SUMITOMO EPOXY 1076 Search Results

SUMITOMO EPOXY 1076 Result Highlights (5)

Part	Manufacturer	Description
54122-107641300LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
65781-076LF	Amphenol Communications Solutions	Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,8 Positions
54112-107641100LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
51731-076LF	Amphenol Communications Solutions	PwrBlade®, Power Connectors, 24S 6P Right Angle Header, Solder To Board
CED010761142001	Amphenol Communications Solutions	Double Density Cool Edge, storage and server connectors, SMT, 76 signal pins, 0.8 mm, Vertical, 2.36mm AIC

SUMITOMO EPOXY 1076 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
sumitomo G700 Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]	Original		PDF
STMicroelectronics marking code date Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes	Original	MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E	PDF
dALLAS MARKING CODE Abstract: Ablebond 84lmisr4 tamac 4 DS1233 marking 84-LMISR4 tamac Text: DALLAS SEMICONDUCTOR APPROVED DOCUMENT 40–01233–05Z ORIGINATOR DESCRIPTION REV. N PAGE 1 OF 4 ECN NUMBER DATE REV. Jerry Jordan Original Issue 05210 08/18/92 A Bruce McLaren Improve brand, add brand table 05550 10/14/92 B Ken Burdette Update die diagram	Original	DS1233 10/31/MICONDUCTOR dALLAS MARKING CODE Ablebond 84lmisr4 tamac 4 DS1233 marking 84-LMISR4 tamac	PDF

Catalog Datasheet

Type

Document Tags

PDF

sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]

Original

PDF

STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes

Original

MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E

PDF

dALLAS MARKING CODE

Abstract: Ablebond 84lmisr4 tamac 4 DS1233 marking 84-LMISR4 tamac
Text: DALLAS SEMICONDUCTOR APPROVED DOCUMENT 40–01233–05Z ORIGINATOR DESCRIPTION REV. N PAGE 1 OF 4 ECN NUMBER DATE REV. Jerry Jordan Original Issue 05210 08/18/92 A Bruce McLaren Improve brand, add brand table 05550 10/14/92 B Ken Burdette Update die diagram

Original

DS1233 10/31/MICONDUCTOR dALLAS MARKING CODE Ablebond 84lmisr4 tamac 4 DS1233 marking 84-LMISR4 tamac

PDF