RBS 6402
Abstract: smd code 1Bs smd fuse marking code TN solar cell cnc TRANSISTOR SMD MARKING CODE kn smd transistor 5Bs smd transistor marking DK RH smd transistor marking cf rh RBS 2202 telecom rbs 6102
Text: Contents 2011 RoHS Compliant CERAMIC METALIZED SUBSTRATE Ceramic Metalized Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F1-F2 CIRCUIT PROTECTION PRODUCTS Page Over-Current Protection CF/CFS
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RS4N
Abstract: RA8C1640 RS8A CSA803 RA4C1632 rs8m RS8A Chip Array Resistors material for chip resistors
Text: DATA BOOK Chip Array Resistors SUSUMU CO.,LTD. Chip Array Resistors Structure Electrode Protection film Resistors Wrap around electrode Alumina substrate thin film type Electrode Protection film Resistors Protection film Wrap around electrode Alumina substrate
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100MHz,
RS4N-1011-J
21pcs)
RS4N-1004-J
RS4N
RA8C1640
RS8A
CSA803
RA4C1632
rs8m
RS8A Chip Array Resistors
material for chip resistors
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thevenin
Abstract: No abstract text available
Text: Chipscale Thevenin Termination Network CHC Thevenin Series • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • RoHS compliant terminations available • JEDEC standard 9-9A compatible High purity alumina substrate
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100ppm/
thevenin
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Untitled
Abstract: No abstract text available
Text: Chipscale Thevenin Termination Network IRC Advanced Film Division CHC Thevenin Series High purity alumina substrate • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • JEDEC standard 8-9A compatible Solder balls
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CC0910L
CC0910L
100ppm/
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Untitled
Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls
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CD0865
100ppm/
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CD1065B-01-50R0-F
Abstract: 100k7
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series High purity alumina substrate • Superior TaNFilm resistors on ceramic substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls
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CD0865
p100ppm/
15722R0
CD1065B-01-50R0-F
100k7
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D1065
Abstract: D0865
Text: Chipscale Termination Arrays ISO-9001 Registered High purity alumina substrate • • • • Superior TaNFilm resistors on ceramic substrate High density networks on a reduced footprint Excellent solution for thin, portable products Custom array solutions also available
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ISO-9001
D1065A
D0865B
D1065B
CD0865
CD1065
CD0865
100ppm/
Issue16OCT01
D1065
D0865
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Untitled
Abstract: No abstract text available
Text: S30R / A30R, S30V / A30V Vishay Thin Film Center Tap Chip Resistor Features • 30 Mil Square Size. • Resistance Range : Silicon Substrate Equal value - 4.7 ohms to 1M total Unequal value - 4.7 ohms to 500K per resistor Actual Size (Alumina Substrate)
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S3ORDC6801FN
28-Jun-00
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Untitled
Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance • Standard tolerances to ±1%
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CD0910
100ppm/
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Untitled
Abstract: No abstract text available
Text: Model 899-1 R* 1.21 gms Breakdown of component e.g. Material Name. chassis, transformer, lead (e.g. Sn alloy frame, encapsulation, etc. ) Alumina Substrate Alumina Substance Name (e.g. Copper (Cu) Aluminum Oxide Silica Magnesium Oxide Other Thick Film with Alumina Substrate
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Al203
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SMD resistors capacitance
Abstract: ohm ranger SMD34 Slim-Mox Resistors SMD carbon composition resistors little devil
Text: Table of Contents Surface Mount Resistors Thick Film Power Resistors LVC Series - Low Value Thick Film 3 TA Series - Alumina Substrate Radial Leads 57 LVC Series - 1% Tolerance 4 TC Series - Porcelainized Steel Substrate Radial Lead 58 5 TN Series - Power SIP Resistor Network
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Ta2N
Abstract: "beryllium oxide" 61051
Text: Substrate Thin Film Metalized Wafers Vishay Electro-Films Thin Film Metalized Plates METALIZED PLATES SIZE SUBSTRATE MATERIAL METALIZATION FILMS 2 to 4 INCHES ALUMINA NiCr, Cu, Ta2N Ni, TiW Pd, Al, Au 2 to 3 INCHES QUARTZ NiCr, Cu, Ta2N Ni, TiW Pd, Al, Au
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07-Mar-07
Ta2N
"beryllium oxide"
61051
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Untitled
Abstract: No abstract text available
Text: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is
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1R50J
2R00J
4R70J
5R00J
5R10J
7R50J
8R20J
10ROJ
11R0J
12R0J
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Untitled
Abstract: No abstract text available
Text: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is
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1R50J
2R00J
4R70J
5R00J
5R10J
7R50J
8R20J
10ROJ
11R0J
12R0J
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A30D
Abstract: S30I
Text: S30D / A30D, S301 / A301 Vishay Thin Film Dual Value Chip Resistor Isolated FEATURES • 30 Mil Square Size • Resistance Range: 270 to 500K ohms each resistor (Silicon Substrate) 270 to 26K ohms each resistor (Alumina Substrate) • Gold terminations with Tantalum Nitride or Tamelox
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S3OIDC6801FN
27-Apr-01
A30D
S30I
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waveguide selective switch
Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators AT*T Wireless Services coupler AT*T coupler conductor
Text: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/
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02-Dec-04
waveguide selective switch
quartz optical properties
MSI nichrome resistor
A1203
Thin Film Capacitors
AI and Au wirebonding
NICHROME wire 0.005 mm2
microwave circulators
AT*T Wireless Services coupler
AT*T coupler conductor
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dupont mylar
Abstract: Mylar DuPont
Text: WAVEGUIDE ATTENUATOR ELEMENTS RESISTIVE FILM CARDS AND Florida RF Labs provides resistor metallization on various substrate materials. This section of the catalog provides descriptive information for those different substrate materials. • Waveguide Elements
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TO220 HEATSINK DATASHEET
Abstract: 2203 T0247 T0247 package to126 TO220 SMALL heatsink
Text: Power Film Resistors TO – Style Packages Riedon’s Film TO – Style Power Resistors use an advanced power film formed onto an excellent heat-conduction alumina substrate. The back of the substrate is metalized and soldered to a heat-dissipating copper plate tab. This design provides excellent thermal
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T0247
TO220 HEATSINK DATASHEET
2203
T0247
T0247 package
to126
TO220 SMALL heatsink
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HTR HSV resistors
Abstract: SV-9 marking sv4
Text: www.htr-india.com Alloy Wire Wound Element on Fibre Glass Substrate / Heat Conducting Ceramic Substrate WIRE WOUND RESISTORS CERAMIC ENCASED TYPE Quartz Silica Powder HSV SERIES VERTICAL MOUNTING Ceramic Type Fire Proof Ceramic Housing Mechanically Crimped
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Untitled
Abstract: No abstract text available
Text: S20 / A20, S40, S50 Vishay Thin Film Single Value Chip Resistors FEATURES • 20, 40, 50 Mil Square Size. • Resistance Range: Silicon Substrate 20 x 20 size - 4.7 ohms to 1M ohm 40 x 40 size - 500K to 2.6M ohms 50 x 50 size - 1M to 5.2M ohms (Alumina Substrate)
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S20NC6801FN
03-May-01
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Untitled
Abstract: No abstract text available
Text: S20 / A20, S40, S50 Vishay Thin Film Single Value Chip Resistors FEATURES • 20, 40, 50 Mil Square Size. • Resistance Range: Silicon Substrate 20 x 20 size - 4.7 ohms to 1M ohm 40 x 40 size - 500K to 2.6M ohms 50 x 50 size - 1M to 5.2M ohms (Alumina Substrate)
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S20C6801FN
12-Aug-02
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Untitled
Abstract: No abstract text available
Text: THIN FILM MULTI TAP RESISTORS 116 SERIES LOG RESISTOR MECHANICAL DATA .060" x . 020" X .010" + .0 0 3 " SILICON OR ALUMINA TANTALUM NITRIDE 25,000 A MINIMUM GOLD BARE SUBSTRATE GOLD BACK OPTIONAL SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE ELECTRICAL DATA
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150ppm
-20dB
125mW
116-240ROJ-0000
240fi,
CN-TF112-A-0993
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4989 IRC
Abstract: No abstract text available
Text: s im THE RESISTOR PEOPLE TANFILM RESISTOR NETWORK ULTRA PRECISION High alumina substrate 4900 SIP SERIES Leads bonded to substrate, no solder • Quaified to M83401, RZ07, RZ08 and RZ09, Characteristic H • .1% tolerance • High component density • TC tracking 5 ppm standard, 2 ppm available
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M83401,
MIL-R-83401
MIL-R-83401/07
MIL-R-83401/09
MIL-R-83401/08
RZ080
RZ090
4989 IRC
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Untitled
Abstract: No abstract text available
Text: HIGH VALUE CHIP RESISTORS SICHROME MSHR SERIES MSHR-2 ww SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE T.C.R. .0 2 0 " x . 0 2 0 " x . 0 1 0 " + .0 0 3 " SILICON OR ALUMINA SICHROME GOLD (15,000 A MIN.), OPTIONAL ALUMINUM (1000 A MIN.) BARE SUBSTRATE OR GOLD BACK OPTIONAL
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TF104
-20dB
125mW,
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