Systems
Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
Text: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered
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profile wave soldering
Abstract: No abstract text available
Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SECK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SECK09 Recommended Soldering Pattern Units : mm
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EM2520SECK09
1000PCS
EA0130
EM2520SEK09-3/3
AUG/31/2001
EM2520SECK09
EM2520SEK09-1/3
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SYC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYC09 Recommended Soldering Pattern Units : mm
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EM2520SYC09
1000PCS
EA0133
EM2520SY09-3/3
AUG/31/2001
EM2520SYC09
EM2520SY09-1/3
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SEC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SEC09 Recommended Soldering Pattern Units : mm
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EM2520SEC09
1000PCS
EA0129
EM2520SE09-3/3
AUG/31/2001
EM2520SEC09
EM2520SE09-1/3
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SYCK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYCK09 Recommended Soldering Pattern Units : mm
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EM2520SYCK09
1000PCS
EA0135
EM2520SYK09-3/3
AUG/31/2001
EM2520SYCK09
EM2520SYK09-1/3
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Untitled
Abstract: No abstract text available
Text: SMD TYPE LED Suntan SMT Reflow Soldering Instructions 1. Reflow soldering should not be done more than two times. 2. When soldering, do not put stress on the LEDs during heating. Soldering iron 1. When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
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RIA Connect
Abstract: No abstract text available
Text: THR and SMT - what is it? The reflow process - what is it? What is actually meant by through-hole reflow? As the term suggests, wired components continue to be used. Through-hole reflow, is the new soldering process and the term describes the fact, i.e. reflow is soldering with
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Untitled
Abstract: No abstract text available
Text: Trimmer Potentiometers SMT Type_ EVM - 1/2/3/7 Series Features • An extremely compact, lightweight 2 mm open frame type for reflow soldering has been added to our lineup • 3 mm square series has types for flow soldering and reflow soldering
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30sec
60sec
50sec)
E1001C
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JEDEC J-STD-020d.1
Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-3
JEDEC J-STD-020d.1
paste profile
J-STD-020d.1
JEDEC SMT reflow profile
Altera ROHS
AN81
J-STD-020D
J-STD-033
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JEDEC J-STD-020d.1
Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-2
JEDEC J-STD-020d.1
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
pcb warpage in ipc standard
Soldering guidelines
J-STD-020D
pcb warpage* in smt reflow
Lead Free reflow soldering profile BGA
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EVM1s
Abstract: EVM1K 7L Marking EVM7J
Text: Trimmer Potentiometers SMT Type EVM - 1/2/3/7 Series Features An extremely compact, lightweight 2 mm open frame type for reflow soldering has been added to our lineup 3 mm square series has types for flow soldering and reflow soldering Solvent washing type is available
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h25b
Abstract: MKA Series MFZ Series
Text: SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS Functional polymer electrolyte capacitors RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PX/PXAseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec
50sec
60sec
50smmended
E1001A
h25b
MKA Series
MFZ Series
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Untitled
Abstract: No abstract text available
Text: Datasheet PCB Components PCB connectors for the Reflow Soldering Process SL-SMT 5.08 SL-SMT 5.08 is the high temperature resistant pin header for the 5.08 mm pitch range specially developed to be compatible with SMT Reflow soldering production processes. Standard PCB
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LIT0105
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXC/PXA series onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30mmended
E1001D
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SMD 5060
Abstract: 5060 smd SMD KAA KPDX04 KPBA-3010 KA-4040 KAA-5060 KPSX56 KA-3022-4
Text: SMD TAPE SPECIFICATIONS SMT Reflow Soldering Instructions Number of reflow process shall be more than 2 times and cooling process to normal temperature is required between first and second soldering process. PART NO. KA-3020,KM-23-F,KP-1608,KP-2012,KP-3216,KPA-2106,
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KA-3020
KM-23-F
KP-1608
KP-2012
KP-3216
KPA-2106,
KPA-3010
KPB-3025
KPBA-3010
KPBD-3224
SMD 5060
5060 smd
SMD KAA
KPDX04
KA-4040
KAA-5060
KPSX56
KA-3022-4
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Untitled
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 2,000 HOUR LOAD LIFE @ +85°C) DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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50Vdc
10KHz
10x10
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Untitled
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 1,000 HOUR LOAD LIFE @ +105°C DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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120Hz/20
120Hz
50Vdc
10x10
330mm)
380mm)
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NASE221M35V10X10
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 2,000 HOUR LOAD LIFE @ +85°C) DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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120Hz/20
120Hz
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10x10
NASE221M35V10X10
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pcb warpage in ipc standard
Abstract: pcb warpage* in smt reflow GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Lead Free reflow soldering profile BGA reflow soldering profile BGA Altera lead free BGA PROFILING leaded AN-081
Text: Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction Reflow Soldering Process Considerations The recent directives and legislations by nations around the world have mandated elimination of lead usage in some sectors of the electronics
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Untitled
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 1,000 HOUR LOAD LIFE @ +105°C DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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120Hz/20Â
120Hz
50Vdc
10x10
330mm)
380mm)
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NAWE221M35V10X10.5LBF
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 1,000 HOUR LOAD LIFE @ +105°C DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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120Hz/20
120Hz
50Vdc
380mm
NAWE221M35V10X10.5LBF
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Untitled
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING UP TO 260°C 1,000 HOUR LOAD LIFE @ +105°C DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
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120Hz/20
120Hz
50Vdc
10x10
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