Molded SOJ V34
Abstract: No abstract text available
Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33
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20-Lead
300-Mil)
24-Lead
28-Lead
400-Mil)
32-Lead
Molded SOJ V34
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soj 36
Abstract: V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package
Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33
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20-Lead
300-Mil)
24-Lead
28-Lead
400-Mil)
32-Lead
soj 36
V28 Package
SOJ 24
diode in 400
Molded SOJ V34
V32 Package
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Untitled
Abstract: No abstract text available
Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram
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20-Lead
300-Mil)
1-85029-A
24-Lead
1-85030-A
28-Lead
51-85031-B
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SOJ-400
Abstract: No abstract text available
Text: 5.7 UNIT : mm 13.2 MJ400-01A, LB-044 length : 493±2.0 thickness : 0.6 +0.3 − 0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied package Quantity (pcs) 28-pin plastic SOJ (400 mil) MAX. 25 32-pin plastic SOJ (400 mil) MAX. 22 36-pin plastic SOJ (400 mil)
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MJ400-01A,
LB-044
28-pin
32-pin
36-pin
40-pin
42-pin
44-pin
SOJ-400
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soj 36
Abstract: 51-85041-A 85031 SOJ 24 V28 Package V32 Package V36 Package 51-85082-B 300MIL
Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram
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20-Lead
300-Mil)
1-85029-A
24-Lead
1-85030-A
28-Lead
51-85031-B
soj 36
51-85041-A
85031
SOJ 24
V28 Package
V32 Package
V36 Package
51-85082-B
300MIL
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Untitled
Abstract: No abstract text available
Text: SOJ Socket 165-200097-01 165-200005-03 PERFORMANCE SPECIFICATIONS: FEATURES: Augat's new SOJ Socket provides the user an easy means of socketing their SOJ devices. These full featured devices are available in a variety of sizes. • Sizes range from 24 to 42 positions
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AS5C512K8
Abstract: AS5C512K8DJ 10 35L
Text: SRAM AS5C512K8 Austin Semiconductor, Inc. 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883
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AS5C512K8
36-Pin
MIL-STD-883
36L/H
AS5C512K8F-35L/H
AS5C512K8F-45/H
AS5C512K8F-55/H
AS5C512K8F-55L/H
AS5C512K8
AS5C512K8DJ
10 35L
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C10943X
Abstract: mounting pad
Text: Mounting pad of SOJ The nominal dimensions of an SOJ package are determined by the package width E . The center-to-center distance between the mounting pad arrays of an SOJ ( e1 ) is equal to the distance between the pin arrays, and the pad pitch is equal to the pin pitch e . Figure 1-11 shows the mounting
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P32LA-300A-2
P26LA-350A-2
P26LB-350A-1
P28LA-400A-2
P28LE-400A-1
P28LE-400A1
P32LE-400A
P36LE-400A
P40LE-400A-2
P42LE-400A
C10943X
mounting pad
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SOJ package MSL
Abstract: 8361H Cypress soj 36 140C JESD22
Text: Cypress Semiconductor Qualification Report QTP# 98148 VERSION 1.0 July, 1998 36 Ld, 400-mil SOJ Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 36 Ld, 400-mil SOJ QTP# 98148, V. 1.0 Page 2 of 4 July, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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400-mil
8361H
JESD22-A112
30C/60
CY7C1049-VC
SOJ package MSL
8361H
Cypress
soj 36
140C
JESD22
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AS5C512K8ECJ-15
Abstract: QV smd 10 35L st diode cross reference AS5C512K8 AS5C512K8DJ 12L marking AS5C512 5962-9560004mma AS5C512K8ECJ
Text: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation
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AS5C512K8
36-Pin
MIL-STD-883
f306HUC
5962-9561311HUC
5962-9561305HUC
5962-9561319HUC
5962-9561320HUC
5962-9561325HUC
AS5C512K8ECJ-15
QV smd
10 35L
st diode cross reference
AS5C512K8
AS5C512K8DJ
12L marking
AS5C512
5962-9560004mma
AS5C512K8ECJ
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HB56D436
Abstract: HM514100
Text: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module Description The HB56D436 is a 4 M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ
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HB56D436
304-word
36-bit
16-Mbit
HM5117400BS)
HM514100CS)
72-pin
HM514100
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HB56G136
Abstract: No abstract text available
Text: HB56G136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module Description The HB56G136 is a 1M × 36 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM HM5118160AJ sealed in SOJ package and 2 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ
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HB56G136
576-word
36-bit
16-Mbit
HM5118160AJ)
HM512200BS)
72-pin
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5962-9561309HZC
Abstract: 5962-9560003MNA SMD 10 - 25L
Text: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation
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AS5C512K8
MIL-STD-883
36-Pin
5962-9561326HUC
5962-9561306HUC
5962-9561311HUC
5962-9561305HUC
5962-9561319HUC
5962-9561320HUC
5962-9561309HZC
5962-9560003MNA
SMD 10 - 25L
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5962-956001
Abstract: 5962-9561310HUA 5962-9560009QM 5962-9561329HN soj 36 10 35L A8 AS5C512 AS5C
Text: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation
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AS5C512K8
MIL-STD-883
36-Pin
100mA
225mA
180mA
AS5C512K8
5962-956001
5962-9561310HUA
5962-9560009QM
5962-9561329HN
soj 36
10 35L A8
AS5C512
AS5C
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HB56D436BR-6A
Abstract: HB56D436SBR-7AC HB56D436 HM5117400AS HB56D436BR-7A HB56D436BR-6AC HB56D436SBR-7A
Text: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module The HB56D436 is a 4 M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400AS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100BS/CS) sealed in SOJ package. An outline of the
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HB56D436
304-word
36-bit
16-Mbit
HM5117400AS)
HM514100BS/CS)
72-pin
HB56D436BR-6A
HB56D436SBR-7AC
HM5117400AS
HB56D436BR-7A
HB56D436BR-6AC
HB56D436SBR-7A
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PNY Technologies
Abstract: 72 simm function block diagram of FPM FPM RAM
Text: 32M x 36 Bit 5V FPM SIMM Fast Page Mode FPM DRAM SIMM 363206-S54m24JL 72 Pin 32Mx36 FPM SIMM Unbuffered, 4k Refresh, 5V General Description The module is a 32Mx36 bit dynamic RAM module consisting of (16) 16Mx4 (SOJ) DRAMs and (8) 16MX1 (SOJ) DRAMS. The module is unbuffered and supports Fast
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363206-S54m24JL
32Mx36
16Mx4
16MX1
72-pin
16Mx4
16Mx1
4096-cycle
PNY Technologies
72 simm function
block diagram of FPM
FPM RAM
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hb56d836sbr-7a
Abstract: HB56D836BR-6A HB56D836SBR-6A HB56D836 HM5117400AS HB56D836BR7AC
Text: HB56D836 Series 8,388,608-word x 36-bit High Density Dynamic RAM Module The HB56D836 is a 8 M × 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM HM5117400AS sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100BS/CS) sealed in SOJ package. An outline of the
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HB56D836
608-word
36-bit
16-Mbit
HM5117400AS)
HM514100BS/CS)
72-pin
hb56d836sbr-7a
HB56D836BR-6A
HB56D836SBR-6A
HM5117400AS
HB56D836BR7AC
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HB56D136
Abstract: hb56d136bv-7b
Text: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module The HB56D136 is a 1M × 36 dynamic RAM module, mounted 8 pieces of 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 4 pieces of 1-Mbit DRAM (HM511000AJP/ALJP) sealed in SOJ package. An outline of the
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HB56D136
576-word
36-bit
HM514400BS/BLS)
HM511000AJP/ALJP)
72-pin
hb56d136bv-7b
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max3808
Abstract: No abstract text available
Text: HB56G136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G136 is a 1M x 36 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM HM5118160 AJ sealed in SOJ package and 2 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.
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HB56G136
576-word
36-bit
16-Mbit
HM5118160
HM512200BS)
72-pin
max3808
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Untitled
Abstract: No abstract text available
Text: HB56G236 Series 2,097,152-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G236 is a 2M x 36 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM HM5118160AJ sealed in SOJ package and 4 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.
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HB56G236
152-word
36-bit
16-Mbit
HM5118160AJ)
HM512200BS)
72-pin
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Untitled
Abstract: No abstract text available
Text: HB56D836 Series 8,388,608-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56D836 is a 8 M x 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ
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OCR Scan
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PDF
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HB56D836
608-word
36-bit
16-Mbit
HM5117400BS)
HM514100CS)
72-pin
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hy5118160b
Abstract: No abstract text available
Text: «HYUNDAI HYM536220A W-Series 2M X 36-bit CMOS DRAM MODULE DESCRIPTION The HYM536220A is a 2M x 36-bit Fast page mode CMOS DRAM module consisting of four HY5118160B in 42/42 pin SOJ and eight HY531000Ain 20/26pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22nFdecoupling
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HYM536220A
36-bit
HY5118160B
HY531000Ain
20/26pin
22nFdecoupling
HYM536220AW/LW
HYM536220AWG/LWG
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Untitled
Abstract: No abstract text available
Text: @ LG Semicon. Co., LTD._ Description Features The GMM7361000DS/SG is a 1M x 36 bits Dynamic RAM MODULE which is assembled 8 pieces of 1M x 4bit DRAMs in 20/26 pin SOJ package and 4 pieces of 1M x 1bit DRAMs in 20/26 pin SOJ package on both sides the
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GMM7361000DS/SG
7361000DS/SG
11111111111IIH
000bfl41
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Untitled
Abstract: No abstract text available
Text: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56D436 is a 4 M x 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ package. An outline of
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OCR Scan
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PDF
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HB56D436
304-word
36-bit
16-Mbit
HM5117400BS)
HM514100CS)
72-pin
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