IC Size Y (mm): 7; IC Size Tolerance (mm): 0.15; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.125; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-Epoxy | Original |