Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint for reflow soldering of RDBS27P package 2 SOT878-1 1 27 1 2.54 26 hole diameter min. 0.92 2 ∅ 0.08 M Dimensions in mm SOT878-1_fr PDF sot878-1_fr Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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RDBS27P
OT878-1
OT878-1
sot878-1
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Untitled
Abstract: No abstract text available
Text: Package outline TSON4R: plastic thin small outline package; no leads; 4 terminals; resin based; body 1.6 x 2 × 1.1 mm SOT870-1 D B A A E A1 terminal 1 index area detail X C e1 b 1 terminal 1 index area 2 v w M v w M M M C A B C y y1 C C A B C L e2 4 3 X
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OT870-1
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MO-205
Abstract: LFBGA100 sot872
Text: Package outline Philips Semiconductors LFBGA100: plastic low profile fine-pitch ball grid array package; 100 balls; body 9 x 9 x 1.05 mm D SOT872-1 B A ball A1 index area A2 A E A1 detail X e1 C 1/2 e ∅v ∅w b e M M y y1 C C A B C K J e H G F e2 E D 1/2 e
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LFBGA100:
OT872-1
MO-205
MO-205
LFBGA100
sot872
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Untitled
Abstract: No abstract text available
Text: 333 SOT873-1 QF N3 HVSON8; reel pack; standard product orientation; 12NC ending 115 Rev. 1 — 21 September 2011 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning PQ-label permanent Circular sprocket holes opposite the
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OT873-1
001aak603
OT873-1
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sot870
Abstract: No abstract text available
Text: Package outline Philips Semiconductors TSON4: plastic thin small outline package; no leads; 4 terminals; body 1.6 x 2 × 1.1 mm D SOT870-1 B A A E A1 terminal 1 index area detail X C e1 b 1 terminal 1 index area 2 v w M v w M M M C A B C y1 C y C A B C L
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OT870-1
sot870
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philips e3
Abstract: sot877
Text: Package outline Philips Semiconductors HLQFN18: plastic thermal enhanced low profile quad flat package; no leads; 18 terminals; body 10 x 8 x 1.4 mm SOT877-1 A D y terminal 1 index area E D2 2x D3 (2×) ZE1 (10×) b (15×) 7 8 9 6 10 5 11 4 12 3 13 2 14
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HLQFN18:
OT877-1
philips e3
sot877
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LBGA196
Abstract: LBGA-196 MO-192 sot879
Text: Package outline Philips Semiconductors LBGA196: plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm A B D SOT879-1 ball A1 index area A A2 A1 E detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C P N e M L K J H e2 G 1/2 e F E D C
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LBGA196:
OT879-1
MO-192
LBGA196
LBGA-196
MO-192
sot879
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm D SOT871-1 A B terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 26 M M y y1 C C A B C L 27 12 LC e e2 Eh 1/2 e eg
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HVQFN52:
OT871-1
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BGA756
Abstract: MS-034 sot875
Text: Package outline Philips Semiconductors BGA756: plastic ball grid array package, 756 balls, body 35 x 35 x 1.75 mm D D1 SOT875-1 B A ball A1 index area A E1 E A2 A1 detail X C e1 e AP AM AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M y AN AL e AJ
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BGA756:
OT875-1
MS-034
BGA756
MS-034
sot875
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Untitled
Abstract: No abstract text available
Text: Package outline DFN3333-8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3.3 x 3.3 x 1.0 mm SOT873-1 X B D A E terminal 1 index area A A1 c detail X terminal 1 index area e1 C v w b e 1 4 M M y y1 C C A B C L1 Eh L2
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DFN3333-8:
OT873-1
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IC-7316-001
Abstract: TFBGA316 sot876 MO-195
Text: Package outline Philips Semiconductors TFBGA316: plastic thin fine-pitch ball grid array package; 316 balls; body 11 x 11 x 0.8 mm SOT876-1 B D A ball A1 index area A E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J
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TFBGA316:
OT876-1
MO-195
IC-7316-001
IC-7316-001
TFBGA316
sot876
MO-195
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HVQFN52
Abstract: DF-39 sot871 HVQFN-52 DF 39 DF 085 l2712
Text: Package outline Philips Semiconductors HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm A B D SOT871-1 terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 M M y1 C C A B C y 26 L 27
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HVQFN52:
OT871-1
HVQFN52
DF-39
sot871
HVQFN-52
DF 39
DF 085
l2712
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RDBS27P
Abstract: SOT-878 sot878
Text: Package outline Philips Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm
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RDBS27P:
OT878-1
RDBS27P
SOT-878
sot878
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lfpak
Abstract: LFPAK package SOT669* PSMN017-60YS PSMN012-60YS as 220 1r7 PSMN015-60PS PSMN5R0-80PS PSMN013-30LL PSMN014-60LS PSMN017-30LL
Text: NXP power switching MOSFETs in compact QFN3333 package Smaller. Faster. Cooler. 30 V Trench 6 MOSFETs in 3.3 x 3.3 mm QFN package A new range of 30 V Trench 6 MOSFETs in QFN3333 SOT873 package NXP now offers a range of high-performance, 30 V, logic-level MOSFETs in QFN3333 package.
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QFN3333
QFN3333
OT873)
switc873
OT669
OT1023
lfpak
LFPAK package
SOT669* PSMN017-60YS
PSMN012-60YS
as 220 1r7
PSMN015-60PS
PSMN5R0-80PS
PSMN013-30LL
PSMN014-60LS
PSMN017-30LL
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Untitled
Abstract: No abstract text available
Text: AN11304 MOSFET load switch PCB with thermal measurement Rev. 1 — 25 January 2013 Application note Document information Info Content Keywords Load switch, MOSFETs, DFN2020MD-6 SOT1220 , DFN2020-6 (SOT1118); DFN3333-8 (SOT873-1), thermal resistance Abstract
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AN11304
DFN2020MD-6
OT1220)
DFN2020-6
OT1118)
DFN3333-8
OT873-1)
DFN2020,
DFN3333
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A 1 L 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale Dimensions (mm are the original dimensions)
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RDBS27P:
OT878-2
sot878-2
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Untitled
Abstract: No abstract text available
Text: Package outline LBGA196: plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm A B D SOT879-1 ball A1 index area A A2 A1 E detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1 index area
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LBGA196:
OT879-1
MO-192
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tea1719
Abstract: PH1930 nds 3 video guard smart card OPTOCOUPLER SMPS for HDD ph1930al PH2530AL ip4223 SMD 8A TRANSISTOR 702 transistor smd code PH6030AL
Text: Application Guide Notebook Computing Introduction Your partner for notebook computing Designing notebooks isn’t getting any easier. The footprint continues to shrink, and consumers continue to demand more features, faster speeds, on our decades-long leadership in high-performance mixed-signal solutions,
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TDA8594SD
Abstract: AEC-Q100 BC859 Q100 TDA3664 TDA8594J philips speakers tweeter 00-TOTAL TDA8595
Text: TDA8594 I2C-bus controlled 4 x 50 W power amplifier Rev. 02 — 11 December 2007 Product data sheet 1. General description The TDA8594 is a complementary quad Bridge Tied Load BTL audio power amplifier made in BCDMOS technology. It contains four independent amplifiers in BTL
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TDA8594
TDA8594
TDA8594SD
AEC-Q100
BC859
Q100
TDA3664
TDA8594J
philips speakers tweeter
00-TOTAL
TDA8595
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prtr5v0u6s
Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years
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2002/95/EC.
PMBTA42
PMEG3005EL
PMEG6010EP
PMR780SN
PTVS12VS1UR
PZU13y
PMBTA42DS
PMEG3005ET
PMEG6010ER
prtr5v0u6s
csp1040
TSSOP20 FOOTPRINT
ip4065cx11
smd transistor GY sot89
IP4065CX11/LF
BV 9y transistor smd
IP4058CX8/LF
IP4280CZ10
smd transistor GY
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PSMN013-30LL
Abstract: No abstract text available
Text: PSMN013-30LL N-channel QFN3333 30 V 13 mΩ logic level MOSFET Rev. 04 — 7 July 2010 Product data sheet 1. Product profile 1.1 General description Logic level N-channel MOSFET in QFN3333 package qualified to 150 °C. This product is designed and qualified for use in a wide range of industrial, communications and power
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PSMN013-30LL
QFN3333
PSMN013-30LL
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NX3008NBKMB
Abstract: IP4303CX4 PCMF2DFN1
Text: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL
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PESD18VF1BL
PESD24VF1BL
PESD18VF1BSF
PESD24VF1BSF
DFN1006
DSN0603
DFN2520
DFN4020
NX3008NBKMB
IP4303CX4
PCMF2DFN1
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TDF8544TH
Abstract: No abstract text available
Text: NXP quad Class-AB amplifiers TDF854x for automotive and transportation Seamless sound experience for stop/start cars Designed for use in stop/start cars, these advanced Class-AB amplifiers support listening to audio streams while the car’s internal power supply is down for engine start. They
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TDF854x
withP36
OT851-1
TDF8544TH
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philips speakers tweeter
Abstract: TDA8595SD tda85 BC859 HSOP36 TDA3664 TDA8595 TDA8595J TDA8595TH
Text: TDA8595 I2C-bus controlled 4 x 45 W power amplifier Rev. 01 — 20 April 2006 Product data sheet 1. General description The TDA8595 is a complementary quad Bridge Tied Load BTL audio power amplifier made in BCDMOS technology. It contains four independent amplifiers in BTL
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TDA8595
TDA8595
philips speakers tweeter
TDA8595SD
tda85
BC859
HSOP36
TDA3664
TDA8595J
TDA8595TH
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