MC100EL91
Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 E1651
Text: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION Normal operation of Integrated Circuits will cause electrical power, P, to be converted into heat by the die
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AND8072/D
MC100EL91
MC100EPT25
MC100LVEP16
MC10LVEP16
E1651
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MC100EL91
Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16
Text: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION Normal operation of Integrated Circuits will cause electrical power, P, to be converted into heat by the die
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AND8072/D
MC100EL91
MC100EPT25
MC100LVEP16
MC10LVEP16
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Test
Abstract: thermal analysis of heat sink WV-T220-101
Text: WV series Heat Sink Thermal Performance Analysis/Test Air Direction Options: 1 parallel with the fins (2) from side to side of the heat sink (3) perpendicular to device, from the front (4) perpendicular to device, from the back The Analyses/Tests below using Option (1) and (2) plus free convection (no forced air)
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O-247
Test
thermal analysis of heat sink
WV-T220-101
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TMS320
Abstract: TX75243
Text: TMS320 DSP Number 91 DESIGNER’S NOTEBOOK TMS320C6x Thermal Design Considerations Contributed by David Bell April 29, 1998 Design Problem Thermal analysis and heat sink selection for the TMS320C6x. Solution Like most high-performance processors, the ‘C6x dissipates some thermal energy during
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TMS320
TMS320C6x
TMS320C6x.
045A-17
TX75243
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Untitled
Abstract: No abstract text available
Text: Advanced Thermal Solutions, Inc. How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To
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aEPF4217
CPF4217
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thermal management
Abstract: MF251 SF4217 CPF2525
Text: How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To achieve a desired device temperature,
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Untitled
Abstract: No abstract text available
Text: THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 L m Abstract Comparative thermal tests have been carried out using
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Abstract: No abstract text available
Text: EFFECT OF OBSTRUCTION NEAR FAN INLET ON FAN HEAT SINK PERFORMANCE Vivek Khaire, Dr. Avijit Goswami Applied Thermal Technologies India 3rd Floor,C-Wing,Kapil Towers, Dr. Ambedkar Road, Pune- 411 001 Maharashtra, India. Ph- 91-20-56030625 Fax-91-20-56030626
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Fax-91-20-56030626
Pune-411
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opa541
Abstract: BUF634 OPA544 howland Source amplifier circuit using 6283 force piezo signal conditioning circuit for 4-20 OPA512 equivalent INA105 OPA27 OPA445
Text: Power Operational Amplifiers • Thermal Stability .4.4 • Frequency Stability .4.13 • Common Applications .4.23 Contributing Author: Robert Louis Watson 4.1 Why Power Op Amps • Source or Sink large > 100mA output
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100mA)
opa541
BUF634
OPA544
howland Source
amplifier circuit using 6283
force piezo signal conditioning circuit for 4-20
OPA512 equivalent
INA105
OPA27
OPA445
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Untitled
Abstract: No abstract text available
Text: OPTIMUM DESIGN AND SELECTION OF HEAT SINKS ‘, Seri Lee Aavid Engineering Inc. Laconia, New Hampshire 0 3 2 4 7 Abstract An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partiaHy confined configuration. Sample calculations are carried out, and parametric
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050232
Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050235
Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
Text: Xeon 5500 Series Blade High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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E5520
Abstract: LGA1366 E5530 E5506 heat pipes E5540
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050233
Abstract: E5504 Aavid thermalloy 9000 heat pipes intel E5520 E5530 LGA1366 x.25 intel E5506 aavid
Text: Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes, copper, and
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050075
Abstract: E5540 LGA1366 Intel Xeon 5500 l5520 heat pipes E5506 W3520 E5520 E5530
Text: Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and
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power supply schematic IC 2003
Abstract: SA 2003 ic 80 Hz crossover 106C 146C LM2679 thermal analysis of heat sink
Text: Power WEBENCH and Buck Regulator Design Part 3: Electrical and Thermal Analysis Jeff Perry 408 721-4545 [email protected] 5/2002 http://power.national.com Step 3A: Electrical Analysis WebSIM Schematic Tests available: -Steady state -Input line transient
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050234
Abstract: LGA1257 heat pipes
Text: Xeon 7500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 7500 SERIES PROCESSORS Aavid’s line of 7500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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Untitled
Abstract: No abstract text available
Text: ATS WHITE PAPER How the maxiGRIP Attachment System Impacts Component Mechanical Behavior How the maxiGRIP TM Attachment System Impacts Component Mechanical Behavior There is an increasing need for heat sink solutions to handle greater heat loads. The typical approach has been to design
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2850KT
Abstract: 2850MT 1200 RTV 1N5550 1N6515 2850FT RTV-615 scotchcast epoxy potting material diode with piv of 40v
Text: APPENDIX B Diode Thermal Analysis Controlling junction temperature is key to reliable semiconductor package design. High voltage diodes present unique junction temperature problems which must be addressed. In high voltage diodes, heat is generated primarily by:
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1N6515
1N5550
2850KT
2850MT
1200 RTV
1N5550
1N6515
2850FT
RTV-615
scotchcast epoxy
potting material
diode with piv of 40v
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TMS320C6x
Abstract: SPRA432 TMS320 case to board r3sa
Text: TMS320C6x Thermal Design Considerations APPLICATION REPORT: SPRA432 David Bell Digital Signal Processing Solutions April 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of
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TMS320C6x
SPRA432
045A-17
SPRA432
TMS320
case to board
r3sa
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elina fan
Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
Text: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of
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VSC870,
VSC880
AN-36
VSC870
VSC880
G53034-0,
elina fan
3dfx
heat sink for 304 point BGA
2319B
658-35AB
100C
G53034-0
192 BGA PACKAGE thermal resistance
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Untitled
Abstract: No abstract text available
Text: Germany USA D S D M S S France S D M Italy USA M S Engineering Innovation Since 1964 Shanghai D M S S D M India D Taiwan Dong Guan S Singapore M Manufacturing S Sales Offices D Design Centers Value Proposition Aavid Design offers creative and cost effective product design,
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32-PIN
Abstract: ADS-117 HS-24 TCA 290
Text: Application Note AN-8 ® Heat Sinks for Data Converters Design engineers constantly look for ways to reduce the effects of high operating temperatures in hybrid data converters Heat sinks provide a proven solution By Joe Coupal, DATEL, Inc. Electrical performance of high precision electronic components, such as hybrid type Data Converters, is very temperature sensitive. These devices generally operate much more
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thermal camera flir a20
Abstract: double sided pcb, thermal via thermal analysis on pcb double sided pcb FR4 double sided pcb 400LFM SP7655 SP7662 thermal camera 4-Layer PCB Layout Guideline
Text: Solved by APPLICATION NOTE ANP25 TM PowerBloxTM Thermal Analysis Introduction The primary factor limiting how much current a PowerBloxTM device can deliver is heat. Heat is generated by losses in the PowerBloxTM package and comes from four main sources: conduction Losses in the FETs, switching losses in the FETs and FET drivers, losses in the
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ANP25
SP7662
Jan15-07
ANP25:
thermal camera flir a20
double sided pcb, thermal via
thermal analysis on pcb
double sided pcb FR4
double sided pcb
400LFM
SP7655
thermal camera
4-Layer PCB Layout Guideline
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