D149
Abstract: D150 D2240 D257 D412 E595 IPC-TM650
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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A13512-00
T-FLEX600-0707
D149
D150
D2240
D257
D412
E595
IPC-TM650
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D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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D2240
Abstract: D257 E595
Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component
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A15955-00
D2240
D257
E595
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY
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E1269
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D149
Abstract: D150 D2240 D257 D374 D575 D792 2500S20-0 2500S20 KPA25
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
E1269
2500S20
D149
D150
D2240
D257
D374
D575
D792
2500S20-0
KPA25
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
E1269
D2240
2500S20
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bergquist
Abstract: 2500S2
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
2500S20
bergquist
2500S2
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
E1269
D2240
2500S20
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C351
Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures
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2000S40
C351
D149
D150
D2240
D257
D374
D575
D792
ASTM d792
ASTM D2240
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PDF
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very
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2000S40
2000S40
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D149
Abstract: D575 ASTM D5470 D150 D2240 D257 D374 D792 ASTM d792 astm D150
Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very
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2000S40
2000S40
D149
D575
ASTM D5470
D150
D2240
D257
D374
D792
ASTM d792
astm D150
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Untitled
Abstract: No abstract text available
Text: TflexTM HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR400
HR400â
A15958-00
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BERGQUIST
Abstract: 3000S30 conductivity
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures
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3000S30
3000S30
BERGQUIST
conductivity
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D575
Abstract: ASTM D575 D792 C351 D149 D150 D2240 D257 D374 Bergquist Company
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 • Thermal conductivity = 3.0 W/mK • Low S-Class thermal resistance at very low pressures • Conformable low hardness
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3000S30
D575
ASTM D575
D792
C351
D149
D150
D2240
D257
D374
Bergquist Company
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A15999-00
Abstract: D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR600 HR6120 HR-60
Text: Tflex HR600 Series TM Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR600
A15999-00
D2240
ASTM D5470
ASTM-D-257
HR610FG
D257
E595
HR6120
HR-60
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A16311
Abstract: XS460
Text: TflexTM XS400 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.0 W/mK Thermally Conductive Gap Filler Tflex XS400 is a compliant elastomer gap filler designed to provide moderate thermal performance. This soft interface pad conforms well with minimal pressure, resulting in little
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XS400
A16311-00
A16311
XS460
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ADHESIVE GAP PAD
Abstract: D575 D2240 D257 E595 low outgassing materials
Text: TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with
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ADHESIVE GAP PAD
D575
D2240
D257
E595
low outgassing materials
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D149
Abstract: D150 D2240 D257 D412 E595
Text: TflexTM 600 Series Thermal Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tflex 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a
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A13512-00
D149
D150
D2240
D257
D412
E595
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D149
Abstract: D150 D2240 D257 D412 E595 Outgassing
Text: T-flex 300 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 300 Series Thermal Gap Filler Features and Benefits: Unique silicone gel offers compliancy, thermal resistance • Extreme compliancy allows material to “totally blanket” component s
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50psi,
/m750
D149
D150
D2240
D257
D412
E595
Outgassing
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SoftFlex
Abstract: No abstract text available
Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides
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400mm
x8122
SoftFlex
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.7 W/m-K • High thermal performance, cost-effective solution • Un-reinforced construction for additional compliancy • Medium compliancy and conformability
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures • Highly conformable,“S-Class” softness
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3000S30
3000S30
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Untitled
Abstract: No abstract text available
Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE
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5000S35
5000S35
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conductivity meter circuit
Abstract: ASTM D5470 ASTM d792 ASTM D374 conductivity meter astm D150 ASTM D2240 ph meter circuit GP1500 D149
Text: Gap Pad 1500 Thermally Conductive, Unreinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Unreinforced construction for additional compliancy • Conformable, low hardness
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E1269
D2240
conductivity meter circuit
ASTM D5470
ASTM d792
ASTM D374
conductivity meter
astm D150
ASTM D2240
ph meter circuit
GP1500
D149
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