J-STD-005
Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging
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TB389
J-STD-005
nozzle heater
paste profile
qfn 10mm land pattern
J-STD-001C
solder joint
IPC-SM-782
MO-220
MARK RAY QFN
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PDF
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qfn Substrate design guidelines
Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid
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TB389
qfn Substrate design guidelines
j-std-001d
IPC-SM-782
MO-220
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PDF
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TB488
Abstract: No abstract text available
Text: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.
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TB488
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TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
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TB389
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J-STD-005
Abstract: IPC-SM-782 MO-220
Text: August 2001 Application Note 7525 PCB Land Pattern Design and Surface Mount Guidelines for MicroFET Packages Scott Pearson Fairchild Semiconductor , Jim Benson (Intersil Corporation) Introduction Fairchild’s MicroFET™ package is a relatively new packaging concept that is currently experiencing rapid acceptance. It offers a variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint,
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J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
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PDF
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J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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H60AH63A
Abstract: 40KHZ ULTRASONIC CLEANER CIRCUIT LQG21C220NOO-470NOO S66C LQS33N LQP21A
Text: Notice of Chip Coil 1. Standard Land Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Land Series I I Solder Resist in mm; Standard Land Dimensions Flow and Reflow
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OCR Scan
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LQG21N
LQG21C
LQP10A
LQP11A
LQP21A
LQG11A
LQG21N/21C
H60AH63A
40KHZ ULTRASONIC CLEANER CIRCUIT
LQG21C220NOO-470NOO
S66C
LQS33N
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PDF
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Untitled
Abstract: No abstract text available
Text: Technical Brief 498 PCB Land Pattern Design and Surface Mount Guidelines for HDA POL Modules Introduction Intersil's HDA POL Module Product family offers a relatively new packaging concept that is currently experiencing rapid growth. The Module Product family features the HDA High
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ele00x
TB498
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PDF
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DFY21R74C1R84BHF
Abstract: DFY2R836CR881 DFY2R902CR947BHGF DFY21R74C1R84BHE DFY2R836CR881BHHN DFY2R902CR947BHG DFY2R902 DFY21R88C1R96BHG DFY2R836CR OFY2R836CR881BH
Text: CER AM IC MICROWAVE FILTERS STANDARD LAND PATTERNS-DUPLEXERS m il f in f a A u w a to r tfi F ie c ffc n i, DFY Serie: KB TYPE/E-AMPS DFYKR836CR881HHA * 3.3 -* k T 5r t 3.7 1.9 i Note: Im p e d a n ce o f b o th in p u t a nd o u tp u t lin e s s h o u ld be 5 0 o h m s in c lu d in g land p a tte rn . The s ta n d a rd c o n d itio n is a p p ly in g g la s s e p o x y b o a rd d ie le c tric c o n s ta n t = 4 .8 , c o p p e r
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DFYKR836CR881HHA
DFY2R836CR881
OFY2R836CR881Bte
OFY2R836CR881BH
DFY2R836CR881BHHN
DFY2R902CR947BHG
DFY2R902CR947BHGF
DFY21R88C1R96BHG
DFY21R88C1R96BHGF
DFY21R74C1R84BHF
DFY21R74C1R84BHE
DFY2R836CR881BHHN
DFY2R902
DFY2R836CR
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ERE22
Abstract: GRM55 ERA21 GRM21 TV19
Text: Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.
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GRP15,
GRM18/21
GJ615
LLL18/21
GQM18/21
ERA11/21,
GRM31
LLL31
GNM31
ERE22
GRM55
ERA21
GRM21
TV19
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GR530
Abstract: GRH708 grm42-6 gr500
Text: NOTICE Soldering and Mounting 1. PCB Design 1 Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal
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TV130D
GR530
GRH708
grm42-6
gr500
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PDF
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Untitled
Abstract: No abstract text available
Text: RE V 1 S LTR 1O N S DESCRIPTION F R E V I S E & R EDRAW P E R C U R R E N T S T D S ; ADD LAND PATTERN G ADD NOTE . 0 0 4 0 . 1 ] C O P L A N A R IT Y ; 1: 200 W AS 150 , 5 . 0 8 WAS 3.81 E.C.N. DATE 11206 11/30/95 119 25 02/23/1998 BY/APR'D TL/ O M M S/
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OCR Scan
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O-236,
OT-23,
MKT-M03B
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PDF
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200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
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IPC-SM-782)
200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
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qfn 32 land pattern
Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and
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IPC-SM-782.
OD-323
qfn 32 land pattern
hermetic packages PCB land
IPC 1725
SOD-323 land pattern
SOIC 8 pcb pattern
land pattern for SSOP
land pattern for TSSOP 24 pin
16 soic pcb footprint
QFN-20 reflow
IPC-SM-782
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PDF
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PA-SO44-S-V-04
Abstract: No abstract text available
Text: SO SMT land pattern SO44A compatible 7.98mm 0.314" 44 23 12.95mm [0.510"] 17.02mm [0.670"] 30.02mm [1.182"] 1 22 1 3.58mm [0.141"] 2 Side View 2.54mm typ. [0.100"] End View 0.46mm dia. typ. [0.018"] 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
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SO44A
FR4/G10
PA-SO44-S-V-04
PA-SO44-S-V-04
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SOD-323 land pattern
Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and
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IPC-SM-782.
SoD-323
SOD-323 land pattern
SOIC 8 pcb pattern
land pattern for SSOP
tssop 16 exposed pad stencil
land pattern for TSsOP 16
LPCC-16
16 soic pcb footprint
land pattern for TSSOP
qfn 32 land pattern
qfn 28 land pattern
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max232 free
Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Text: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is
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RS-232
MAX220
MAX249
EIA/TIA-232E
MAX225,
MAX233,
MAX235,
MAX245/MAX246/MAX247
MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E:
max232 free
AUO-M201.1F pdf
MAX222CPN
90-0108
MAX232EJE
8 PIN Plastic DIP land pattern
max233acw
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IPC-7525
Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Text: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in
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AN-5067
IPC-7525
jedec package MO-220
MO-229 footprint
MO-229
MO-226
MLP06J
JEDEC Drawing MO-220 7mm
IPC-9701
MLP32A
Thin Quad flat package mo-220
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PDF
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SF-SO42B-L-01
Abstract: No abstract text available
Text: 0.850" Compatible target board land pattern not to scale A < 0.430" B > 0.530" 0.050" typ. A Top View B 0.018" ±0.001" dia typ 2 0.187" 1 0.062" 0.470" 1.0 mm pitch End View Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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FR4/G10
SF-SO42B-L-01
SF-SO42B-L-01Dwg
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PDF
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Untitled
Abstract: No abstract text available
Text: 0.10 ±0.012 2.54 ±0.3 0.075 ±0.004 1.9 ±0.1 0.24 ±0.008 6 ±0.2 0.04 1 A B C D E F 0.099 2.5 0.099 (2.5) 0.21 (5.25) 0.099 (2.5) 0.04 (1) 0.06 (1.5) 0.08 ±0.01 2 ±0.3 Recommended Land Pattern C D E F B E A NOTE: The body/can of the componentis notto be soldered.To do so may
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AB26TRB
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PDF
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SF-SO32A-J-02
Abstract: No abstract text available
Text: 20.32mm [0.800"] 11.20mm [0.441"] 6.35mm [0.250"] Top View 0.46mm dia. typ. [0.018"] 2 9.49mm [0.374"] 5.25mm [0.207"] 1 0.43mm typ. [0.017"] 3 9.93mm [0.391"] 1.27mm typ. [0.050"] End View Side View Compatible target board land pattern not to scale A B
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FR4/G10
SF-SO32A-J-02
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PDF
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Untitled
Abstract: No abstract text available
Text: m VDEM TB s Y N B L A A1 A2 D D1 E E1 N • b b 1 ree JEDEC VARIATION AA-2 UN NOM MAX 2J5 25 2.00 2.10 U 95 U S BSC 10.03 BSC 13.90 BSC 10.00 BSC 44 ¿ 0 BSC JO .45 JO ,J5 ,40 20 KN REV DESCRIPTION G24-15 OD N IT W L R ELEASE □ATE APPROVED 10/ 2V W LAND PATTERN DIMENSIONS
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OCR Scan
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G24-15
DEDB49
4J3-BS74
Sn0-358-M70
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PDF
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SF-SO44C-L-01
Abstract: No abstract text available
Text: 10.90mm [0.429"] 1.27mm typ. [0.050"] 18.54mm [0.730"] Top View 0.46mm dia. typ. [0.018"] 4.76mm [0.188"] 6.35mm [0.250"] 2 1 0.80mm typ. [0.031"] Side View End View Compatible target board land pattern not to scale A < 8.64mm[0.340"] B > 11.18mm[0.440"]
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FR4/G10
SF-SO44C-L-01
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PDF
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