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    TOP SIDE MARKING B2 Search Results

    TOP SIDE MARKING B2 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD2017FN Toshiba Electronic Devices & Storage Corporation Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD2015FN Toshiba Electronic Devices & Storage Corporation Intelligent power device (High side switch) / VDD=40 V / 8ch / SSOP30 Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1ZMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC MOSFET、Low-side: SiC SBD Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    ISL28022EVKIT1Z Renesas Electronics Corporation Bidirectional High-side and Low-side Digital Power Monitor Eval Kit Visit Renesas Electronics Corporation

    TOP SIDE MARKING B2 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    14.5M 1982

    Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
    Text: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL


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    20-Pin 300-Mil) 1020-ball 1152-ball 1704-ball 492-Ball 208-ball 25-ball 332-ball 100-pin 14.5M 1982 AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40 PDF

    d1684

    Abstract: 84-Pin QFN FCBGA304 1704B MachXO2 Family Lattice Semiconductor Package Diagrams 256-Ball fpBGA 132-ball 284-BA x45e2
    Text: Package Diagrams November 2012 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL


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    20-Pin 300-Mil) GS-003. d1684 84-Pin QFN FCBGA304 1704B MachXO2 Family Lattice Semiconductor Package Diagrams 256-Ball fpBGA 132-ball 284-BA x45e2 PDF

    Lattice Semiconductor Package Diagrams 256-Ball fpBGA

    Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
    Text: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL


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    20-Pin 300-Mil) 208-ball 25-ball 332-ball 100-pin 120-pin 128-pin 160-pin 208-pin Lattice Semiconductor Package Diagrams 256-Ball fpBGA LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304 PDF

    RR1220

    Abstract: diode marking b2 10R2
    Text: CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : RC000000 REVISION : B2 PAGE : 1 OF 10 0805 Series Thin Film Chip Resistor 1. Scope This specification applies to 1.25mm x 2.0mm 0805 size, fixed metal chip resistors rectangular type for use in electronic equipment.


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    RC000000 RR1220 25ppm/ 50ppm/ 100ppm/ RR1220 diode marking b2 10R2 PDF

    RS8M

    Abstract: 10R0 16P8R
    Text: CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : RT340000 REVISION : B2 PAGE : 1 OF 9 RS8MXXXXXX Resistor Network 1. Scope This specification applies to 1.6mm x 4.0mm 1606 size resistor network (16P8R) with 8 isolated resistor for use in electronic equipment.


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    RT340000 16P8R) 63mW/each RS8M 10R0 16P8R PDF

    RR0816

    Abstract: 10202C
    Text: CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : RB000000 REVISION : B2 PAGE : 1 OF 10 0603 Series Thin Film Chip Resistor 1. Scope This specification applies to 0.8mm x 1.6mm 0603 size, fixed metal chip resistors rectangular type for use in electronic equipment.


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    RB000000 RR0816 25ppm/ 50ppm/ 100ppm/ RR0816 10202C PDF

    computation screw for pcb

    Abstract: ntc 33 747 55218 ZM marking 32083
    Text: NTC A LUG.103 SERIE Vishay BCcomponents NTC Thermistors, Mini Lug Sensors FEATURES QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 °C 10 kΩ Tolerance on R25 - value ±3% B25/85 value 3984K Tolerance on B25/85 - value ± 0.5 % Maximum dissipation at 25 °C


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    B25/85 18-Jul-08 computation screw for pcb ntc 33 747 55218 ZM marking 32083 PDF

    RR0510

    Abstract: No abstract text available
    Text: CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : RA000000 REVISION : B2 PAGE : 1 OF 10 0402 Series Thin Film Chip Resistor 1. Scope This specification applies to 0.5mm x 1.0mm 0402 size, fixed metal chip resistors rectangular type for use in electronic equipment.


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    RA000000 RR0510 25ppm/ 100ppm/ PDF

    DPAK-5

    Abstract: On semiconductor date Code dpak 369AE DPAK5
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DPAK−5 TO−252, 5 LEAD CASE 369AE−01 ISSUE O DATE 14 OCT 2010 SCALE 1:1 C A E b2 A B c2 L3 Z D H DETAIL A 1 2 3 4 E2 5 c e b 0.12 TOP VIEW M SIDE VIEW C A B BOTTOM VIEW H C 0.10 C L L2 A1 L1 GUAGE PLANE DETAIL A


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    O-252, 369AE-01 369AE DPAK-5 On semiconductor date Code dpak 369AE DPAK5 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series A2000, LP2000 & CB2000 Single Row Terminal Blocks A20510807WR SPECIFICATIONS Rating: A2: 30A, 300V* LP2: 30A, 150V* CB2: 30A, 300V* Center Spacing: 0.375” or 3/8” 9.52mm Wire Range: #12-22 AWG CU Screw Size: #6-32 zinc-plated philslot LP202110


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    A2000, LP2000 CB2000 A20510807WR LP202110 E62622, A38/B38/F38 A38/B38 PDF

    HEP32

    Abstract: MC10EP32DR2G 5P J TRANSISTOR MARKING
    Text: MC10EP32, MC100EP32 3.3V / 5V ECL B2 Divider • 350 ps Typical Propagation Delay • Maximum Frequency > 4 GHz Typical Figure 3 • PECL Mode Operating Range: • VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V


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    MC10EP32, MC100EP32 MC10/100EP32 MC10EP32/D HEP32 MC10EP32DR2G 5P J TRANSISTOR MARKING PDF

    A1560

    Abstract: No abstract text available
    Text: MC10EP32, MC100EP32 3.3V / 5V ECL B2 Divider Description The MC10/100EP32 is an integrated B2 divider with differential CLK inputs. The VBB pin, an internally generated voltage supply, is available to this device only. For single−ended input conditions, the unused


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    MC10EP32, MC100EP32 MC10/100EP32 MC10EP32/D A1560 PDF

    KEP32

    Abstract: HEP32 HP32 MC100EP32 MC10EP32
    Text: MC10EP32, MC100EP32 3.3V / 5V ECL B2 Divider Description • 350 ps Typical Propagation Delay • Maximum Frequency > 4 GHz Typical Figure 3 • PECL Mode Operating Range: • MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 1 8 8 1 VCC = 3.0 V to 5.5 V with VEE = 0 V


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    MC10EP32, MC100EP32 KEP32 HEP32 506AA MC100 MC10EP32/D KEP32 HEP32 HP32 MC100EP32 MC10EP32 PDF

    KEP32

    Abstract: HEP32 HP32 MC100EP32 MC10EP32
    Text: MC10EP32, MC100EP32 3.3V / 5V ECL B2 Divider Description Features • 350 ps Typical Propagation Delay • Maximum Frequency > 4 GHz Typical Figure 3 • PECL Mode Operating Range: • http://onsemi.com MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751


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    MC10EP32, MC100EP32 KEP32 HEP32 506AA MC100 MC10EP32/D KEP32 HEP32 HP32 MC100EP32 MC10EP32 PDF

    DAT3 DIODE

    Abstract: N231 SD card footprint PCB 1458m
    Text: CM1423 Secure Digital SD Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six (6) Pifilters (C-R-C) and 2 channels of ESD protection. The


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    CM1423 12pF100 -12pF 20-bump, 000mm 458mm CM1423-01 CM1423-03 330mm DAT3 DIODE N231 SD card footprint PCB 1458m PDF

    N231

    Abstract: CM1423 CM1423-01CP CM1423-01CS CM1423-03CP CM1423-03CS micro SD card CARD PCB FOOTPRINT MICRO SD card footprint PCB D4 diode top mark
    Text: CM1423 Secure Digital SD Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The


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    CM1423 CM1423 12pF100-12pF. MIL-STD-883 CM1423-01 330mm CM1423-03 N231 CM1423-01CP CM1423-01CS CM1423-03CP CM1423-03CS micro SD card CARD PCB FOOTPRINT MICRO SD card footprint PCB D4 diode top mark PDF

    MICRO SD card footprint PCB

    Abstract: N231 DAT3 DIODE micro SD card CARD PCB FOOTPRINT CM1423-01CS CM1423-03CP CM1423-03CS CM1423 CM1423-01CP eutectic 157
    Text: CM1423 Secure Digital SD Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The


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    CM1423 CM1423 12pF100-12pF. MIL-STD-883 CM1423-01 330mm CM1423-03 MICRO SD card footprint PCB N231 DAT3 DIODE micro SD card CARD PCB FOOTPRINT CM1423-01CS CM1423-03CP CM1423-03CS CM1423-01CP eutectic 157 PDF

    C6B3

    Abstract: N231
    Text: CM1423 Secure Digital SD Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The


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    CM1423 12pF100 -12pF 20-bump, 000mm 458mm CM1423-01 CM1423-03 330mm C6B3 N231 PDF

    Untitled

    Abstract: No abstract text available
    Text: CM1423 Secure Digital SD Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The


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    CM1423 CM1423 CM1423â 12pF100â -12pF. MIL-STD-883 CM1423-01 330mm CM1423-03 PDF

    Untitled

    Abstract: No abstract text available
    Text: Si8650/51/52/55 L O W P O W E R F I V E - C HANNEL D IGITAL I SOLATOR Features          High-speed operation DC to 150 Mbps No start-up initialization required Wide Operating Supply Voltage 2.5–5.5 V Up to 5000 VRMS isolation


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    Si8650/51/52/55 60-year PDF

    pinout ac125

    Abstract: ACT125 ac125 pinout MC74AC125 MC74AC125D MC74AC125DR2 MC74AC125DT MC74AC125N MC74ACT125 MC74ACT125D
    Text: MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs • Outputs Source/Sink • ′ACT125 Has TTL Compatible Inputs VCC A2 B2 O2 A3 B3 O3 14 13 12 11 10 9 8 http://onsemi.com PDIP–14 N SUFFIX CASE 646 14 1 1 2 3 4 5 6 7 A0 B0 O0 A1 B1 O1 GND SO–14 D SUFFIX


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    MC74AC125, MC74ACT125 ACT125 MC74AC125N r14525 MC74AC125/D pinout ac125 ac125 pinout MC74AC125 MC74AC125D MC74AC125DR2 MC74AC125DT MC74AC125N MC74ACT125 MC74ACT125D PDF

    Untitled

    Abstract: No abstract text available
    Text: ± DOUBLE POLARIZING BACKPLANE MODULE ASSEMBLY PART NUMBER ASSIGNMENT 350 - X 3 XX - X X X SH C - 3 5 0 -5 3 0 5 -5 0 0 ZONE REV SCR NUMBER ALL A MRE0-7LKJ2N.VER01 SH2.B2 B DSMH-7TSJ9T.VER01 C MINIMUM PIN W IPE LENGTH. SEE DETAIL A 3 = 1.00 mm W IPE NOT TOOLED


    OCR Scan
    COLUMNS-------------------------05 VER01 C-350-5305-500 Q1132-350-5310-500 PDF

    D004 ic

    Abstract: xf070 12JC 208H
    Text: 1. Mechanical Dimensions: 2 . S ch e m atic: B °~ -o 6 °- -o 3 7°- -o 2 50- -0 4 1 Tape IC Side o ti Line Side ui 3. E l e c t r i c a l S p e c i f i c a t i o n s : @25°C A OCL: Pins 1 - 4 B2uH±10% @10KHz 0.1V, Tie Pins 2& 3 ^ > .9 0 Min \ G \ _ 0.46


    OCR Scan
    MIL-STD-202G, UL94V-D 102mm) 10KHz 100KHz 10KHz, 1500Vac 500VAC XF070 9-AD46S D004 ic 12JC 208H PDF

    Untitled

    Abstract: No abstract text available
    Text: ± DRW NO. SH 1 C-951-401A-500 REV ZONE SCR NUMBER A AASY-8HDRHQ.VER01 ALL SHT1; B2 B M S P E - 8 T V H F Z . V E R 0 1 OPEN L - S E R I E S B A C K P L A N E MODULE A S S E MB L Y P A R T NUMBER A S S I G N ME N T 951 - A 0 X X - X 0 X SHT1; D6 C SHT 1 C5


    OCR Scan
    C-951-401A-500 VER01 VER02 951-i01A PDF