D-xxxV
Abstract: GS88237BB-200 GS88237BB-200V GS88237BB-250IV GS88237BB-250V
Text: GS88237BB/D-xxxV 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237BB/D-xxxV
165-Bump
119-bump
D-xxxV
GS88237BB-200
GS88237BB-200V
GS88237BB-250IV
GS88237BB-250V
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GS88237BB-200V
Abstract: GS88237BB-250IV GS88237BB-250V GS88237BB-200
Text: GS88237BB/D-xxxV 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237BB/D-xxxV
165-Bump
119-bump
GS88237BB-200V
GS88237BB-250IV
GS88237BB-250V
GS88237BB-200
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-333/300/250/200
119-Bump
x18/x36
88237C
119-BGA
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-333/300/250/200
119-Bump
x18/x36
88237C
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-333/300/250/200
119-Bump
x18/x36
200hich
88237C
119-BGA
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88237BB-333/300/275/250/225/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237BB-333/300/275/250/225/200
119-Bump
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GS88237BB-333/300/275/250/225/200
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GS88237AB-133
Abstract: GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225 GS88237AB-250 GS88237A GS88237AB
Text: Preliminary GS88237AB-250/225/200/166/150/133 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237AB-250/225/200/166/150/133
119-Bump
88219A
88237A
GS88237AB-133
GS88237AB-150
GS88237AB-166
GS88237AB-200
GS88237AB-225
GS88237AB-250
GS88237A
GS88237AB
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GS88237BB-200
Abstract: GS88237B GS88237BB GS88237BB-166 GS88237BB-225 GS88237BB-250 GS88237BB-250I
Text: Preliminary GS88237BB-333/300/275/250/225/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237BB-333/300/275/250/225/200
119-Bump
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GS88237BB-200
GS88237B
GS88237BB
GS88237BB-166
GS88237BB-225
GS88237BB-250
GS88237BB-250I
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GS88237C
Abstract: No abstract text available
Text: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS88237CB-333/300/250/200
119-Bump
x18/x36
88237C
119-BGA
GS88237C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS88237CB-333/300/250/200
119-Bump
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88237C
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GS88237AB-250
Abstract: GS88237A GS88237AB GS88237AB-133 GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225
Text: GS88237AB-250/225/200/166/150/133 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb Synchronous Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237AB is a SCD Single Cycle Deselect and DCD
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GS88237AB-250/225/200/166/150/133
119-Bump
GS88237AB
88219A
88237A
GS88237AB-250
GS88237A
GS88237AB-133
GS88237AB-150
GS88237AB-166
GS88237AB-200
GS88237AB-225
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GS88237BB-200
Abstract: GS88237B GS88237BB GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I x327
Text: GS88237BB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB is a SCD Single Cycle Deselect and DCD
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GS88237BB-333/300/250/200
119-Bump
GS88237BB
GS88237BB-200
GS88237B
GS88237BB-250
GS88237BB-300
GS88237BB-333
GS88237BB-333I
GS88237BB-250I
x327
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Untitled
Abstract: No abstract text available
Text: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Single/Dual Cycle Deselect selectable
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GS88237CB-333/300/250/200
119-Bump
x18/x36
119-BGA
88237C
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Untitled
Abstract: No abstract text available
Text: GS88237BB/D-333/300/250/200 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB/D is a SCD Single Cycle Deselect and
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GS88237BB/D-333/300/250/200
165-Bump
x18/x36
119-bump
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GS88237BB-200
Abstract: GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I
Text: GS88237BB/D-333/300/250/200 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB/D is a SCD Single Cycle Deselect and
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GS88237BB/D-333/300/250/200
165-Bump
GS88237BB/D
GS88237BB-200
GS88237B
GS88237BB-250
GS88237BB-300
GS88237BB-333
GS88237BB-333I
GS88237BB-250I
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-xxx
119-Bump
x18/x36
88237C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-xxx
119-Bump
x18/x36
88237C
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bcm 4330
Abstract: telemecanique contactor catalogue A5 GNC mosfet philips ecg master replacement guide Elektronikon II keltron electrolytic capacitors PART NO SELEMA DRIVER MOTOR AC 12v dc EIM Basic MK3 lenze 8600 Atlas copco rc universal 60 min
Text: NEED IT NOW? BUY REMAN! SEE PAGE lxx xx xvi SOLUTIONS, SOLUTIONS. Q A r e q u a l i t y, c o s t , a n d t i m e i m p o r t a n t to you? A ELECTRICAL SOUTH! Q Do you spend too much of your valuable time dealing with too m a n y d i ff e r e n t r e p a i r v e n d o r s ?
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MT8880AC
Abstract: MT8870CE MT8880CE MT8870C JEDEC-22BA102 cd200 mt8870 example code 87Q4 MT8870C-1 MT88L70
Text: MITEL SEMICONDUCTOR RELIABILITY MONITORING PROGRAM 1996 Table of Contents 1 INTRODUCTION TO MITEL RELIABILITY MONITORING . 1-1 2 RELIABILITY MONITOR TEST METHODOLOGY . 2-1
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MT88870CS
MT9126AS
MT8880AC
MT8870CE
MT8880CE
MT8870C
JEDEC-22BA102
cd200
mt8870 example code
87Q4
MT8870C-1
MT88L70
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Untitled
Abstract: No abstract text available
Text: B D _L NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP. U L94V-0; COLOR: BLACK 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 2. FINISH: 2.1 CONTACT: UNDER PLATING: 5 0 u ”~ 10 0 u ” NICKEL OVERALL. FINISH: SEE ORDER INFORMATION.
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L94V-0;
88238-X
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Untitled
Abstract: No abstract text available
Text: D B TERMINAL 8.0±o.i NOTES: 1. MATERIAL 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; C0L0R:BLACK. 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 2. FINISH: 2.1 CONTACT: N :1 0 0 ~ 2 0 0 u " MATT TIN PLATING 1:1 ~ 3 u * GOLD PLATING 5 0 ~ 1 0 0 u " NICKEL UNDERPLATING OVERALL
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APP96007JIIâ
ECN-0709056)
020XX
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9813
Abstract: ic 8275 ic 9661 UPD789012 IC 8823 58828
Text: IC dependence of oscillatlng charactor isi ies uPD789012 FCR5.0MC5 - STD [V] N. ItM IC NON . VIH/VIL 906 4 ,! x 982 4.8, 384 4.8, 987 4.8, 98B 4.7, b. Room Temp. Vdd CV] CV] V2H/V2L 5 .5, .4 .6 5.5, .8 .1 5.5, .6 .1 5.6 .7 .2 5.5 8 .6 e. CMHz] d. CuS] a. 5
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uPD789B12
UPD789812
9813
ic 8275
ic 9661
UPD789012
IC 8823
58828
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MIL-STD-461B
Abstract: No abstract text available
Text: interpoint Mflb3a7S 10301 Willows Road 000DS70 Sût. • IGC FMC-461 EMI FILTER MODULE P.O. Box 9 7 0 0 5 Redmond. WA 9 8 0 7 3 -9 7 0 5 TEL: 206 882-3100 TEL: (800) 8 2 2 -8 7 8 2 FAX: (206) 882-1990 • Less than 2.4 sq. in. of board area • -5 5 °C to + 125°C operation
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FMC-461
MIL-STD-461B
MIL-STD-704D
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940-100
Abstract: interpoint FMC 150 MIL-STD 461 B
Text: interpoint 10301 Willows Road FMC-461 EMI FILTER MODULE P.O. Box 97005 Redmond, WA 98073-9705 TEL: 206 882-3100 TEL: (800) 822-8782 FAX: (206) 882-1990 • Less than 2.4 sq. in. of board area •-55°C to +125°C operation •40 dB min differential mode rejection at
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FMC-461
MIL-STD-461B
MIL-STD-704D
FMC-461â
9401001HXC
FMC-461/883
9401001HZC
F/883
940-100
interpoint
FMC 150
MIL-STD 461 B
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