techpoint
Abstract: AN 7823 Unbiased HAST 130, 85 RH, 100 Hrs
Text: FLGA-SD Fine Pitch Land Grid Array - Stacked Die • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution • Available in 1.2mm TFLGA , 1.0mm (VFLGA), and 0.8mm (WFLGA) maximum thickness • Thinner than FBGA
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PTLG0100KA-A
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA100-5.5x5.5-0.5 RENESAS Code PTLG0100KA-A MASS[Typ.] 0.1g b1 S w S A w S B D Previous Code 100F0M AB b ZD A S AB e A e K J H G B E F E D C B ZE A y S x4 v 1 2 3 Index mark Laser mark S Index mark 4 5 6 7 8 9 10 Reference Symbol
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P-TFLGA100-5
PTLG0100KA-A
100F0M
PTLG0100KA-A
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Untitled
Abstract: No abstract text available
Text: P-TFLGA84-0909-0.80 5 パッケージ材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.16 TYP. 2 版/99.8.19
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P-TFLGA84-0909-0
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA081-5x5-0.50 RENESAS Code PTLG0081KA-A Previous Code 81F0E MASS[Typ.] 0.1g w S B φ b1 D φx M S φb AB φ× M S w S A ZD A AB e e A J H G B E F E D ZE C B A ×4 y S 1 2 3 4 5 6 7 8 9 Reference Symbol v Index mark Laser mark S
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P-TFLGA081-5x5-0
PTLG0081KA-A
81F0E
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P-TFLGA56-0808-0
Abstract: No abstract text available
Text: P-TFLGA56-0808-0.80 5 Package material PAD Finish Package weight g Rev. No./Last Revised Epoxy resin Au Plating 0.16 TYP. 1/Mar.31,1999
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P-TFLGA56-0808-0
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STHV800
Abstract: No abstract text available
Text: STHV800 Octal ±90 V, ±2 A, 3-level RTZ, high-speed ultrasound pulser Data brief • • • • TFLGA-56LD 8x8x0.9 mm Fully integrated real clamping-to-ground function − 8 Ω synchronous active clamp − ±2 A source and sink current Fully integrated TR switch
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STHV800
TFLGA-56LD
DocID026018
STHV800
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Untitled
Abstract: No abstract text available
Text: P-TFLGA56-0808-0.80 5 パッケージ材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.13 TYP. 2 版/00.10.25
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P-TFLGA56-0808-0
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Untitled
Abstract: No abstract text available
Text: P-TFLGA48-0707-0.80 5 Package material Package weight g Rev. No./Last Revised Epoxy resin 0.10 TYP. 2/Jun. 20, 2001
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P-TFLGA48-0707-0
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA113-8x8-0.65 RENESAS Code PTLG0113JA-A Previous Code TLP-113V MASS[Typ.] 0.12g D w S B E w S A x4 v y1 S A S y S e Z A D Reference Symbol Min Nom D 8.0 E 8.0 Max e L Dimension in Millimeters K J H B G F v 0.15 w 0.20 A 1.2 A1 E e
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P-TFLGA113-8x8-0
PTLG0113JA-A
TLP-113V
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PTLG0100JA-A
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA100-7x7-0.65 RENESAS Code PTLG0100JA-A Previous Code 100F0G MASS[Typ.] 0.1g w S B φ b1 D φx M S φb w S A ZD φ× M S AB e A e A AB K J H G B E F E D C B ×4 y S v Index mark Laser mark S ZE A 1 2 3 Index mark 4 5 6 7 8 9 10
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P-TFLGA100-7x7-0
PTLG0100JA-A
100F0G
PTLG0100JA-A
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TLP-85V
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA85-7x7-0.65 RENESAS Code PTLG0085JA-A Previous Code TLP-85V MASS[Typ.] 0.1g D w S B E w S A x4 v y1 S A S y S ZD e A K Reference Symbol e J H G B F E Dimension in Millimeters Min Nom D 7.0 E 7.0 Max v 0.15 w 0.20 A 1.20 A1 D e b
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P-TFLGA85-7x7-0
PTLG0085JA-A
TLP-85V
TLP-85V
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Untitled
Abstract: No abstract text available
Text: P-TFLGA32-0806-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-TFLGA32-0806-0
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Untitled
Abstract: No abstract text available
Text: P-TFLGA84-0909-0.80 5 Package material PAD Finish Package weight g Rev. No./Last Revised Epoxy resin Au Plating 0.16 TYP. 1/Aug.19,1999
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P-TFLGA84-0909-0
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JESD51-9
Abstract: TFLGA AN 7823 JESD51-2
Text: FLGA Fine Pitch Land Grid Array • Array molded, cost effective, space-saving packaging solution • Available in 1.20mm TFLGA , 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness • Thinner than FBGA • Exposed thermal/mechanical lands available • Laminate substrate based enabling 2 and 4
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Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA113-6x6-0.50 RENESAS Code PTLG0113KA-A Previous Code 113F0E MASS[Typ.] 0.3g w S B b1 S b w S A A ZD AB AB e A e D S L K J H B G E F E D ZE C B A y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 11 Reference Symbol D E v w A
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P-TFLGA113-6x6-0
PTLG0113KA-A
113F0E
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PTLG0077KA-A
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA77-6x6-0.50 RENESAS Code PTLG0077KA-A Previous Code 77F0E MASS[Typ.] 0.3g w S B b1 D S b ZD AB e A e A AB S w S A K J H B G E F E D ZE C B A y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 Reference Symbol D E v w A e b b1
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P-TFLGA77-6x6-0
PTLG0077KA-A
77F0E
PTLG0077KA-A
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PTLG0064JA-A
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA64-6x6-0.65 RENESAS Code PTLG0064JA-A Previous Code 64F0G MASS[Typ.] 0.07g w S B b1 D S AB b S w S A AB e A e H G F E E D C B A y S x4 v Index mark Laser mark 1 2 3 Index mark 4 5 6 7 8 Reference Symbol D E v w A e b b1 x y Dimension in Millimeters
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P-TFLGA64-6x6-0
PTLG0064JA-A
64F0G
PTLG0064JA-A
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TFLGA145-10x10-0.65 RENESAS Code PTLG0145JA-A Previous Code 145F0E MASS[Typ.] 0.5g w S B b1 S b D w S A AB S AB A ZD e e A N M L K J B E H G F E D ZE C B A Reference Symbol y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 11 12 13
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P-TFLGA145-10x10-0
PTLG0145JA-A
145F0E
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P-TFLGA56-0808-0
Abstract: No abstract text available
Text: P-TFLGA56-0808-0.80 5 Package material Lead finish Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.13 TYP. 2/Oct. 25, 2000
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P-TFLGA56-0808-0
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Untitled
Abstract: No abstract text available
Text: P-TFLGA48-0707-0.80 5 パッケージ材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 0.10 TYP. 2 版/01.06.20
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P-TFLGA48-0707-0
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PTLG0145KA-A
Abstract: P-TFLGA145-7x7-0
Text: JEITA Package Code P-TFLGA145-7x7-0.50 RENESAS Code PTLG0145KA-A Previous Code 145F0G MASS[Typ.] 0.1g w S B b1 D S AB b S AB w S A ZD A e e N M L K J E H G F E D C B y S x4 v Index mark Laser mark ZE A 1 2 3 4 5 6 7 8 9 10 11 12 13 Reference Symbol D E v
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P-TFLGA145-7x7-0
PTLG0145KA-A
145F0G
PTLG0145KA-A
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RX63N
Abstract: RX62N RX621 F5621 RX631 R5F56218 r5f52108 R5F56218ADFP R5f521 6108V
Text: R5 F 5 621 8 A D FP Renesas MCU ROM Type RX Family F: Flash S：ROM less Package, pin count and pin pitch *2 Function Code *1 Memory Code Product Group FL LFQFP 48 0.50 mm FK LQFP 64 0.80 mm FM LFQFP 64 0.50 mm FN LFQFP 80 0.50 mm FF LQFP 80 0.65 mm LD TFLGA
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RX210
RX220
RX610
RX621
RX62N
RX62T
RX62G
RX630
RX631
RX63N
F5621
R5F56218
r5f52108
R5F56218ADFP
R5f521
6108V
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Untitled
Abstract: No abstract text available
Text: P-TFLGA48-0707-0.80 5 パッケージ材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 0.12 TYP. 1 版/98.11.14
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P-TFLGA48-0707-0
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Untitled
Abstract: No abstract text available
Text: JEITA Packaqe Code P-TFLGA145-9x9-0.65 RENESAS Code PTLG0U5JB-A m N Previous Code - Zd H 3 O O Ô Ô O O Ô OOOOOO M ooooooi OOOOOO L o K 0 0 0 0 0 0 6 J H G o o o o o OOOOOO 0000 0000 0 0 0 0 0 D ooooooû 0000 0000 OOOOOO 0000000 OOOOOO 0 0 0 0 0 0 OOOOOO
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CIA11SSVW
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