Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TAPE AND REEL BGA Search Results

    TAPE AND REEL BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TB67H481FTG Toshiba Electronic Devices & Storage Corporation Stepping and Brushed Motor Driver /Bipolar Type / Vout(V)=50 / Iout(A)=3.0 / IN input type / VQFN32 Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation

    TAPE AND REEL BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA 328

    Abstract: No abstract text available
    Text: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,


    Original     		PDF 44-Lead 48-Lead 80-Lead BGA 328

    LGA 1150

    Abstract: No abstract text available
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch


    Original     		PDF 330mm LGA 1150

    Untitled

    Abstract: No abstract text available
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch


    Original     		PDF 330mm

    639X

    Abstract: LGA 1150
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.


    Original     		PDF 330mm 150mm 639X LGA 1150

    MO-205

    Abstract: TAPE AND REEL BGA 54-BALL
    Text: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide


    Original     		PDF BGA54A 96-Ball MO-205, BGA96A 114-Ball 54-Ball BGA114A MO-205 TAPE AND REEL BGA

    Untitled

    Abstract: No abstract text available
    Text: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with


    Original     		PDF EIA-481 TB347

    948D

    Abstract: FC-09A
    Text: FC-09A 2 x 2 mm MOSFET BGA Tape and Reel Dimensions FC-09A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film


    Original     		PDF FC-09A 177cm 948D

    948d

    Abstract: No abstract text available
    Text: FC-12A 2 x 2.5 mm MOSFET BGA Tape and Reel Dimensions FC-12A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film


    Original     		PDF FC-12A 177cm 948d

    QFn 64 tape carrier

    Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
    Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with


    Original     		PDF EIA-481 TB347 QFn 64 tape carrier Techwell 7x7x1 MO-169 1748 QFN

    f948

    Abstract: F63TNR FDZ6966
    Text: FC-12A 2 x 2.5 mm MOSFET BGA with 12 balls Tape and Reel Data FC-12A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-12A 177cm f948 F63TNR FDZ6966

    FC-09A

    Abstract: f948 F63TNR FDZ6966 corrugated box spec
    Text: FC-09A 2 x 2 mm MOSFET BGA with 9 balls Tape and Reel Data FC-09A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-09A 177cm f948 F63TNR FDZ6966 corrugated box spec

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


    Original     		PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    SM-69

    Abstract: ods-1072 ODS-1079 ODS-1306 PQFN-12 sm2 1056 SOIC-AC90 W1 sot 363 M513 SM-46
    Text: Tape and Reel Packaging for Surface Mount Components M513 V11 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape


    Original     		PDF 10-inch, 13-inch 08-mm 15-mm PQFN-12, MO-220, PQFN-16, PQFN-20, SM-69 ods-1072 ODS-1079 ODS-1306 PQFN-12 sm2 1056 SOIC-AC90 W1 sot 363 M513 SM-46

    ods-1072

    Abstract: SM-69 ODS-1056 VHHC W1 sot 363 M513 MO-220 MSOP-10 PQFN-12 ODS-54
    Text: Tape and Reel Packaging for Surface Mount Components M513 V9 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape


    Original     		PDF 10-inch, 13-inch 08-mm 15-mm PQFN-12, MO-220, PQFN-16, PQFN-20, ods-1072 SM-69 ODS-1056 VHHC W1 sot 363 M513 MO-220 MSOP-10 PQFN-12 ODS-54

    Untitled

    Abstract: No abstract text available
    Text: Tape and Reel Specifications Description Loading the Reel Surface-mounted devices are packaged in embossed tape and wound onto reels for shipment in compliance with Electronics Industries Association Standard EIA-481 Rev. A. Empty pockets are not permitted between the first and last


    Original     		PDF EIA-481

    intel 04195

    Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
    Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel


    Original     		PDF paC/85 intel 04195 BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3

    k1 522

    Abstract: VFBGA EIA-481-B 07JAN200 pd0002
    Text: PD0002 Packing information Chip scale packages for memory products tape and reel shipping media Introduction Surface mounting packages can be supplied with tape and reel packing. The reels are standard 330 mm 13” diameter, 180 mm (7”) for very small packages, and


    Original     		PDF PD0002 k1 522 VFBGA EIA-481-B 07JAN200 pd0002

    PQFN-32

    Abstract: STQFN-14 ODS-1056 PQFN-12 PQFN-24 SM-46 STQFN-12 SOW-24 ODS-1072 MO-229
    Text: Application Note M513 Tape and Reel Packaging for Surface Mount Components Rev. V15 Introduction M/A-Com Technology Solutions supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and


    Original     		PDF 10-inch, 13-inch 08-mm 15-mm MSOP-10 ODS-54 ODS-120 SOIC-16 SOW-16) SOIC-24 PQFN-32 STQFN-14 ODS-1056 PQFN-12 PQFN-24 SM-46 STQFN-12 SOW-24 ODS-1072 MO-229

    f 948

    Abstract: TOP 948 f948
    Text: FC-36A 5.5 x 5 mm MOSFET BGA Tape and Reel Dimensions FC-36A MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-36A F63TNR 330cm f 948 TOP 948 f948

    Untitled

    Abstract: No abstract text available
    Text: S PEC I FI C AT I ON SHE E T Tape and Reel Tap e a n d R ee l UltraLite designs Available Now Reel only Optimized for high speed assembly of small components Confor ms to EIA-481 Peak Tape and Reel designs protect your high-value, small components through your high-speed assembly processes. Available for a


    Original     		PDF EIA-481

    FDZ6966

    Abstract: F63TNR SK 150 BGA
    Text: FC-18A 2.5 x 4 mm MOSFET BGA with 18 balls Tape and Reel Data FC-18A MOSFET BGA Packaging Configuration: Figure 1.0 Packaging Description: Moisture Sens itive Sticker Antistatic Cover Tape FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-18A 177cm FDZ6966 F63TNR SK 150 BGA

    AT 30B

    Abstract: F63TNR FC-30B FDZ6966 D9942
    Text: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-30B 330cm AT 30B F63TNR FDZ6966 D9942

    948c

    Abstract: No abstract text available
    Text: FC-18A 2.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-18A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film


    Original     		PDF FC-18A 177cm 948c

    F63TNR

    Abstract: FDZ6966 F942B
    Text: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled


    Original     		PDF FC-36A 330cm F63TNR FDZ6966 F942B