Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SHOW THE STRUCTURE OF INTEGRATED CIRCUIT Search Results

    SHOW THE STRUCTURE OF INTEGRATED CIRCUIT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP2701 Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), 5000 Vrms, 4pin SO6L Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type Visit Toshiba Electronic Devices & Storage Corporation

    SHOW THE STRUCTURE OF INTEGRATED CIRCUIT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Integrated Circuit

    Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES hssop show the structure of integrated circuit EPOXY RESIN resin
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE STRUCTURE 3. PACKAGE STRUCTURE The following diagrams show the structure of typical IC packages. STRUCTURE OF METAL SEALED DIP LID Au or Ni PLATING CHIP AI WIRE SEALING MATERIAL (Au/Sn or Pb/Sn) CERAMIC BODY


    Original     		PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		PDF 16-pin MF202 160P6) 152P6T) 135S8) 42Alloy) leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES

    dc to 3 ghz lna application circuits

    Abstract: MGA-645T6 E4440A dc to 3 ghz lna amplifier application circuits FR4 Prepreg for RF 06 layer PCB
    Text: Low Noise High Linearity Amplifier with Integrated Bypass Switch for 2.3 to 2.7 GHz Application Using MGA-645T6 Application Note 5312 Introduction This application note describes the design of application circuits for the LNA from 2.3 to 2.4 GHz for WiMax,


    Original     		PDF MGA-645T6 11b/g) MGA-645T6 -30dBm -20dBm AV01-0678EN AV02-0476EN dc to 3 ghz lna application circuits E4440A dc to 3 ghz lna amplifier application circuits FR4 Prepreg for RF 06 layer PCB

    network resistor integrated

    Abstract: thyristor driving circuit Design Seminar Signal Transmission
    Text: Protective Circuits Section 6_3 DATA TRANSMISSION Protective Circuits ESD and Latch up 3-1 Protective Circuits NOTICE This presentation is a single chapter from the 1996 Mixed Signal Products Seminar. This presentation includes notes which can be read in the notes page view.


    Original     		PDF EH9549/08/002/00/E SN74xx network resistor integrated thyristor driving circuit Design Seminar Signal Transmission

    JESD22A121

    Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
    Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were


    Original     		PDF SZZA051B JESD22A121 IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031

    szza026

    Abstract: Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75
    Text: Application Report SZZA026 – July 2001 Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT Texas Instruments has introduced a refined version of its nickel/palladium NiPd finish for


    Original     		PDF SZZA026 40-billion szza026 Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75

    1000H

    Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3. INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3.1 PACKAGE CRACKING Introduction With electronic equipment becoming more compact, light-weight and sophisticated, the high-intensity mounting of semiconductor devices,


    Original     		PDF 28-pin 1000H MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow

    Rogers 4350

    Abstract: Rogers 4350 datasheet GETEK FR4 Rogers microstrip 3003 rogers laminate materials rogers MTC1204 3003 Multilink Technology Corporation ROSENBERGER
    Text: MIXED SIGNAL INTEGRATED CIRCUIT PRODUCTS Multilink Tech Note - 102 Printed Circuit Board Design Considerations for the MTC1207/MTC1204 The MTC1207 Multiplexer/Clock Multiplier Unit and MTC1204 Demultiplexer/Clock and data Recovery chip are SONET/SDH OC-192/STM-64 mixed signal integrated circuits which contain 10


    Original     		PDF MTC1207/MTC1204 MTC1207 MTC1204 OC-192/STM-64 appnote102 Rogers 4350 Rogers 4350 datasheet GETEK FR4 Rogers microstrip 3003 rogers laminate materials rogers 3003 Multilink Technology Corporation ROSENBERGER

    NI-9205

    Abstract: MBD102 ni9205 ni 9205 Instrumentation Amplifier IC MAX4208 MBD103 circuit diagram of instrumentation amplifier with MBK-408
    Text: Maxim > App Notes > Amplifier and Comparator Circuits Keywords: Rejustor, instrumentation amplifier, differential signal, adc, a to d Dec 19, 2008 APPLICATION NOTE 4321 Precision Instrumentation Amplifiers with Rejustors Solve High-Gain Applications By: Maurizio Gavardoni


    Original     		PDF MAX4208 com/an4321 MAX4208: AN4321, APP4321, Appnote4321, NI-9205 MBD102 ni9205 ni 9205 Instrumentation Amplifier IC MBD103 circuit diagram of instrumentation amplifier with MBK-408

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		PDF AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer

    SZZA031

    Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
    Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)


    Original     		PDF SZZA031 Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste

    Untitled

    Abstract: No abstract text available
    Text: Content BOWEI INTEGRATED CIRCUITS CO.,LTD. l LC Filter Outline Drawings -l Miniature LC Bandpass Filter -l Miniature LC Lowpass Filter -l


    Original     		PDF MFSS-30-90 DIP24 MFSS-90-200-4 MFSS-200-400 MFSS-225-512-4 MFSS-400-700-4

    B150A

    Abstract: B250D B500D spice model PNP UHF B1000A B250A pnp 8 transistor array ttl B500A
    Text: Analog ASICs Introduction TEMIC has been developing customer specific integrated circuits for more than 20 years. In the field of analog ASICs, numerous ASIC developments covering communication, data processing, measurement, household, consumer, industrial, military and space, and automotive have created an extensive know-how. These


    Original     		PDF 22-Feb-95 B150A B250D B500D spice model PNP UHF B1000A B250A pnp 8 transistor array ttl B500A

    MPC8315E

    Abstract: pic pid ccs example PIC in ccs mcs 96 pid
    Text: Freescale Semiconductor Addendum Document Number: MPC8315ERMAD Rev. 2.1, 09/2010 Errata to MPC8315E PowerQUICC II Pro Integrated Host Processor Family Reference Manual, Rev. 2 This errata describes corrections to the MPC8315E PowerQUICC II Pro Integrated Host Processor


    Original     		PDF MPC8315ERMAD MPC8315E MPC8315E pic pid ccs example PIC in ccs mcs 96 pid

    VIPER12A-E

    Abstract: VIPer12A SAMWHA wd sfh517 VIPer12A applications BGY20G Nippon Chemi-Con VZ capacitor viper12 design AN1484 power transformer tank calculation
    Text: AN1484 Application note A 3.6 W travel adaptor using VIPer12A-E Introduction The VIPer12A-E is an integrated PWM and MOSFET circuit for low power applications in the 5 W range, typically in cellular phone adapters. It is housed in surface mount SO-8 and DIP8


    Original     		PDF AN1484 VIPer12A-E VIPer12A-E VIPer12A SAMWHA wd sfh517 VIPer12A applications BGY20G Nippon Chemi-Con VZ capacitor viper12 design AN1484 power transformer tank calculation

    Decoupling And Layout Of Digital Printed Circuits

    Abstract: capacitor 1uf MH89101 MT8910 MUR105 TPW4671
    Text: MSAS-68  Guidelines on a Printed Circuit Board Layout for the MT8910 ISSUE 1 1.0 Introduction The MT8910 Digital Subscriber Line Interface Circuit DSLIC is one of the most complex integrated circuits ever developed for telecommunication applications. The performance of this complex


    Original     		PDF MSAS-68 MT8910 MT8910 MH89101 TPW4671 MUR105 Decoupling And Layout Of Digital Printed Circuits capacitor 1uf MH89101 MUR105 TPW4671

    "Analog

    Abstract: TPW4671 MH89101 MT8910 MUR105 Decoupling And Layout Of Digital Printed Circuits
    Text: MSAS-68  Guidelines on a Printed Circuit Board Layout for the MT8910 ISSUE 1 1.0 Introduction The MT8910 Digital Subscriber Line Interface Circuit DSLIC is one of the most complex integrated circuits ever developed for telecommunication applications. The performance of this complex


    Original     		PDF MSAS-68 MT8910 MT8910 MH89101 TPW4671 MUR105 "Analog TPW4671 MH89101 MUR105 Decoupling And Layout Of Digital Printed Circuits

    transistor RCA 467

    Abstract: ota ca 3080 RCA 3080 rca CA3080 RCA 467 rca cmos book rca cmos handbook IEEE J. Solid State Circuits, SC "rca application note" rca 1967
    Text: R. L. Geiger and E. Sánchez-Sinencio, "Active Filter Design Using Operational Transconductance Amplifiers: A Tutorial," IEEE Circuits and Devices Magazine, Vol. 1, pp.20-32, March 1985. Active Filter Design Using Operational Transconductance Amplifiers: A Tutorial


    Original     		PDF

    100n capacitor tantalum

    Abstract: 120NQ045 CL10 SG1524B TAJA106K016R TPSD107K010R0050 TPSD336K025R0200 TPSV108K004R0035 electronic design
    Text: TANTALUM AND NIOBIUM OXIDE CAPACITORS EQUIVALENT CIRCUIT MODEL APPLICABILITY TO SIMULATION SOFTWARE J. Pelcak AVX Czech Republic s.r.o., Dvorakova 328, 563 01 Lanskroun, Czech Republic Phone: +420 465 358 127 Fax: +420 465 358 128, email [email protected] ABSTRACT


    Original     		PDF NOJC686K006R 120NQ045 TAJA106K016R GOJD337K004R 100n capacitor tantalum 120NQ045 CL10 SG1524B TAJA106K016R TPSD107K010R0050 TPSD336K025R0200 TPSV108K004R0035 electronic design

    block diagram of atmega 328

    Abstract: No abstract text available
    Text: Rainbowduino LED controller manual and datasheet v0.8b Rev. Descriptions Release date V0.8Beta First public version 2009/06/11 V0.8alpha Initial design 2008/11/06 To be added: 1. Hardware Installtion Step By Step 2. Controlling other LED devices Rainbowduino Manual


    Original     		PDF 12Right) block diagram of atmega 328

    2 pole Low Voltage Isolator Switch

    Abstract: Linear Technology - Photovoltaic Energy PN channel MOSFET 10A relay 6v 100 ohm thyristor silicon WAFER chips photo thyristor application photovoltaic coupler series connection of mosfet 20DQ AN-104
    Text: AN-104 The Photovoltaic Relay: A New Solid State Control Device by Bill Collins Summary Recent developments in semiconduc­ tor technology have led to the design of a new type of solid state relay which combines photovoltaic isolation with MOSFET power integrated circuit


    OCR Scan     		PDF AN-104 2 pole Low Voltage Isolator Switch Linear Technology - Photovoltaic Energy PN channel MOSFET 10A relay 6v 100 ohm thyristor silicon WAFER chips photo thyristor application photovoltaic coupler series connection of mosfet 20DQ AN-104

    AN-138

    Abstract: OP-42 ISSPICE OP-42s OP42S pmi op42
    Text: ANALOG DEVICES AN-138 APPLICATION NOTE □ ONE TECHNOLOGY WAY • P.O. BOX 9106 • NORWOOD, MASSACHUSETTS 02062-9106 • 617/329-4700 SPICE-Compatible Op Amp Macro-Models by Mark Alexander and Derek F. Bowers There is a definite trend tow ards a com prehensive circuitsim ulation approach. W e believe tha t 75 percent of all installed


    OCR Scan     		PDF AN-138 OP-42 ISSPICE OP-42s OP42S pmi op42

    r5609

    Abstract: TSG85xx RETICON R5611 RETICON R5609 r5612 RETICON RF anti aliasing filter analog TSG8510 TSG8514
    Text: TSG85XX: Standard filters T S G F 0 8 / C ustom er ident.: Sem i C ustom Filters SWITCHED CAPACITOR MASK PROGRAMMABLE FILTER The TSG85XX circuits are HCMOS universal filters containing a mask programmable switched-capacitor cascadable structure and two uncom­


    OCR Scan     		PDF TSG85XX: TSGF08/Customer TSG85XX TSG85XX CB-79 CB-98 r5609 RETICON R5611 RETICON R5609 r5612 RETICON RF anti aliasing filter analog TSG8510 TSG8514

    1011n

    Abstract: ci op 241 AN-138 OP-42 pmi op42
    Text: I AN-138 APPLICATION NOTE ANALOG ► DEVICES ONE TECHNOLOGY WAY • P.O. BOX 9106 • NORWOOD, MASSACHUSETTS 02062-9106 • 617/329-4700 SPICE-Compatible Op Amp Macro-Models by Mark Alexander and Derek F. Bowers There is a definite trend towards a comprehensive circuitsimulation approach. We believe that 75 percent of all installed


    OCR Scan     		PDF AN-138 1011n ci op 241 AN-138 OP-42 pmi op42