Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-1
OT638-1
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD
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HTQFP100:
OT638-4
MS-026
sot638-4
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e
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HTQFP100:
OT638-3
MS-026
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp
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HTQFP100:
OT638-1
MS-026
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HTQFP100
Abstract: a7551
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index
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HTQFP100:
OT638-1
HTQFP100
a7551
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-3
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philips l 6.1
Abstract: HTQFP100 MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index L detail X
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HTQFP100:
OT638-1
MS-026
philips l 6.1
HTQFP100
MS-026
sot638
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD
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HTQFP100:
OT638-6
sot638-6
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HTQFP100
Abstract: MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X
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HTQFP100:
OT638-2
MS-026
HTQFP100
MS-026
sot638
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-2
OT638-2
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X 26 100 1 25 w M bp
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HTQFP100:
OT638-2
MS-026
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HTQFP100
Abstract: No abstract text available
Text: PDF: 2001 Mar 30 Philips Semiconductors Package outline HTQFP100: plastic, heatsink thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT638-1 c y heatsink side X Dh A 75 51 76 50 ZE e E HE Eh A2 A A3 A1 w M θ bp Lp pin 1 index L detail X 26 100
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HTQFP100:
OT638-1
HTQFP100
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MRF581
Abstract: 2SK163 BFG480W NB b6 smd transistor 2SK508 SMD transistor n36 bf998 TEF6860HL 3SK290 baw 92
Text: RFݠ8⠜ RF RFׂڦᆌᆩࢅยऺ֩ 20066ሆ ݀քනǖ20066ሆ ࿔ॲຩႾࡽǖ9397 750 15589 Henk RoelofsLjޭጺ&ጺঢ়RFׂ ० ᅃӲԨ்ࣷۼၠጲम༵ᅜ߀்ڦRF֩ăڼ8Ӳᄺփ૩ྔă்ᅙཁेକ߸ܠएᇀ
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Motorola transistor smd marking codes
Abstract: walkie-talkie transceiver diagram BFM505 BF256B spice model 2SK163 UAF3000 BGO807C FET marking code 365 marking code M2 SOT23 SOT56
Text: RF Manual 8 edition th Application and design manual for RF products June 2006 date of release: June 2006 document order number: 9397 750 15589 Henk Roelofs,Vice President & General Manager RF Products Introduction Every edition we challenge ourselves to improve our RF manual. This 8th edition is no exception.
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uaf4000
Abstract: toshiba smd marking code transistor smd code marking wl sot23 RF LNB C band chipset M74 marking BFG480W SMD transistor n36 vHF amplifier module 2450Mhz TOSHIBA DIODE CATALOG DIODE RF DETECTOR
Text: RFマニュアル第9版 RF製品用のアプリケーションおよび設計マニュアル 2006年11月 date of release: November 2006 document order number: 9397 750 15817 Henk RoelofsRF製品担当副社長兼ゼネラル・マネージャー はじめに
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20GHz
uaf4000
toshiba smd marking code transistor
smd code marking wl sot23
RF LNB C band chipset
M74 marking
BFG480W
SMD transistor n36
vHF amplifier module 2450Mhz
TOSHIBA DIODE CATALOG
DIODE RF DETECTOR
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DAC1205D650
Abstract: HTQFP100 MS-026
Text: DAC1205D650 Dual 12-bit DAC, up to 650 Msps; 2x 4× and 8× interpolating Rev. 01 — 28 July 2009 Product data sheet 1. General description The DAC1205D650 is a high-speed 12-bit dual-channel Digital-to-Analog Converter DAC with selectable 2×, 4× or 8× interpolating filters optimized for multi-carrier wireless
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DAC1205D650
12-bit
DAC1205D650
32-bit
16-bit
HTQFP100
MS-026
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Untitled
Abstract: No abstract text available
Text: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1405D750
14-bit
DAC1405D750
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 4 — 31 January 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1005D750
10-bit
DAC1005D750
32-bit
16-bit
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dac1405d750
Abstract: No abstract text available
Text: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1405D750
14-bit
DAC1405D750
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 05 — 2 July 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1005D750
10-bit
DAC1005D750
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8× interpolating Rev. 1 — 27 July 2010 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4× or 8× interpolating filters optimized for multi-carrier wireless
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DAC1005D750
10-bit
DAC1005D750
32-bit
16-bit
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2SK43 transistor
Abstract: smd transistor m29 sot343 UXA23465 Motorola transistor smd marking codes walkie-talkie transceiver diagram UXA23476 diode SMD WL sot23 BF862 AM LNA uaf3000 2SK163
Text: th 1 ed ition 10 th editio n t h 1 e d th i t i o n RF manual 10 edition 10 Application and design manual for RF products TH September 2007 www.nxp.com 2007 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written
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UPC8236
Abstract: MRFE6VP m74 7 segment display Mounting and Soldering of RF transistors MOBILE jammer GSM 1800 MHZ circuit diagram BLF4G08LS-160A rf Amplifier mhz Doherty 470-860 RF transceiver 802.11AC AN10882 m74 7 segment display input
Text: RF Manual 16 edition th Application and design manual for High Performance RF products June 2012 NXP enables you to unleash the performance of next-generation RF and microwave designs NXP's RF Manual is one of the most important reference tools on the market for today’s
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PNX8511
Abstract: MDB65 DVI demux RGB DAC pnx8510 HTQFP100 YUV422 input analog CVBS output Philips DN 10-5 crt SMD CODES 1002 19-AUDIO mdb643
Text: PNX8510; PNX8511 Analog companion chip Rev. 04 – 12 January 2004 Product data 1. General description The PNX8510; PNX8511 is an analog backend companion chip to digital ICs processing video and audio signals. The primary difference between the PNX8510 and the PNX8511 is:
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PNX8510;
PNX8511
PNX8511
PNX8510
PNX8510/11
MDB65
DVI demux RGB DAC
HTQFP100
YUV422 input analog CVBS output
Philips DN 10-5 crt
SMD CODES 1002
19-AUDIO
mdb643
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