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    SOIC 8 PCB PATTERN Search Results

    SOIC 8 PCB PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BQ2052SN-A515 Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 Visit Texas Instruments Buy
    RPI96B3TJ12P1LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    8609153004LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    10090929-H156VLF Amphenol Communications Solutions HIGH DENSITY PCB CONNECTORS Visit Amphenol Communications Solutions
    86092326314755V1LF Amphenol Communications Solutions DIN PCB STRAIGHT RECEPTACLE Visit Amphenol Communications Solutions

    SOIC 8 PCB PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


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    IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern PDF

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


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    IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10 PDF

    SOIC 8 pcb pattern

    Abstract: No abstract text available
    Text: MECHANICAL DIMENSIONS 6 Pin DIP Through Hole Standard 8.382 ± .635 ¿.330 ±.0 2 5), PC Board Pattern (Top View) 2.540± .127 (.100 ±.005) 7.620 ± .254 (.300 ±.010) 2.540 ±.127 6-.800 DIA. (.100 ±.005) (6-.031 D IA .) \ — ' è- A A _ A T 7.239 TYP


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    CYG21XX YG21XX CYG22XX SOIC 8 pcb pattern PDF

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


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    IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782 PDF

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


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    IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern PDF

    LPCC-16

    Abstract: recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern
    Text: GaAs RFICs and Modules Footprints Surface Mount Land Patterns Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface mount design and land pattern standard: IPC-SM-782.


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    IPC-SM-782. QFN-32 LPCC-16 recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern PDF

    Untitled

    Abstract: No abstract text available
    Text: RoHS COMPLIANT 10.16mm [0.400"] Compatible target board land pattern 10.16mm [0.400"] 7.62mm [0.300"] A B Top View 2.54mm [0.100"] A>9.27mm [0.365"] B<4.57mm [0.180"] 2 1 8.15mm [0.321"] 13.83mm ±0.38mm [0.545" ±0.015"] assembled 10.00mm[0.394"] assembled


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    PC-DIP/SOIC8-04F SOIC8-04F PDF

    QFN-64 footprint

    Abstract: No abstract text available
    Text: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


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    DS51194Q o-3-572-9526 DS51194Q-page QFN-64 footprint PDF

    DS51140

    Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
    Text: Transition Socket Specification  2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


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    DS51194R DS51194R-page DS51140 PIC32 PICC-18 XLT28QFN4 DS51298 PDF

    DS51140

    Abstract: DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1
    Text: Transition Socket Specification  2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


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    DS51194S DS51194S-page DS51140 DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1 PDF

    STi7110

    Abstract: le88221 bl3458 PI7C9X440SL PI3EQX5701 PI7C9X111SL PI7C9X111 HDMI TO VGA MONITOR PINOUT PAS5201 PI3EQX6701
    Text: Signal Integrity Signal Integrity Solutions from Pericom Poor signal quality can significantly impact system performance and reliability. Maintaining eye-pattern signal integrity at the receiver end-points in high-speed, serial-differential protocols, like PCI Express,


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    UJWIFI026 CSR9000 UF6026 BC7820) FNSTB1027 FNSURV027 FNSURV054 FDSAS2062 FDSAS6062 STi7109, STi7110 le88221 bl3458 PI7C9X440SL PI3EQX5701 PI7C9X111SL PI7C9X111 HDMI TO VGA MONITOR PINOUT PAS5201 PI3EQX6701 PDF

    qfn 44 PACKAGE footprint

    Abstract: PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead
    Text: TRANSITION SOCKET SPECIFICATION 2006 Microchip Technology Inc. DS51194P Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


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    DS51194P so36-4803 DS51194P-page qfn 44 PACKAGE footprint PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead PDF

    DEI1070A-DMS

    Abstract: DEI107XA Line Drivers ARINC 429 Line Drivers DEI1070 DEI1072A-SES-G DEI1073 DS-MW-01070-02 DEI1070ASESG DEI1071a
    Text: Device Engineering Incorporated 385 East Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] DEI1070A-DEI1075A ARINC 429 LINE DRIVER FAMILY FEATURES TTL/CMOS to ARINC 429 Line Driver HI/LO Speed Control Pin for Hi (100KBS) or Lo (12.5KBS) speed slew rates


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    DEI1070A-DEI1075A 100KBS) DEI1070A DEI1070 HI8585 HI8586 DEI107xA DS-MW-01070-02 DEI1070A-DMS Line Drivers ARINC 429 Line Drivers DEI1072A-SES-G DEI1073 DEI1070ASESG DEI1071a PDF

    DE1071A

    Abstract: No abstract text available
    Text: Device Engineering Incorporated 385 East Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] DEI1070A-DEI1075A ARINC 429 LINE DRIVER FAMILY FEATURES • • • • • • • • • TTL/CMOS to ARINC 429 Line Driver


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    DEI1070A-DEI1075A 100KBS) DEI1070A DEI1070 HI8585 HI8586 DEI107xA DS-MW-01070-02 DE1071A PDF

    3M TEST SOCKETS

    Abstract: SOIC 8 pcb pattern 208-7391-55-1902 218-7223-55-1902 216-7383-55-1902 1902 transistor transistor 22X 214-7390-55-1902 data sheet 7474 228-7396-55-1902
    Text: Test & Burn-In SOIC Sockets • Lid can be actuated from top or front and is compatible with automated load/unload equipment • Compact envelope and side to side stackability maximize board density • Tweezer slot for easy manual loading/unloading • Lid applies 80 grams normal force per lead for


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    TS-0338-09 3M TEST SOCKETS SOIC 8 pcb pattern 208-7391-55-1902 218-7223-55-1902 216-7383-55-1902 1902 transistor transistor 22X 214-7390-55-1902 data sheet 7474 228-7396-55-1902 PDF

    3M TEST SOCKETS

    Abstract: 7383 data sheet 7474 7474B TS-0338-08
    Text: Test & Burn-In SOIC Sockets • Lid can be actuated from top or front and is compatible with automated load/unload equipment • Compact envelope and side to side stackability maximize board density • Tweezer slot for easy manual loading/unloading • Lid applies 80 grams normal force per lead for


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    TS-0338-08 MIL-G-45204, 3M TEST SOCKETS 7383 data sheet 7474 7474B TS-0338-08 PDF

    XLT08SO

    Abstract: XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint
    Text: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION 2005 Microchip Technology Inc. DS51194L Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


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    DS51194L likel011-632-634-9065 DS51194K1-page XLT08SO XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint PDF

    DEI1072a

    Abstract: DEI1072A-SES-G DE1070A DEI1071A DEI1070A DEI1070 DEI1071A-SES-G DEI1071A-SMS-G DEI107XA TVS RZ
    Text: Device Engineering Incorporated 385 East Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] DEI1070A-DEI1075A ARINC 429 LINE DRIVER FAMILY FEATURES • • • • • • • • • TTL/CMOS to ARINC 429 Line Driver


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    DEI1070A-DEI1075A 100KBS) DEI1070A DEI1070 HI8585 HI8586 DEI107xA DS-MW-01070-02 DEI1072a DEI1072A-SES-G DE1070A DEI1071A DEI1071A-SES-G DEI1071A-SMS-G TVS RZ PDF

    plcc socket 68 PLCC bottom view

    Abstract: TQFP 100 pin Socket 68 pin plcc socket view bottom PLCC 44 socket layout footprint tqfp 208 tqfp 56 socket qfn 44 PACKAGE footprint tqfp 64 socket Microchip Product Line DS00148 84 pin plcc ic base
    Text: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION  2004 Microchip Technology Inc. DS51194K Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


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    DS51194K likely334-8870 DS51194K-page plcc socket 68 PLCC bottom view TQFP 100 pin Socket 68 pin plcc socket view bottom PLCC 44 socket layout footprint tqfp 208 tqfp 56 socket qfn 44 PACKAGE footprint tqfp 64 socket Microchip Product Line DS00148 84 pin plcc ic base PDF

    Untitled

    Abstract: No abstract text available
    Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 S8 E – 8 LEAD PLASTIC SOIC PACKAGE PACKAGE OUTLINES S8 (E) Package Outline Drawing


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    PDF

    SOIC 8 pcb pattern

    Abstract: No abstract text available
    Text: v00.0902 S8 E – 8 LEAD PLASTIC SOIC PACKAGE PACKAGE OUTLINES S8 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.


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    PDF

    SI8451BB

    Abstract: Si8451 SI8440 Si8450 B23A3 anritsu PATTERN GENERATOR Digital Isolators 4 channel SOIC16 VDE0884
    Text: Si8450/51/52/55 I S O P R O L O W P O W E R F I V E - C H A N N E L D I G I TA L I S O L A T O R Features  High-speed operation: DC to 150 Mbps  Low propagation delay: <10 ns worst case  Wide Operating Supply Voltage: 2.70–5.5 V  Ultra low power typical


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    Si8450/51/52/55 SI8451BB Si8451 SI8440 Si8450 B23A3 anritsu PATTERN GENERATOR Digital Isolators 4 channel SOIC16 VDE0884 PDF

    SI8502-C-IS

    Abstract: SI8513-C-IS Si85xx Full-bridge converter vde 0110 timer Si85 Si850x Si851x SOIC-20 VDE0884
    Text: Si85xx Si85 XX U N ID I R E C TI ON A L A C C URRENT S ENSORS Features     50 kHz to 1 MHz input frequency range  FAULT output to safeguard operation  Large 2 VPP min output at full scale Pin Assignments: See page 24 20-Pin SOIC  High-side or low-side current sensing


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    Si85xx Si85xx 20-Pin SI8502-C-IS SI8513-C-IS Full-bridge converter vde 0110 timer Si85 Si850x Si851x SOIC-20 VDE0884 PDF

    si8460

    Abstract: SI8460BA Si8461 si8462bb SI8460AB SI8462BB-B-IS1 anritsu PATTERN GENERATOR SOIC-16 VDE0884 Si8460AB-B-IS1
    Text: Si8460/61/62/63 I S O P R O L O W P O W E R S I X - C H A N N E L D I G I TA L I S O L A T O R Features Pin Assignments  High-speed operation: DC to 150 Mbps  Low propagation delay: <10 ns worst case  Wide Operating Supply Voltage: 2.70–5.5 V  Ultra low power typical


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    Si8460/61/62/63 si8460 SI8460BA Si8461 si8462bb SI8460AB SI8462BB-B-IS1 anritsu PATTERN GENERATOR SOIC-16 VDE0884 Si8460AB-B-IS1 PDF