FR4 1.6mm substrate
Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2
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CLD-AP37
FR4 1.6mm substrate
Thermagon t-lam
CLD-AP25
Fabrication process steps mcpcb
FR-4 substrate 1.6mm
NEMA FR-4
led mcpcb large copper trace thermal
Thermagon
pcb fabrication process
kapton
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"exposed pad" PCB via
Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal
Text: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.
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im1573
"exposed pad" PCB via
"thermal via"
thermal pcb guidelines
AIC1573
copper thermal
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SCAA048
Abstract: LVP110 CDCLVP110 JESD51-7 SZZA013
Text: Application Report SCAA057 – August 2002 PCB Layout Guidelines for CDCLVP110 Gerhard Kaser High Performance Analog/CDC ABSTRACT This application note describes various electrical and thermal performance considerations for TI’s CDCLVP110. In addition, it provides recommendations for PCB layout as well as
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SCAA057
CDCLVP110
CDCLVP110.
CDVLP110
SCAA048
LVP110
CDCLVP110
JESD51-7
SZZA013
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asp10
Abstract: JD51 R01F
Text: ASP10 10W High Power Non-Inductive SMD Resistor A non-inductive surface mount resistor pack capable of dissipating 10 watts with the use of a suitable thermal pcb pad. With low thermal resistance in each axis, this is a unique SOIC resistor package • Power Dissipation
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ASP10
100ppm/
500Vdc
JD51
R01F
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IPC-A-6103
Abstract: 14 pin ic 7404 datasheet Amplifier ANSI/IPC-A-610 IPC-2221 IPC-SM-782 SLMA002 TPA032D04 class-d 555 PIC BASIC CIRCUIT
Text: Amplifiers: Audio Power Texas Instruments Incorporated PCB layout for the TPA005D1x and TPA032D0x Class-D APAs By Richard Palmer Application Specialist, Audio Amplifiers Following good, sensible printed circuit board PCB layout practices will ensure peak performance and reliability from Class-D audio power amplifiers. A good thermal
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TPA005D1x
TPA032D0x
SLYT182
IPC-A-6103
14 pin ic 7404 datasheet
Amplifier
ANSI/IPC-A-610
IPC-2221
IPC-SM-782
SLMA002
TPA032D04
class-d 555
PIC BASIC CIRCUIT
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tec driver peltier
Abstract: No abstract text available
Text: R Chapter 4 PCB Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages Thermal Data Printed Circuit Board Considerations Board Routability Guidelines
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FG256
FG456:
FF672,
FF896,
FF1152,
FF1517:
BF957:
FG456
FF672
tec driver peltier
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XC2VP4
Abstract: 2VP4-FG456 A 103 TRANSISTOR pinout 2VP20 FG256 BF957
Text: R Chapter 4 PCB Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages Thermal Data Printed Circuit Board Considerations Board Routability Guidelines
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FG256
FG456:
FF672,
FF896,
FF1152,
FF1517:
BF957:
UG012
XC2VP4
2VP4-FG456
A 103 TRANSISTOR pinout
2VP20
BF957
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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SAC305
Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board
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AN3778
SAC305
24 leads qfn 5x5
"thermal via"
PQFN-24
rf 4 mm PQFN
PQFN 8 leads
PQFN
SAC-305
AN3778
QFN PACKAGE Junction to PCB thermal resistance
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J-STD-005
Abstract: 1092-03A-5 62NCLR-A 292-06A-5 1092-04A-5 hakko AVX0402YG104ZAT2A SMA end launch for pcb 142-0761-841-A SN62 PB36 ag2 heat conductivity
Text: AMMP-XXXX Production Assembly Process Application Note 5386 Description Package Features This document describes and illustrates the attachment and detachment of Avago’s 5x5mm packaged products in a PCB soft board environment. The AMMP package has a solid copper filled cavity to allow optimum thermal transfer of the packaged device to the PCB and associated heat
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42-0761-891-A
DC-40GHz
092-04A-5
092-03A-5
DC-50GHz
492-03A-5
493-03A-5
AVX0402YG104ZAT2A
SMT-0805
08052F47SZ6BBOD
J-STD-005
1092-03A-5
62NCLR-A
292-06A-5
1092-04A-5
hakko
AVX0402YG104ZAT2A
SMA end launch for pcb
142-0761-841-A
SN62 PB36 ag2 heat conductivity
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12x12 bga thermal resistance
Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations
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UG002
CS144:
FG256,
FG456,
FG676:
FF896,
FF115XC2V40
CS144
XC2V40
FG256
12x12 bga thermal resistance
XC2V6000-ff1152
xc2v3000fg
XC2V3000-FG676
smd transistor J6 pin
XC2V3000-BG728
XC2V80
IO-L93N
UG002
Printed Circuit Boards PCB
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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Untitled
Abstract: No abstract text available
Text: Multiphase PWM Regulator for VR12 DDR Memory Systems ISL6353 Features The ISL6353 is a three-phase PWM buck regulator controller for VR12 DDR memory applications. The multi-phase implementation results in better system performance, superior thermal management, lower component cost and smaller PCB area.
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ISL6353
ISL6353
5m-1994.
MO-220WHHE-1
FN6897
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TB499
Abstract: No abstract text available
Text: Technical Brief 499 PCB Thermal Land Design for Ceramic Packages with Bottom Metal or Heat Sinks Introduction Certain Intersil ceramic packages include bottom metal or bottom heat sinks also called heat slugs . When present, these features will be noted on Intersil’s product datasheet
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61450K-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61450K-C1-R0
GR-63-Core
MIL-STD-810
MGT450
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61375R-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61375R-C1-R0
GR-63-Core
MIL-STD-810
MGT375
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61350K-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61350K-C1-R0
GR-63-Core
MIL-STD-810
MGT350
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61330W-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61330W-C1-R0
GR-63-Core
MIL-STD-810
MGT330
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61290R-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61290R-C1-R0
GR-63-Core
MIL-STD-810
MGT290
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61325K-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61325K-C1-R0
GR-63-Core
MIL-STD-810
MGT325
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61270W-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61270W-C1-R0
GR-63-Core
MIL-STD-810
MGT270
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61270K-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61270K-C1-R0
GR-63-Core
MIL-STD-810
MGT270
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61290D-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61290D-C1-R0
GR-63-Core
MIL-STD-810
MGT290
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Untitled
Abstract: No abstract text available
Text: ATS fanSINKTM with maxiGRIP Attachment ATS PART # ATS-61450W-C1-R0 Features & Benefits »» X-Cut straight fin heat sink fins offer omnidirectional air flow for optimum thermal performance independent of PCB lay-out »» Stainless steel screw fan attachment ensures dependable long-term
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ATS-61450W-C1-R0
GR-63-Core
MIL-STD-810
MGT450
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