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    SOLDERABILITY TEST Search Results

    SOLDERABILITY TEST Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    FO-62.5LPBMT0-001 Amphenol Cables on Demand Amphenol FO-62.5LPBMT0-001 MT-RJ Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m Datasheet
    FO-9LPBMTRJ00-001 Amphenol Cables on Demand Amphenol FO-9LPBMTRJ00-001 MT-RJ Connector Loopback Cable: Single-Mode 9/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFP28LPB1W-3DB Amphenol Cables on Demand Amphenol SF-SFP28LPB1W-3DB SFP28 Loopback Adapter Module for SFP28 Port Compliance Testing - 3dB Attenuation & 1W Power Consumption Datasheet
    FO-50LPBMTRJ0-001 Amphenol Cables on Demand Amphenol FO-50LPBMTRJ0-001 MT-RJ Connector Loopback Cable: Multimode 50/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFPPLOOPBK-003.5 Amphenol Cables on Demand Amphenol SF-SFPPLOOPBK-003.5 SFP+ Loopback Adapter Module for SFP+ Port Compliance Testing - 3.5dB Copper/Optical Cable Emulation Datasheet
    SF Impression Pixel

    SOLDERABILITY TEST Price and Stock

    Microchip Technology Inc VOP-SOLDERABILITY_TESTING

    Solderability Testing, Projected EOL: 2049-11-19
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Microchip Technology Inc VOP-SOLDERABILITY_TESTING 28 Weeks
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    Microchip Technology Inc RFDS-SOLDERABILITY_TESTING

    Solderability Testing, Projected EOL: 2044-08-15
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Microchip Technology Inc RFDS-SOLDERABILITY_TESTING 28 Weeks
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    Staffall SOLDERABILITY-TEST

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com SOLDERABILITY-TEST 1
    • 1 $317.41
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    • 100 $317.41
    • 1000 $317.41
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    UNKNOWN SOLDERABILITYTESTING

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    Bristol Electronics SOLDERABILITYTESTING 4
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    SOLDERABILITY TEST Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CuCrSiTi

    Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
    Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds


    Original     		PDF 06-June-03 16H150 10mN/mm 10seconds 06-Junitial CuCrSiTi k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability

    Solderability Tests

    Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
    Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free


    Original     		PDF AN2036 2002/95/EU, Solderability Tests AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002

    Solderability

    Abstract: EIA-198-2-E EIA-198 EIA-198-2E
    Text: 6/3/02 http:www.niccomp.com Technical Inquiries: [email protected] COMPONENT SOLDERABILITY PRODUCTS: SMT CERAMIC CHIP CAPACITORS & ARRAYS SERIES: NMC / NMC-E / NMC-L / NMC-H / NCA SOLDERABILITY SPECIFICATION >95% Coverage of terminal finish by new solder coat


    Original     		PDF EIA-198-2-E Solderability EIA-198-2-E EIA-198 EIA-198-2E

    Sn63Pb

    Abstract: flux
    Text: Point of note about solderability of lead free products attach “G” to package name Test Test condition Note Use of Sn-63Pb solder Bath Pass: Solder bath temperature = 230°C, Dipping time = 5 seconds solderability rate until forming The number of times = one, Use of R-type flux


    Original     		PDF Sn-63Pb Sn63Pb flux

    Kester 182

    Abstract: No abstract text available
    Text: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder


    Original     		PDF 10NOV04 Kester 182

    MSQ1040

    Abstract: 330UH SMD 330uH
    Text: MINIATURE SQUARE SHIELDED SMD POWER INDUCTORS SERIES MSQ1040 FEATURES - 100% ferrite shielded. Very high current handling capacity. - Excellent solderability. High heat resistance. Low price ELECTRICAL SPECIFICATIONS - Inductance range - Test conditions 1.5uH -7uH


    Original     		PDF MSQ1040 330uH) 330uH 25Vrms 100kHz 330mm MSQ1040 330UH SMD 330uH

    CviLux CONNECTOR

    Abstract: 21/CviLux CONNECTOR
    Text: FFC/FPC CONNECTORS CviLux CF SYSTEM CF Technical Specifications Testing Methods of Electronic Connectors Follow Below Military Standards: Dielectric Withstanding Voltage Contact Resistance Insulation Resistance Solderability - Per MIL-STD-1344A method 3001.1


    Original     		PDF MIL-STD-1344A MIL-STD-202F CviLux CONNECTOR 21/CviLux CONNECTOR

    RJ11 jack dimension

    Abstract: RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45
    Text: Series Z Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability


    Original     		PDF 1000VAC RJ11-6Z RJ11-6Z3 RJ11-6Z4 RJ45-8Z RJ45-8Z3 RJ45-8Z4 RJ11 jack dimension RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45

    Untitled

    Abstract: No abstract text available
    Text: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal


    Original     		PDF 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST SM04-17 SM04-17 MIL-STD-202,

    Untitled

    Abstract: No abstract text available
    Text: FHV Vishay Techno Thick Film Planar Resistors, Through-Hole, High Voltage FEATURES MECHANICAL SPECIFICATIONS Terminal Strength: 5 pound pull test Solderability: Continuous satisfactory coverage when tested in accordance with MIL-R-10509 MATERIAL SPECIFICATIONS


    Original     		PDF 2002/95/EC MIL-R-10509 18-Jul-08

    Untitled

    Abstract: No abstract text available
    Text: Z Series Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability


    Original     		PDF 1000VAC RJ11-6Zating: RJ11-6Z RJ11-6Z3 RJ11-6Z4 RJ45-8Z RJ45-8Z3 RJ45-8Z4

    Trichloroethane

    Abstract: No abstract text available
    Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.


    Original     		PDF

    UMB01P050

    Abstract: No abstract text available
    Text: Industrial Microphotonics Company Unmounted 50W Pulsed Laser Diode Bar Part Number: UMB01P050 2.00 50.00 Optical Power W Electrical to Optical Efficiency (%) 40.00 Excellent Solderability Lot Tested Also Available from 915nm-980nm 1.50 30.00 1.00 20.00 0.50


    Original     		PDF UMB01P050 915nm-980nm laser2000 D-10/01 UMB01P050

    alcohol isopropylic

    Abstract: No abstract text available
    Text: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.


    Original     		PDF

    posistor

    Abstract: H60A
    Text: Item Continuous Operating Temperature Resistance R25 Withstanding Voltage Tensil Strength of Lead Wire Terminal Bending Strength of Lead Wire Terminal Solderability Terminal Durability of Soldering Humidity Test Load Cycle Test at High Temperature Method of examination


    Original     		PDF R/R25 posistor H60A

    Untitled

    Abstract: No abstract text available
    Text: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process


    Original     		PDF 50Vdc 100Vdc 200Vdc 300Vdc 500Vdc

    208H

    Abstract: No abstract text available
    Text: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters


    OCR Scan     		PDF MIL-STD-2026, UL94V-0 E151556 102mm) O-80-90- 10O-110-120- SHIELD/77 300MHmensions: 12x00 XF10G02C-CTxul 208H

    208H

    Abstract: No abstract text available
    Text: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters


    OCR Scan     		PDF MIL-STD-2026, UL94V-0 E151556 102mm) SHIELD/77 2MHz-50MHz 200MHz 400MHz 500MHz 12x00 208H

    208H

    Abstract: VE1000
    Text: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0


    OCR Scan     		PDF XF0406 20M-300MHz 125Vrms, 50Vdc MIL-STD-202G, UL94V-0 E151556 102mm) XF0406â 208H VE1000

    Untitled

    Abstract: No abstract text available
    Text: 1. M echanical D im ensions: 1.28 Max A 2. Sch em atic: 3. E lectrical Specification s: 25°C OCL: 47uH ±20% I.O K H z 1.0V, OAdc OCL: 23.7uH±20% ®1KHz 1.0V, 11.8Adc DCR: 0.012 Ohms Max Notes: 1. Solderability: Leads shall meet M IL-STD -202, Method 208D for solderability.


    OCR Scan     		PDF 3XF0476â MIL-STD-202, UL94V-0 E151556 102mm)

    208H

    Abstract: No abstract text available
    Text: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%


    OCR Scan     		PDF MIL-STD-202G, UL94V-0 E151556 102mm) 10KHz XFHCL01 208H

    W-S-6536

    Abstract: WS6536 MIL-M38510 lead finish WS-6536
    Text: Signetics SOW-2000 Solderability Acceptance Testing Statement of Work Military Products Reference Guide FEATURES • Complies with MIL-STD-2000 solderabllity requirements • Complies with WS6536E/I solderabllity requirements • Maximizes component “Shelf


    OCR Scan     		PDF SOW-2000 MIL-STD-2000 WS6536E/I MIL-STD-2000 WS6536E/I MIL-STD-105, MIL-M-38510/P3 MIL-STD-2000/P5 WS6536/P4 W-S-6536 WS6536 MIL-M38510 lead finish WS-6536

    P1B14

    Abstract: No abstract text available
    Text: 2 1. M echanical Dim ensions: . Schem atic: XFMRS ► P YYWW O D 0 .1 2 5 Min Hi— pot: 0O.O2D±D.OO5 G » 0 .1 0 0 o o o o o o - 1 8 16 9 O D O O O D O o O - N o te s: 1. Solderability: Leads shall meet MIL— STD-Z0Z, Method 2 OSD fo r solderability.


    OCR Scan     		PDF XF0013T13 1500Vac 100KHz UL94V-0 E151556 P1B-14 P11-9 013T1 P1B14