JESD30E
Abstract: JESD-30 QFN footprint AN1152 PQFN footprint AN-1152
Text: Application Note AN-1152 Dual 5x6 Power QFN Technology Inspection and Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 2
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AN-1152
JESD30E
JESD-30
QFN footprint
AN1152
PQFN footprint
AN-1152
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Untitled
Abstract: No abstract text available
Text: SMT Insulation Displacement Connectors 21 Part Numbers 1235, 1235T, 1235T-SR Zierick recommends .006" stencil thickness for most applications. For other stencil thicknesses, call Zierick’s product development department. Loose Part No. 1235 Taped Part No.
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1235T,
1235T-SR
1235T
WTPPS-1235-1:
WTPPS-1208-1:
1245T
1245T-SR
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Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste Senju M705-GRN360-K2-V datasheet
Text: www.fairchildsemi.com AN-9078 Surface Mount Guidelines for Motion SPM 7 Series Introduction Soldering Condition This application note provides assembly guidelines for the PQFN package of the Motion SPM® 7 series. This document focuses on the design of stencil, which plays a
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AN-9078
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju M705-GRN360-K2-V datasheet
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5603
Abstract: No abstract text available
Text: SERIES 5603 0.5mmピッチ BtoB SMT H＝10mm 0.5mm Pitch BtoB SMT H＝10mm ●PLUG Recommend Stencil thickness 注文コード/Ordering Code Part No. 14 5603 14 xxxx 861 KEY B NO KEY A NO 極数 NUMBER OF CONTACTS：140極（Contacts） SERIES 5603 0.5mmピッチ BtoB SMT H＝10mm
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H10mm
H10mm
CONTACTS140Contacts
5603
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Untitled
Abstract: No abstract text available
Text: ChipQuik On-Line Store - Data Sheet for PA0096-S Page 1 of 3 DATA SHEET for SMDPA0096-S SMDPA0096-S 10/17/2012 ChipQuik On-Line Store - Data Sheet for PA0096-S Security Policy Privacy Policy
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PA0096-S
SMDPA0096-S
pa0096-s
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Stencil Rolls » EB41M0909 Stencil Rolls - EB41M0909 Features: Highly absorbent material and resistant to solvents Performs in both wet and dry applications Low lint levels
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EB41M0909
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Untitled
Abstract: No abstract text available
Text: ChipQuik On-Line Store - Data Sheet for PA0063-S Page 1 of 3 DATA SHEET for SMDPA0063-S SMDPA0063-S 10/17/2012 ChipQuik On-Line Store - Data Sheet for PA0063-S Security Policy Privacy Policy
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PA0063-S
SMDPA0063-S
pa0063-s
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Untitled
Abstract: No abstract text available
Text: Surface Mount Package Information The following pages contain information about ON Semiconductor’s Surface Mount Pacakages including: • Mimium Recommended Footprint • Power Dissipation • Soldering Precautions • Solder Stencil Guidelines • Typical Solder Heating Profile
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Abstract: No abstract text available
Text: ChipQuik On-Line Store - Data Sheet for PA0091-S Page 1 of 3 DATA SHEET for SMDPA0091-S SMDPA0091-S 10/17/2012 ChipQuik On-Line Store - Data Sheet for PA0091-S Security Policy Privacy Policy
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PA0091-S
SMDPA0091-S
pa0091-s
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Untitled
Abstract: No abstract text available
Text: A firm Commitment to excellence with a global perspective and an eye to the future Home » Stencil Rolls » EB41P2121 Stencil Rolls - EB41P2121 Features: Highly absorbent material and resistant to solvents Performs in both wet and dry applications Low lint levels
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EB41P2121
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Untitled
Abstract: No abstract text available
Text: ChipQuik On-Line Store - Data Sheet for PA0110-S Page 1 of 3 DATA SHEET for SMDPA0110-S SMDPA0110-S 10/17/2012 ChipQuik On-Line Store - Data Sheet for PA0110-S Page 2 of 3
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PA0110-S
SMDPA0110-S
pa0110-s
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Untitled
Abstract: No abstract text available
Text: ChipQuik On-Line Store - Data Sheet for PA0034-S Page 1 of 3 DATA SHEET for SMDPA0034-S SMDPA0034-S 10/17/2012 ChipQuik On-Line Store - Data Sheet for PA0034-S Security Policy Privacy Policy
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PA0034-S
SMDPA0034-S
pa0034-s
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Untitled
Abstract: No abstract text available
Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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11SMnPB30
2768m
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Untitled
Abstract: No abstract text available
Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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11SMnPB30
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SN62MP100AGS90
Abstract: IPC-SF-818 multicore mp100 SN62MP100 prozone sc 01 cleaner multicore solder paste TR-NWT-000078 prozone solder powder Solder paste stencil life
Text: E-MAIL: [email protected] WEB: www.angliac.com REFLOW SOLDERING SOLDER PASTES / CLEANER SCREEN/STENCIL AND REWORK CLEANER HIGH SPEED PRINTING, NO CLEAN, PIN TESTABLE Multicore MP100 solder cream has been formulated as a pale soft residue product for printing and reflow in air, where process yield
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MP100
150mm
SC-01
500ml
SN62MP100AGS90
SC-01
CAT/0135
SN62MP100AGS90
IPC-SF-818
multicore mp100
SN62MP100
prozone sc 01 cleaner
multicore solder paste
TR-NWT-000078
prozone
solder powder
Solder paste stencil life
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Untitled
Abstract: No abstract text available
Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil
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Sn63Pb37
EP256
21Sep09
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Untitled
Abstract: No abstract text available
Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties C Stencil suggestion: Value Surface Tin plated Material CuZn39Pb3 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Rated current 50 A max. Packaging Bulk E General information:
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CuZn39Pb3
2768m
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Untitled
Abstract: No abstract text available
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-145 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-145
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surge arrester Ac
Abstract: MARKING L2E
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-200 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-200
surge arrester Ac
MARKING L2E
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polygon stipple feature
Abstract: nvidia tnt2 alpha blending GDC Tutorial Advanced OpenGL Game Development fake bogus tnt2 nvidia
Text: GDC Tutorial: Advanced OpenGL Game Development Reflections, Shadows, Transparency, and Fog March 8, 2000 Mark J. Kilgard Graphics Software Engineer NVIDIA Corporation Quick Tutorial on Stencil Testing An extra test for fine -grain pixel control fine-grain
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Abstract: No abstract text available
Text: NOTES: REVISION Q Q 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .75 LBS. 3. PARTS TO BE PACKAGED IN TRAYS. 4. MUST BE CHECKED ON EVERY 6 CONSECUTIVE PINS. 5. SEE RECOMMENDED FOOTPRINT DRAWING FOR STENCIL REQUIREMENTS. 6. MEASURE ON ALL 4 CORNERS OF THE ASSEMBLY.
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DPAF-XX-03
DPAF-23-03
K-1000-800
\DWG\MISC\MKTG\DPAF-XX-03
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AK marking
Abstract: marking AK TYCO electronics marking code date
Text: 8 T H IS DRAWING IS U N P U B LIS H E D . 7 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. COPYRIGHT - BY TYCO ELECTRONIC5 CORPORATION. 0.51 D A REF 5.28 [,208]MAX SS 7 7 + 1.02±0.08 B RECOMMENDED PC BOARD PAD PATTERN 0.20 [.008] THICK STENCIL A AMP 4605 REV 31MAR2000
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31MAR2000
25/im
PERTA728-1
19JAN01
19JAN01
AK marking
marking AK
TYCO electronics marking code date
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W8X00
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; SEE TABLE 1 FOR LAND PAD AND SOLDER MASK COORDINATES; SEE TABLE 2 FOR SOLDER PASTE STENCIL COORDINATES. 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS4802X
W8X00
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1-146134-7
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. A REF B SPACES @ 2.54 = [.1 0 0 ] C D 4.Í [.1 92] C 2A TYP RECOMMENDED PCB LAYOUT B A R ECOM MENDED PCB LAYOUT ROR USE WITH .0 0 8 THICK STENCIL
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31MAR2000
30SEP94
1-146134-7
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