all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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c 6090
Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Text: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste
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60-90from
IPC-A-610)
c 6090
IPC-A-610
k type thermocouple
Thermocouple Type K oven
65psi
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mutoh ip-220
Abstract: No abstract text available
Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK
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kskimm12
RC22717
W0302-019)
mutoh ip-220
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all ic data
Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as
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CH09WIP
all ic data
Intel reflow soldering profile BGA
infrared heating gun
82425EX
intel 80486 DX4
hot air bga
land pattern for TSOP
TSOP infrared
80c196kb 1988
land pattern QFP 208
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C 6090
Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Text: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)
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smema specifications
Abstract: smema AN038 smema control EAN-102068
Text: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is
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AN038
10oC/second.
EAN-102068
AN-038
smema specifications
smema
AN038
smema control
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IPC-610A
Abstract: 65psi
Text: Lead Free Solder Reflow Profile – SMD Trimmers Process Description Materials Temperature 1. Apply solder paste to test board 8 - 10 mil thick • Sn Ag Cu Alloy water soluble or no clean solder paste1 • Single sided epoxy glass (G10) (UL approved) • PC board approx. 4x4x.06 in.
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Untitled
Abstract: No abstract text available
Text: Solder reflow recommendations Solder reflow profiles consist of four stages. They are: • Preheat • Pre-flow • Reflow • Cool down It is critical to have the rate of temperature change, maximum temperature, and time duration within each stage controlled to create solder joints that have flowed properly. An example of a
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a6xb
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
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Abstract: No abstract text available
Text: 7 B C A1 INDEX AREA K NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM PLANE A. 4. DATUM A, SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
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BB1110B7
Abstract: BB1110B13
Text: 4200 Bonita Place, Fullerton, CA 92635 BB1110B AND BB2110DI -DDR SRAM TERMINATOR NETWORKS. DESCRIPTION Networks are designed to terminate SSTL_2 Class I and Class II systems. Networks use thick film resistors with high temperature solder balls. With solder balls on resistor side no via connection and ceramic substrate
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BB1110B
BB2110DI
13-inch
BB1110B7
BB1110B13
BB1110B7
BB1110B13
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r2km
Abstract: No abstract text available
Text: D X Y F 4X R2 NOTES: 1. DIMENSIONS IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Rosin Flux Type RMA
Abstract: No abstract text available
Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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01-Apr-08
Rosin Flux Type RMA
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vapor condensation cooling
Abstract: 45034
Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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03-Sep-09
vapor condensation cooling
45034
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90Pb 10Sn solder paste
Abstract: underfill with or without underfill Flip Chip Substrate nitto chip
Text: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028 Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright
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AN01028
SCA73
853503/01/pp20
90Pb 10Sn solder paste
underfill
with or without underfill
Flip Chip Substrate
nitto chip
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Untitled
Abstract: No abstract text available
Text: 新製品紹介 実装接合用Cuコア鉛フリーはんだボール Cu Cored Pb-Free Solder Ball for Solder Jointing Cu cored Pb-free solder ball：CNSA3A5C, CNSAC タブレット端末に代表されるよう めっきが均一に施されており滑らか
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Vitramon
Abstract: vitramon VJ
Text: VJ Soldering Recommendations Vishay Vitramon Multilayer Ceramic Chip Capacitors Speciality Products SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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solder mask
Abstract: BGA NSMD ball Application Note 1126 BGA
Text: Solder Mask and Trace Recommendations for FBGAs Application Note By Rudy Sterner 1. Abstract This application note provides recommendations for solder masks used with FBGAs and escape considerations for traces. The recommendations reflect current industry practices. As always, it is a good idea
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V356
Abstract: No abstract text available
Text: NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M-1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.27mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 20 X 20. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 400. A A 8
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5M-1994.
MS-034/A
27x27
V356
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Untitled
Abstract: No abstract text available
Text: UNLESS OTHERWISE SPECIFIED ALIL DIMENSIONS AND TOLERANCES CONFORM TO A3ME Y14.6M -19B4. THE BASIC SOIDER BALL GRID PITCH IS O.&Omm. THE MAXIMUM SOLDER BAN. MATRIX SIZE IB 10 X 10. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 100. DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER.
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-19B4.
BF100
15/15/Q1
492-B074
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ph0n
Abstract: No abstract text available
Text: B O TTO M VIEW 2 4 0 SO LD ER BALLS NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M -1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.00mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 18 X 18. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 324.
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ph0n
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