Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA376
OT741-1
OT741-1
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PDF
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BGA376
Abstract: MS-034 sot741 MS 034
Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 ∅v M C A B b 1/2 e e AB AA Y W V U T R P N M L K J H G F E
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BGA376:
OT741-1
MS-034
BGA376
MS-034
sot741
MS 034
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape
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BGA376:
OT741-1
MS-034
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PDF
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KELTRON
Abstract: b0949 B0539 sot6001 2SC2516M B0123 2n5978
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 . 30 2S01667 2S01904 2SC25620 IOC2562 IOC3299 SOT9011 SOT9011 SOT9011 ~~t:J62Y 35 40 2S01395 SML1612A SML1622A SML1632A SMl1642 SML1652 SML1662 SML7412 ~~tj:~~ 45 50 55 60 SML3402 SML3422 SML85502 SML85507
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1000n
127var
220AB
220AB
20var
KELTRON
b0949
B0539
sot6001
2SC2516M
B0123
2n5978
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PDF
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SOT-74
Abstract: SOT74 CDIP16 CDIP-16 philips 23
Text: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP16: ceramic dual in-line package; 16 leads; glass seal SOT74-1 8.25 max seating plane 19.94 max 296 mm Datasheet 27 mm 5.08 max 3.4 2.9 0.51 min 0.32 0.23 1.27 max 2.54 (14x) 0.51 0.38 0.254 M 7.62
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CDIP16:
OT74-1
MBB908
SOT-74
SOT74
CDIP16
CDIP-16
philips 23
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b0951
Abstract: 2SC647 BLX19 BLX16 25G60 2n5979 2N4310 ST+T8+1060
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 25 30 35 40 45 • 50 60 65 70 75 · · 80 ·85 90 · 95 912 Ie Max (A) V(BA)CEO (V) fT hFE Min Max (Hz) leBO Max (A) t, Max tf Max PD Max TOper Max (a) (a) (W) (OC) Package Style >= 5 A, (Co nt' d)
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2N1152
Abstract: 2N1149 2N1150 2N1151 2N1265 2N1193 2N1212 RCA 2n1184a 2N1247 2N1264
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 . 30 2S01667 2S01904 2SC25620 IOC2562 IOC3299 SOT9011 SOT9011 SOT9011 ~~t:J62Y 35 40 2S01395 SML1612A SML1622A SML1632A SMl1642 SML1652 SML1662 SML7412 ~~tj:~~ 45 50 55 60 SML3402 SML3422 SML85502 SML85507
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CDIP14
Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Text: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm
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OT108-1
OT109-1
OT162-1
OT163-1
OT137-1
OT136-1
OT337-1
CDIP24;
OT94-1)
MBB910
CDIP14
cdip28
SSOP20 300 mil
MS-012AB
MS-012AC
SO20
sot73-1
sot94
150AH
CDIP-14
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2SC3303 to-251
Abstract: 2S0586 2SC3303 2N4306 bo 913 bur10 SML1634
Text: POWER SILICON NPN Item Part Number Number I C 5 -10 15 -20 25 30 35 40 45 -50 ~ BUR10 BUR10 BUR10 SVTSO-5 SVTSO-5 SVTBO-5 2N2SS0 2N4113 2N4115 2N4306 2N4309 2SC520 2N1725 2N3S50 SOT5636 SOT63S3 2N2S93 2N5326 "~""";JIOI'\L. 55 - -60 2SC3367 2S0961 2N5337
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O-l11
O-220AB
O-220
O-220var
O-251
2SC3303 to-251
2S0586
2SC3303
2N4306
bo 913
bur10
SML1634
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philips package information
Abstract: No abstract text available
Text: Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 SOT109-1 SOT162-1 SOT163-1 SOT137-1 SOT136-1 plastic small outline package; 14 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 3.9 mm
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OCR Scan
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OT108-1
OT109-1
OT162-1
OT163-1
OT137-1
OT136-1
S0T337-1
OT338-1
S0T339-1
OT340-1
philips package information
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PDF
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