Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT636-1 Search Results

    SOT636-1 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT636-1 NXP Semiconductors Footprint for reflow soldering SOT636-1 Original PDF
    SOT636-1 NXP Semiconductors Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink Original PDF