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    SLCC SERIES Search Results

    SLCC SERIES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical Visit Murata Manufacturing Co Ltd
    9004FM/B Rochester Electronics LLC 9004 - NAND Gate, 9004 Series Visit Rochester Electronics LLC Buy
    100183FC Rochester Electronics LLC Multiplier, 100K Series, 8-Bit, ECL, CQFP24, CERPAK-24 Visit Rochester Electronics LLC Buy
    74AC521SC REEL Rochester Electronics LLC 74AC521 - Identity Comparator, AC Series, 8-Bit, Inverted Output, CMOS Visit Rochester Electronics LLC Buy
    MM74HC4538M-G Rochester Electronics LLC 74HC4538 - Monostable Multivibrator, HC/UH Series, 2-Func, CMOS Visit Rochester Electronics LLC Buy

    SLCC SERIES Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SLCC Series Vishay Telefunken Thin Film Leadless Chip Resistor Networks Original PDF

    SLCC SERIES Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    N681622

    Abstract: W681388 TRANSISTOR Bf 310n N681387DG N681387 GKDF QFN-48 thermal resistance N681386 w684386 n681622yg
    Text: N681386/87 Single Programmable Extended Codec/SLCC 1. DESCRIPTION The N681386/87, implements a single channel FXS telephone line interface optimized for short loop applications. It integrates SLCC Subscriber Line Control Circuit functionality with a programmable CODEC and a DC/DC controller.


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    N681386/87 N681386/87, 16-bit N681622 W681388 TRANSISTOR Bf 310n N681387DG N681387 GKDF QFN-48 thermal resistance N681386 w684386 n681622yg PDF

    Untitled

    Abstract: No abstract text available
    Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 h at 70 °C under Pn • Low noise < 35 dB • Hermetic package RoHS COMPLIANT TYPICAL PERFORMANCE ABS TRACKING Actual Size


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    MIL-PRF-83401 08-Apr-05 PDF

    FAH 32

    Abstract: No abstract text available
    Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of


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    DP5Z1MW32PV3 DP5Z1MW32PV3 MX29F1610AHC) MX29F1610HC) 30A180-11 FAH 32 PDF

    DP5Z2MW16PA3

    Abstract: DP5Z2MW16PH3 DP5Z2MW16PI3 DP5Z2MW16PJ3 DP5Z2MW16PY3
    Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-22 A 32 Megabit FLASH EEPROM DP5Z2MW16Pn3 PRELIMINARY DESCRIPTION: SLCC Stack The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip


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    2Mx16, 200ns, 30A161-22 DP5Z2MW16Pn3 50-pin 64-Megabits DP5Z2MW16Pn3 DP5Z2MW16PA3 DP5Z2MW16PH3 DP5Z2MW16PI3 DP5Z2MW16PJ3 DP5Z2MW16PY3 PDF

    DP5Z2MW32PV3

    Abstract: Dense-Pac Microsystems
    Text: 64 Megabit FLASH EEPROM DP5Z2MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z2MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It


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    DP5Z2MW32PV3 DP5Z2MW32PV3 5555H 30A180-12 Dense-Pac Microsystems PDF

    Dense-Pac DP5Z1M

    Abstract: 30A18
    Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It


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    DP5Z1MW32PV3 DP5Z1MW32PV3 5555H 30A180-11 Dense-Pac DP5Z1M 30A18 PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.


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    MIL-R-83-401 PDF

    08AP

    Abstract: No abstract text available
    Text: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.


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    MIL-R-83-401 08-Apr-05 08AP PDF

    resistor 100k ohm

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401


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    MIL-PRF-83401 11lute 27-Apr-01 resistor 100k ohm PDF

    Untitled

    Abstract: No abstract text available
    Text: SLCC CNP www.vishay.com Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Thin Film Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package


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    2002/95/EC MIL-PRF-83401 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: SLCC CNP www.vishay.com Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Thin Film Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < - 35 dB • SMD • Hermetic package


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    MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401


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    MIL-PRF-83401 08-Apr-05 PDF

    R0005

    Abstract: SLCC20
    Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 hours at 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401


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    MIL-PRF-83401 08-Apr-05 R0005 SLCC20 PDF

    DP5Z2MK16PA3

    Abstract: DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY
    Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2MK16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MK16n3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing


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    2Mx16, 200ns, 30A161-02 DP5Z2MK16Pn3 DP5Z2MK16n3 50-pin 32-Megabits DP5Z2MK16PY DP5Z2MK16Pn3 30A161-32 DP5Z2MK16PA3 DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY PDF

    SMD A06

    Abstract: R0005 20A06 A03 SMD
    Text: SLCC CNP Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package Actual Size Capable of meeting the characteristics of MIL-PRF-83401


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    MIL-PRF-83401 2002/95/EC 18-Jul-08 SMD A06 R0005 20A06 A03 SMD PDF

    DP5Z2ME16PA3

    Abstract: DP5Z2ME16PH3 DP5Z2ME16PI3 DP5Z2ME16PJ3 DP5Z2ME16PY
    Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2ME16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2ME16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing


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    2Mx16, 200ns, 30A161-02 DP5Z2ME16Pn3 50-pin 32-Megabits DP5Z2ME16PY DP5Z2ME16Pn3 30A161-42 DP5Z2ME16PA3 DP5Z2ME16PH3 DP5Z2ME16PI3 DP5Z2ME16PJ3 DP5Z2ME16PY PDF

    resistor* 100k ohm

    Abstract: 20A06 a06 transistor resistor 100k ohm
    Text: P R E C I S I O N T H I N F I L M T E C H N O L O G Y SURFACE MOUNT NETWORKS Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks SLCC Series FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size


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    MIL-PRF-83401 resistor* 100k ohm 20A06 a06 transistor resistor 100k ohm PDF

    20A06

    Abstract: R0005
    Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm 0.05 % at 1000 h at + 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401


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    MIL-PRF-83401 18-Jul-08 20A06 R0005 PDF

    Untitled

    Abstract: No abstract text available
    Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE Actual Size ● ABS TCR Capable to meet characteristics of the MIL-PRF-83401 these networks are


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    MIL-PRF-83401 03-Apr-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 64 Megabit FLASH EEPROM DP5Z4MX16Pn3 PRELIMINARY DESCRIPTION: The DP5Z4MX16Pn3 "SLC C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing


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    DP5Z4MX16Pn3 50-pin 64-Megabits DP5Z4MX16Pn3 120ns 150ns 200ns 30A161 PDF

    11A16

    Abstract: No abstract text available
    Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DENSIE-PAC MI GR ÖS VST BMS PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It


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    DP5Z1MW32PV3 DP5Z1MW32PV3 120ns 200ns 11A16 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 64 Megabit FLASH EEPROM DP5Z2MW32PV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 32PV3 VERSA -STA CK module is a revolutionary new memory subsystem using Dense-Pac Microsystems ceram ic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It


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    DP5Z2MW32PV3 32PV3 120ns 200ns 30A180-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 32 Megabit FLASH EEPROM DP5Z2MW 16Pn3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 16Pn3 " S L C C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing


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    16Pn3 50-pin 64-Megabits 16Pn3 120ns 150ns 200ns 30A161-22 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MI C R O S Y S T E MS 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It


    OCR Scan
    DP5Z1MW32PV3 DP5Z1MW32PV3 32PV3 120ns 150ns 200ns 30A180-11 PDF