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MaxLinear Inc ST16C654IQ100-F IC UART FIFO 64B QUAD 100QFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ST16C654IQ100-F	Tray	344		1	1 $29.59 10 $23.906 100 $29.59 1000 $19.78342 10000 $19.78342	Buy Now
Mouser Electronics	ST16C654IQ100-F		104			1 $19.89 10 $18.34 100 $18.24 1000 $18.24 10000 $18.24	Buy Now
MaxLinear Inc ST16C654CQ100-F IC UART FIFO 64B QUAD 100QFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ST16C654CQ100-F	Tray	132		1	1 $23.63 10 $18.958 100 $23.63 1000 $15.56781 10000 $15.56781	Buy Now
Mouser Electronics	ST16C654CQ100-F		66			1 $23.13 10 $18.96 100 $16.3 1000 $15.56 10000 $15.56	Buy Now
MaxLinear Inc ST16C654IQ64-F IC UART FIFO 64B QUAD 64LQFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ST16C654IQ64-F	Tray	69		1	1 $21.09 10 $16.857 100 $21.09 1000 $13.77025 10000 $13.77025	Buy Now
Mouser Electronics	ST16C654IQ64-F		255			1 $19.99 10 $16.09 100 $14.84 1000 $13.77 10000 $13.77	Buy Now
Flip Electronics	ST16C654IQ64-F		1,880			1 - 10 - 100 - 1000 - 10000 -	Get Quote
MaxLinear Inc ST16C654DCQ64-F IC UART FIFO 64B QUAD 64LQFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ST16C654DCQ64-F	Tray	69		1	1 $15.98 10 $13.634 100 $13.634 1000 $13.634 10000 $13.634	Buy Now
Mouser Electronics	ST16C654DCQ64-F		99			1 $21.25 10 $19.6 100 $16.74 1000 $15.2 10000 $15.2	Buy Now
New Advantage Corporation	ST16C654DCQ64-F		160		1	1 - 10 - 100 - 1000 $21.71 10000 $21.71	Buy Now
MaxLinear Inc ST16C654CQ64-F IC UART FIFO 64B QUAD 64LQFP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ST16C654CQ64-F	Tray	66		1	1 $22.16 10 $17.742 100 $22.16 1000 $14.51915 10000 $14.51915	Buy Now
Mouser Electronics	ST16C654CQ64-F		32			1 $22.16 10 $17.74 100 $15.07 1000 $14.51 10000 $14.51	Buy Now
Flip Electronics	ST16C654CQ64-F		1,880			1 - 10 - 100 - 1000 - 10000 -	Get Quote

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T16 C6 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
k4212 Abstract: K2611 F1 J37 pmd 11 k40 X740 Xceive K3112 k4112 2M172 CC-130 Text: 1-12-1999_10:20 A +3V B R11 TO R16 N11 TO N16 L11 TO L16 T11 TO T16 P11 TO P16 M11 TO M16 THERMAL PINS D10, C8, C6, B3, AF4 A18, D16, B14, D13, A11 C26, A26, B24, A23, C20 M26, K26, H26, G24, E25 Y24, W23, U25, P23, N25 AD19, AF23, AF26, AA23 AE10, AD13, AF14, AF18	Original	PDF	BT00-X740-C BT00-X740 k4212 K2611 F1 J37 pmd 11 k40 X740 Xceive K3112 k4112 2M172 CC-130
T16 C6 Abstract: PA-PGA176-03 Text: PA-PGA176-03 Map Rev A, 4/11/95 Generic Pinout 155,133 111,89 PGA 176 1989 67,45 23,1 1,23 -03G Bottom View- Base 44,22 -03G A16 T1 T16 © 88,66 176 A1 I.E. 176,154 132,110 89,111 133,155 45,67 PGA 22,44 1989 66,88 I.E. 110,132 154,176 Top View- PGA Xilinx Specific Pinout	Original	PDF	PA-PGA176-03 T16 C6
160 e7 Abstract: 484-pin BGA diodes t25 4 l9 AC22 AE23 AF14 EPF10K30A t25 4 k8 t25 4 H9 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet Text: EPF10K30A Device Pin-Outs ver. 1.0 Pin Name 144-Pin TQFP MSEL0 2 77 MSEL1 (2) 76 nSTATUS (2) 35 nCONFIG (2) 74 DCLK (2) 107 CONF_DONE (2) 2 208-Pin PQFP/RQFP 108 107 52 105 155 2 240-Pin PQFP/RQFP 124 123 60 121 179 2 256-Pin FineLine BGA P1 R1 T16 N4 B2	Original	PDF	EPF10K30A 144-Pin 208-Pin 240-Pin 256-Pin 356-Pin 484-Pin EPF10K100A 600-pin 240-pin 160 e7 484-pin BGA diodes t25 4 l9 AC22 AE23 AF14 t25 4 k8 t25 4 H9 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
VMD32 Abstract: R526 Text: 1 2 3 4 5 6 7 8 BWP BCA11 BCA10 BCA25 BCA12 BCA24 BCA15 BCA23 BCA16 BCA22 BCA21 BCA20 BCA14 BCA19 BCA13 BCA18 BCA8 BCA17 BCA9 U6 T8 T16 T13 T11 R6 R15 P5 P16 M16 D11 D10 C10 B10 A10 D9 C9 B9 A9 D8 C8 B8 A8 E7 D7 C7 B7 A7 E6 D9 3,7,20 2 AGP_BUSY# 1 G_REQ# 3	Original	PDF	BCA11 BCA10 BCA25 BCA12 BCA24 BCA15 BCA23 BCA16 BCA22 BCA21 VMD32 R526
pbE1 sot23 Abstract: A10 sot23-5 F1 J37 J119 SOT23 M7 j632 IO830 sot23-5 a17 H12 SOT23-5 A44 SOT23-5 cc150 Text: tied low = A B T11 TO T16 P11 TO P16 M11 TO M16 NC 1 2 J23 1 2 APPROVALS DRAWN DAN JEFF C SCOTT CHECKED ENGINEER MULLIN 303 543-2029 B 1 VGG 1 1 1 1 2 2 J100 2 J90 2 J96 2 J95 2 J89 2 J94 2 J91 2 J92 2 J93 2 J99 2 J115 DATE SIZE SCALE: TRST TCK TMS PCITDI	Original	PDF	CLK66 RS8234 CX28250 4201-XC PE685326 PE685386 BT00-D700-009 BT00-X700 pbE1 sot23 A10 sot23-5 F1 J37 J119 SOT23 M7 j632 IO830 sot23-5 a17 H12 SOT23-5 A44 SOT23-5 cc150
871L-B20E40-T2 Abstract: 871l-xcb15s40 872C-D4NP12-E2 872c-d4np12-d4 872c-dh4np12-d4 871C-P5A18 872C-D5NP18-D4 871C-P2A12 875CP-D20NP30-A2 871C-C5A18 Text: Inductive, Ultrasonic, and Capacitive Sensor/ Programmable Controller Interface Manual 1771 PLCR I/O 1746 SLCt I/O 1747 SLCt I/O 1791 Block I/O 1794 Flext I/O 1761 MicroLogixt 1000 Preferred Compatibility How To Use This Manual The information in this manual is divided into two sections. The first section	Original	PDF
P62H Abstract: ICD, P44 DATA SHEET DA16 P-FBGA169 DST1 SIO CHIP P-FBGA 169 "saturation instruction" "saturation" "instruction" DST2 dsio dclk Text: S1C33401 CMOS 32-bit Single Chip Microcomputer ● ● ● ● ● ● ● ● ● 32-bit C33 ADV RISC Core with 8K-byte Cache Low Power Consumption Multiply Accumulation Built-in 32K-byte + 1K-byte RAM 10-bit ADC 4-ch. SIO 10-ch. PWM Timer with DA16 Mode	Original	PDF	S1C33401 32-bit 32K-byte 10-bit 10-ch. S1C33401 P62H ICD, P44 DATA SHEET DA16 P-FBGA169 DST1 SIO CHIP P-FBGA 169 "saturation instruction" "saturation" "instruction" DST2 dsio dclk
S1C17705 Abstract: S5U1C17001C S1C17 Text: CMOS 16-BIT SINGLE CHIP MICROCOMPUTER S1C17705 Technical Manual Rev.1.0 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability	Original	PDF	16-BIT S1C17705 S1C17705 S5U1C17001C S1C17
ty9000 Abstract: TY9000A 1g nand mcp TY9000A000CMGF SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp Text: TY9000A000CMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A000CMGF is a mixed multi-chip package containing a 536,870,912-bit Low Power Synchronous	Original	PDF	TY9000A000CMGF TY9000A000CMGF 912-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A 1g nand mcp SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp
ty9000 Abstract: TY9000A ty9000a400 MCP 256M nand toshiba TY9000A400BMGF 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba Text: TY9000A400BMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A400BMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices	Original	PDF	TY9000A400BMGF TY9000A400BMGF 912-bit 456-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A ty9000a400 MCP 256M nand toshiba 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba
toyocom HCM filter Abstract: bare die show all kinds of LED Epson SuperFlash toyocom crystal filter 10.7 S1C17703 S1C17705 Text: CMOS 16-BIT SINGLE CHIP MICROCONTROLLER S1C17705/703 Technical Manual Rev.1.2 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability	Original	PDF	16-BIT S1C17705/703 toyocom HCM filter bare die show all kinds of LED Epson SuperFlash toyocom crystal filter 10.7 S1C17703 S1C17705
MPC850 Abstract: No abstract text available Text: MPC850 PBGA PIN ASSIGNMENT JEDEC (C) 1998 Motorola PIN NAME PIN NAME B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 VSSSYN VSSSYN1 KAPWR XTAL EXTAL EXTCLK VDDL IP_B0/IWP0/VFLS0 IP_B3/IWP2/VF2 FRZ/IRQ6 BB TA BDIP/GPL_B5 CS1 CS3 NC C2 C3 C4 C5 C6	Original	PDF	MPC850
ty9000 Abstract: MCP 256M nand toshiba ty90 TY90009400DMGF toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM P-FBGA149-1013-0 Text: TY90009400DMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400DMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices	Original	PDF	TY90009400DMGF TY90009400DMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 MCP 256M nand toshiba ty90 toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM
i351 Abstract: LOGIC FCT BT 342 project Text: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E08 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not	Original	PDF	32-BIT S1C33E08 i351 LOGIC FCT BT 342 project

TY9000 Abstract: MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM TY90009400FMGF Text: TY90009400FMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400FMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices	Original	PDF	TY90009400FMGF TY90009400FMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 TY9000 MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM
xdr rambus Abstract: xdr elpida Text: XDR DRAM 8x16Mx4 Advance Information Overview XDR DRAM CSP x4 Pinout The 512Mb Rambus XDR DRAM device is a CMOS DRAM organized as 128M words by 4 bits. The use of Differential Rambus Signaling Level DRSL technology permits 4000/ 3200/2400 Mb/s transfer rates while using conventional system and board design technologies. XDR DRAM devices are	Original	PDF	8x16Mx4 512Mb DL-0211 xdr rambus xdr elpida
S1C17711 Abstract: DATA VISION LCD MODULE p34 T16A S1C17 Text: CMOS 16-BIT SINGLE CHIP MICROCONTROLLER S1C17711 Technical Manual Rev.1.0 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability	Original	PDF	16-BIT S1C17711 representat52-2585-4600 S1C17711 DATA VISION LCD MODULE p34 T16A S1C17
XDR Rambus Abstract: 8x4Mx16 Text: XDR DRAM 8x4Mx16/8/4/2 Overview XDR DRAM CSP x16 Pinout The Rambus XDR™ DRAM device is a general-purpose highperformance memory device suitable for use in a broad range of applications, including computer memory, graphics, video, and any other application where high bandwidth and low	Original	PDF	8x4Mx16/8/4/2 512Mb DL-0476 XDR Rambus 8x4Mx16
murata REEL label Abstract: No abstract text available Text: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E07 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not	Original	PDF	32-BIT S1C33E07 murata REEL label
LCD 320 x 240 mono stn Abstract: No abstract text available Text: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E07 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not	Original	PDF	32-BIT S1C33E07 LCD 320 x 240 mono stn
MCP 256M nand toshiba Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9 Text: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package	Original	PDF	TY80009000AMGF TY80009000AMGF 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-39/39 MCP 256M nand toshiba toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
Untitled Abstract: No abstract text available Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT ^ 0 4 8 1 8 5 0 for Rev.L 8 M-BIT SYNCHRONOUS GRAM 128K-WORD BY 32-BIT BY 2-BANK Description The ,uPD481850 is a synchronous graphics memory SGRAM organized as 131,072 words x 32 bits x 2 banks random access port.	OCR Scan	PDF	128K-WORD 32-BIT uPD481850 100-pin S100GF-65-JBT juPD481850 PD481850. PD481850GF-JBT
Untitled Abstract: No abstract text available Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT jUPD4811650 for Rev.E 16 M-BIT SYNCHRONOUS GRAM 256K-WORD BY 32-BIT BY 2-BANK Description The ,uPD4811650 is a synchronous graphics memory SGRAM organized as 262,144 words x 32 bits x 2 banks random access port.	OCR Scan	PDF	jUPD4811650 256K-WORD 32-BIT uPD4811650 100-pin
Untitled Abstract: No abstract text available Text: P R E LIM IN A R Y DA TA SH EE T MOS INTEGRATED CIRCUIT aîPD4811650 for Rev.K 16 M-BIT SYNCHRONOUS GRAM 256K-WORD BY 32-BIT BY 2-BANK Description The ,uPD4811650 is a synchronous graphics memory SGRAM organized as 262,144 words x 32 bits x 2 banks random access port.	OCR Scan	PDF	aPD4811650 256K-WORD 32-BIT uPD4811650 100-pin PD4811650

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T16 C6 Search Results

T16 C6 Price and Stock

MaxLinear Inc ST16C654IQ100-F

MaxLinear Inc ST16C654CQ100-F

MaxLinear Inc ST16C654IQ64-F

MaxLinear Inc ST16C654DCQ64-F

MaxLinear Inc ST16C654CQ64-F

T16 C6 Datasheets Context Search

k4212

T16 C6

160 e7

VMD32

pbE1 sot23

871L-B20E40-T2

P62H

S1C17705

ty9000

ty9000

toyocom HCM filter

MPC850

ty9000

i351

TY9000

xdr rambus

S1C17711

XDR Rambus

murata REEL label

LCD 320 x 240 mono stn

MCP 256M nand toshiba

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