Untitled
Abstract: No abstract text available
Text: ftm D U IT Grounding Connectors Typesspfi andspf2 Bronze Service Post Connectors Type SPF1 _ Dimensions-lnches V Conductor Size Range Wire Diameter Range (In.) Stud Size SPF1-8-C #12 Sol.-#8 Str. .08 1-1 46 1/4-20 .50 Female-One Cable SPF1-7-C #10 Sol.—#7 Str.
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OCR Scan
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SPF2-350-12
-350MCM
SPF2-500-12
-500MCM
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PDF
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Untitled
Abstract: No abstract text available
Text: Signetics FAST74F381 Arithmetic Logic Unit FAST Products Product Specification TYPE TYPICAL PROPAGATION DELAY 74F381 TYPICAL SUPPLY CURRENT TOTAL 6.5 ns 59mA ORDERING INFORMATION 20-Pin Plastic DIP N74F381N 20-Pin Plastic SOL N74F381D INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
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OCR Scan
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FAST74F381
74F381
20-Pin
N74F381N
N74F381D
500ns
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PDF
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LPKL
Abstract: No abstract text available
Text: Signetics FAST 74F539 Dual l-Of-4 Decoder 3-state Product Specification FAST Products TYPE TY P IC A L PROPAGATION DELAY 74F539 7.5 ns 40mA ORDERING INFORMATION COM M ERCIAL RANGE Vc c = 5V±10% ; Ta = 0CC to +70°C PACKAGES 20-Pin Plastic DIP N74F539N 20-Pin Plastic SOL
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OCR Scan
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74F539
500ns
LPKL
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PDF
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Xr 1075
Abstract: SFNF123 BD 266 S
Text: / 836860 2 SOL ITRON D E VI CE S TOC 02014 INC SFNF123 ' " \ T-39-09 SWITCH MOS 70 tEl S3tatDa 0002014 1 • PACKAGE TO-39 POWER MOS MAXIMUM RATINGS VDS S tg V Power Dissipation 0 Tc«25°C 20 W Drain Current, Clamped Inductive 20 A Voltage, Gate-to-Source
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OCR Scan
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T-39-09
SFNF123
5M6-24UNF-2A
P06fTKMOF
eA03AT
Xr 1075
SFNF123
BD 266 S
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PDF
|
Untitled
Abstract: No abstract text available
Text: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • Standard E.I.A. package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ Tape and reel packaging standard (see page 114 for dimensions)
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OCR Scan
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4400P
100ppm/Â
250ppm/Â
50ppm/Â
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PDF
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL STYLE / 16 AND 20 PINS • JEDEC package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques
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OCR Scan
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4400P
50ohms
100ppm/Â
250ppm/Â
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTOR NETWORK SOL WIDE BODY GULL WING/ 16 AND 20 PIN • Increased lead density ■ Custom circuits available per factory Model 4400T Resistor Networks Electrical Characteristics Resistance Range. 10 to 150K ohms Resistance Tolerance . ±0.1 %, ±0.5%, ±1 %
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OCR Scan
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4400T
100ppm/Â
50ppm/Â
25ppm/Â
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PDF
|
231-75PAB-14V
Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Text: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube
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Original
|
O-220,
SOL-20
216-40CT
216-40CTT
216-40CTR
LP-225
231-75PAB-14V
251-62AB
216-40CTT
wakefield engineering 67
c 945 p 239 c
MO-184
REF-10
Wakefield Engineering
EIA-481-3
MS-013
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PDF
|
Untitled
Abstract: No abstract text available
Text: CCD board level camera OEutM ion Sol C10990 series SPECTRAL RESPONSE * This is typical, not guaranteed. 60 C10990-904 C10990-942 Quantum efficiency % C10990-901, -942 50 C10990-904 40 30 20 10 200 300 400 500 600 700 800 900 1000 1100 1200 Wavelength (nm)
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Original
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C10990
C10990-904
C10990-942
C10990-901,
C10990-901
C10990-942)
B1201
SCAS0035E06
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL-J STYLE / 16 AND 20 PINS • Board footprint identical to medium body (.220 wide) SOM gull wing ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques
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OCR Scan
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4400J
100ppm/Â
250ppm/Â
|
PDF
|
sfnf423
Abstract: No abstract text available
Text: 8368602 SOL ITRON DEVICES SFNF423 70C 0 20 7 8 INC _ SWITCH MOS PACKAGE TO-39 ?o 0 r T-39-09 tE.|a3tat,Gg odosotis s F POWER MOS MAXIMUM RATINGS SYMBOL VDS XD XDM VGS PD XL TJ oper T stg UNITS PARAMETER Voltage, Drain to Source A Drain Current, Continuous @ Tc«25°C
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OCR Scan
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T-39-09
SFNF423
5M6-24UNF-2A
P06fTKM
eA03AT
sfnf423
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PDF
|
ebonol
Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
|
Original
|
O-220,
OT-223,
SOL-20
ebonol
215CB
647-25ABP
217-36CT6
230-75AB-10
MO-169
205-CB
281-2AB
204CB
1134 sot dm
|
PDF
|
ipc sm 782
Abstract: 4420p-002
Text: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • P ackage com patible with autom atic placem ent equipm ent ■ C om pliant leads to reduce solder joint fatiguing W ß P O U H N S ■ High tem perature lead attachm ent designed to withstand reflow
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OCR Scan
|
4400P
50ohms
100ppm/
250ppm/
100ppm/V
50ppm/
ipc sm 782
4420p-002
|
PDF
|
217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
|
Original
|
O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
|
PDF
|
|
|
ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
|
Original
|
O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
|
PDF
|
sfn065d
Abstract: itron 406
Text: 8368602 SOL ITRON DEVICES SFN065D INC 01990 SWITCH MOS PA CKA G E TO-3 IDM VGS PD XL T J oper T . stg UNITS Voltage, Drain to Source Drain Current, Clamped Inductive XDSS V 010 G fs VGS(th). IGSS C ISS CRSS coss ^d(on) t r td ( o f f ) Cf 16 W 20 A -55 to +150
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OCR Scan
|
T-39-11
SFN065D
5M6-24UNF-2A
P06fTKM
eA03AT
sfn065d
itron 406
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
|
Original
|
O-220,
OT-223,
SOL-20
217-36CTR6
1-866-9-OHMITE
217-36CTT6
O-263
MO-169
|
PDF
|
05683
Abstract: 587H
Text: T H IS COPY IS PROVIDED ON A RES TR IC TED B A S IS AND IS NOT TO BE USED IN ANY WAY DETRIM ENTAL TO THE Listed os o PRESSURE -TYPE wire connector on the Pol lowing sol id and/or stranded wire comb ¡notions Cu-Cu . 2 #14 w/1 or 2 #16 4 to 6 #22 5 # 18 w/ #20
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OCR Scan
|
CI221*
A41636
05683
587H
|
PDF
|
N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
|
Original
|
O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
|
PDF
|
ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
|
Original
|
O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ANALOG DEVICES Programmable, Isolated Voltage-to-Current Converter 1B22 FEATURES FUNCTIONAL BLOCK DIAGRAM I n t er n al I sol a t e d Lo op S u p p l y Dr i v e s 1000 SI Load Pin P r o g r a m m a b l e I n p u t s: 0 V t o +5 V or 0 V t o +10 V Pin Program m able O u t p u t s : 4 to 20 m A or 0 to 20 m A
|
OCR Scan
|
12-bit
AD7245
|
PDF
|
ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
|
Original
|
WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
|
Original
|
WTS001
p1-25
O-220,
OT-223,
SOL-20
|
PDF
|
SOL package
Abstract: array, sol 20 Package 28719
Text: ASRA Vishay Beyschlag Application Specific Resistor Array FEATURES ASRA stands for Application Specific Resistor Array and is supplied in a SO-L package “Small Outline” . Gull wing shaped leads and the dimensions of the package are well known from standard integrated circuits.
|
Original
|
08-Apr-05
SOL package
array,
sol 20 Package
28719
|
PDF
|
