thomas shear
Abstract: No abstract text available
Text: . I c c SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES SAMTEC CORPORATION APPROVED BY: THOMAS PEEL TEST PROGRAM MANAGER CONTECH RESEARCH, INC. E SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES
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NIS23
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thomas shear
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Revalpha
Abstract: Nitto* revalpha Nitto Denko Revalpha Revalpha NO.3195H etch uv tape and furukawa magnetron X-band microwave oven magnetron Mitsui chemicals X-band antenna
Text: Benefits and Challenges in Decreasing GaAs Through Substrate Via Size and Die Thickness Henry Hendriks, Allen Hanson, Thomas Lepkowski, Anthony Quaglietta, and Bharat Patel M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA Phone: 978 656-2562, Fax: (978) 656-2900, Email: [email protected]
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535 mcm cable
Abstract: TBM15PF MCM 535 AWG cable mcm 535 IBG20-40 TBM15 53218 53223M copper bus bar torque 21940
Text: Color-Keyed Cast Copper Connectors Code Copper Cables ® I Beam Ground Clamp I-beam ground clamp for connecting ground cable to I-beam, or any 1" max. structural steel member without welding or drilling. Breakaway bolt head shears at predetermined torque to
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IBG2-10
IBG20-40
53223M
535 mcm cable
TBM15PF
MCM 535 AWG
cable mcm 535
TBM15
53218
copper bus bar torque
21940
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TAG 8409
Abstract: ASTM d4066 ms3367 TC817 THOMAS BETTS TYZ528M TL075 MS3367-4-9 MS21266-2N MS3367-5-9 TYZ28M MS3367-6-0
Text: 412031.J01 TYRAP 3/12 3/14/03 11:15 AM Page 1 / Cable Fastening Systems Ty-Rap /Ty-Fast® Cable Tying System Overview .J2-J3 Ty-Rap® Cable Ties .J4-J8 Cable Ties for Special Environments .J9-J10
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J9-J10
J12-J13
J17-J19
TY910X
TY910-11
TY910-1
TY910-2
TY910-3
TY910-4
TY910-5
TAG 8409
ASTM d4066 ms3367
TC817
THOMAS BETTS TYZ528M
TL075
MS3367-4-9
MS21266-2N
MS3367-5-9
TYZ28M
MS3367-6-0
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amerductor
Abstract: amerductor wire UL 467 tables for grounding UL467 IEEE837 UL 467 96 GP114 blackburn cast bronze conduit hub NEC250 IEEE-837 TBM15I
Text: 412031.F01 BB 3/6 3/14/03 8:31 AM Page 83 Grounding Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . F84 E-Z Ground Grounding Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . F85 Grounding Connectors . . . . . . . . . . . . . . . . . . . . . F86
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F87-F93,
F95-F99
F101-F102,
F103-F105
F108-F114
amerductor
amerductor wire
UL 467 tables for grounding
UL467
IEEE837 UL 467 96
GP114
blackburn cast bronze conduit hub
NEC250
IEEE-837
TBM15I
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49055
Abstract: No abstract text available
Text: IDC Systems Reference Guide REFERENCE GUIDE I. THE MASS TERMINATION CONCEPT Insulation Displacement Contact IDC mass termination with flat cable/connector systems, first pioneered in the 1960’s, has evolved rapidly in recent years. Constantly pressed to meet increasing packaging
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raychem JOINT procedure KIT 11kv cable shrinkable
Abstract: 11kv raychem termination kit raychem heat shrink boots raychem 11KV CABLE JOINT KIT STS221 raychem silicone grease HSFR12-6-4 raychem JOINT KIT Heat-shrinkable 11KV PANDUIT corporation tie wrap raychem heat shrinkable joint procedure
Text: 412031.N01 SHRINK 3/5 3/14/03 10:52 AM Page 1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N2 Heavy Wall Heat Shrinkable Tubing . . . . . . . . . . . . . . . . . . . . . . . . . . . N3-N6 Heat Shrinkable End Caps . . . . . . . . . . . . . . . . N7
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N10-N13
N14-N19
UL486,
raychem JOINT procedure KIT 11kv cable shrinkable
11kv raychem termination kit
raychem heat shrink boots
raychem 11KV CABLE JOINT KIT
STS221
raychem silicone grease
HSFR12-6-4
raychem JOINT KIT Heat-shrinkable 11KV
PANDUIT corporation tie wrap
raychem heat shrinkable joint procedure
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Untitled
Abstract: No abstract text available
Text: 403030.05BB 3/11/02 3:42 PM Page 202 EZ Ground Compression Connectors MEETS IEEE 837 REQUIREMENTS I Beam Ground Clamp I-beam ground clamp for connecting ground cable to I-beam, or any 1" max. structural steel member without welding or drilling. Breakaway bolt head shears at predetermined torque to assure tight connection. Heavy duty compression lug provides excellent current carrying capabilities.
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TBM15I
IBG2-10
NEC250-81
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din 71550
Abstract: T3CG DIN 3021-3 DIN 3021-3 STANDARD 93051 5x4G transistor 5cw U80304 73021 ASTM d792
Text: 412031.QO1 TAYLOR 3/5 3/14/03 11:08 AM Page 1 Wiring Duct Wiring Duct and Accessories Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . Q2 Open Slot Flush Profile Duct . . . . . . . . . . . . . . . Q3 Vinyl Ducts Narrow Slot Flush Profile Duct . . . . . . . . . . . . Q4
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25X2HDG
25X3HDG
T1-1022G
T1-2222G
T1-1540G
T1-2230G
25X2HDW
T1-2222W
din 71550
T3CG
DIN 3021-3
DIN 3021-3 STANDARD
93051
5x4G
transistor 5cw
U80304
73021
ASTM d792
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NAF-0602
Abstract: WES-1334 MARKING CODE WM9 WD-26p WD-26P thomas and betts WCCP1-25S BP-0273 WC-125 D882 pm 75 WL185
Text: MEP S-2205/Technical Sec. M 28/09/99 15:44 Page 2 E-Z-Code Wire Marker System Applications for IS-SW 30 Software IS-SW 3.0 Windows Labeling System • • • • • The IS-SW 3.0 software offers the customer powerful technology allowing them to address their particular labeling needs quickly and efficiently. The
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S-2205/Technical
NAF-0602
WES-1334
MARKING CODE WM9
WD-26p
WD-26P thomas and betts
WCCP1-25S
BP-0273
WC-125
D882 pm 75
WL185
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MIL-STD-750
Abstract: CK6001 UPS835LE3 1038A UPS1040E3 plaskon thomas shear UPS840e3 SEC77 qualify
Text: SCO TT SD ALE DI VI SIO N MSC POWERMITE 3 Qualification Data Completion Date: July 7, 2005 Purpose: To qualify 1 Mfg Location (PSI Technologies) (2) New Molding Compound (CK6001) (3) Matte Sn Lead Finish Reliability test Test Method Conditions SS Rejects
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CK6001)
MIL-STD-750,
JESD22-A102-C
MSC/PCN-0002
UPS340e3
UPS835Le3
UPS360e3
UPS840e3
MIL-STD-750
CK6001
UPS835LE3
1038A
UPS1040E3
plaskon
thomas shear
UPS840e3
SEC77
qualify
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burndy Y35 crimping tool manual
Abstract: burndy Y35 operation manual burndy Y35 user manual burndy compression die index csa 26 burndy Y46 operation manual TBM14 TB cable lug catalogue FBC21-1 IEEE-837 15G126R
Text: Table of Contents Introduction Page 2-3 C-Taps* Page 4-5 Compression for Copper Ground Rod Tap Connectors Page 6 Compression Connectors for Steel Ground Rod Page 6 Structural Grounding Stud s - Type TBGS Page 7 Compression Ground Rod to Grid Connectors Page 8
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GG500-350
GG500-40250
GG500-500
GP2250-2
GP2250-4
GP250500-2
GP250500-4
GR1-202
GR12-202
GR12-202TP
burndy Y35 crimping tool manual
burndy Y35 operation manual
burndy Y35 user manual
burndy compression die index csa 26
burndy Y46 operation manual
TBM14
TB cable lug catalogue
FBC21-1
IEEE-837
15G126R
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TC225
Abstract: MS3368-1 ty 93021 c thomas betts 13640 belcor 593
Text: 8/18/05 3:24 PM Page 1 / Cable Fastening Systems Ty-Rap /Ty-Fast® Cable Tying System Overview . 2 - 3 Ty-Rap® Cable Ties. 4 - 8 Cable Ties for Special Environments. 9 - 10
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Lodestone
Abstract: No abstract text available
Text: 11 Antique Tattoo Machine This is a soft-hit, long-stroke shader. Antique coil-style tattoo irons are still popular, and modern craftsmen create artistic and functional handmade machines. 1 Holcomb & Hoke Butter-Kist Popcorn Machine, 1919 All electric model with
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m1847
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SnPb36Ag2
Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation
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2002/95/E
SnPb36Ag2
Lead Free reflow soldering profile BGA
Infineon diffusion solder
semiconductors cross reference
philips pb-free products
FeNi42
BGA Ball Crack
VSO56
BGA and QFP Package freescale
HTQFP100
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JFET siced
Abstract: SiC-JFET siced SiC jfet cascode SiC JFET cascode mosfet switching SiC-JFET* JFET siced SiC-JFET comparison modern power device concepts high normally off SiC-JFET cascode mosfet switching thermal perfomance SiC IGBT IGBT THEORY AND APPLICATIONS
Text: A comparison of modern power device concepts for high voltage applications: Field stop-IGBT, compensation devices and SiC devices G. Deboy, H. Hüsken, H. Mitlehner* and R. Rupp Infineon AG, P.O. Box 80 09 49, 81609 Munich, Germany *SICED Electronics Development, Paul-Gossenstr. 100, 91052 Erlangen, Germany
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JESD-26
Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing
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Copper Alloy C151
Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been
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"0.4mm" bga "ball collapse" height
Abstract: cga 624 ibm semi reflow temperature bga
Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the
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w/2116
"0.4mm" bga "ball collapse" height
cga 624
ibm semi
reflow temperature bga
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Copper Alloy C151
Abstract: C151 C194 c194 shear stress leadframe materials c151 lead frame C151 C194 "leadframe material" DIP
Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been developed for high-power integrated circuit industrial and automotive
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MS3367-2-9
Abstract: MS3367-5-9 MS3367-1-9 MS3367-4-9 Avery Dennison 08377 ms3367-2-0 SM4181 MS3367-7-9 ms3367-5-0 MS3368-5-9E
Text: F a s t e n e r D i v i s i o n Avery Dennison C able Tie Products F a s t e n e r D i v i s i o n Welcome to the Fastener Division of Avery Dennison, Ta b l e o f C o n t e n t s 4-5 Cable Tie Basics 6-7 Installation Tools a diversified Fortune 500 company. With sales offices in 24 countries and 200 manufacturing facilities, the company
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AD8488
Abstract: No abstract text available
Text: Reliability Handbook UG-311 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reliability Handbook INTRODUCTION Analog Devices, Inc., would like to thank its customers for making Analog Devices a leading supplier of high quality LSI, VLSI, and ULSI
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UG-311
UG10137-0-11/14
AD8488
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thomas and betts FIBER OPTIC connector
Abstract: thomas betts 609 ACTIVE duplex connector 92800 thomas betts FIBER OPTIC 93802-500
Text: Fiber Optic Plastic Optical Fiber Interconnect D e s c r i p t i o n A p p l ic a t io n Thomas & Betts Active Duplex Rber Optic Connector integrates the benefits of light-wave communications with the advantages of electrical interconnection. It is designed to permit fast, reliable self
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92208-TB
92208BC
thomas and betts FIBER OPTIC connector
thomas betts 609
ACTIVE duplex connector 92800
thomas betts FIBER OPTIC
93802-500
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8 pin ic base socket round pin type lead
Abstract: idc 50 pin data ribbon connector THOMAS AND BETTS HEADER IDC CONNECTOR thomas & betts 622 series idc female solid insulation materials used in transmission line
Text: ThomasiBetts IDC Systems Reference Guide REFERENCE GUIDE I. T he M a ss T er m inatio n C o n c ep t Insulation Displacement Contact IDC m a s s t e r m in a t io n w ith f la t cable/connector systems, first pioneered in the 1960's, has evolved rapidly in recent years. Constantly
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