32TQFP
Abstract: No abstract text available
Text: SK19XX Family 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Ordering Information Ord ering Cod e Package ID SK1900ATF 32-TQFP 5 x 5 mm SK1901ATF 32-TQFP 5 x 5 mm SK1902ATF 32-TQFP 5 x 5 mm SK1903ATF 32-TQFP 5 x 5 mm SK1904ATF 32-TQFP 5 x 5 mm SK1925ATF
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SK1900ATF
SK1901ATF
SK1902ATF
SK1903ATF
SK1904ATF
SK1925ATF
SK1926ATF
SK1927ATF
SK1928ATF
SK1929ATF
32TQFP
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TQP32
Abstract: No abstract text available
Text: SK19XX Family 1:9 Signal Distribution PRELIMINARY HIGH-PERFORMANCE PRODUCTS Ordering Information Ordering Code Package ID Temperature Range SK1900 32-TQFP 5 x 5 mm Commercial SK1901 32-TQFP 5 x 5 mm Commercial SK1902 32-TQFP 5 x 5 mm Commercial SK1903 32-TQFP
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SK19XX
SK1900
SK1901
SK1902
SK1903
SK1904
SK1925
SK1926
SK1927
SK1928
TQP32
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Untitled
Abstract: No abstract text available
Text: SL6619 Direct Conversion FSK Data Receiver Data Sheet August 2005 Ordering Information SL6619/KG/TP1N 32 Pin TQFP SL6619/KG/TP1Q 32 Pin TQFP SL6619/KG/TP2Q 32 Pin TQFP* SL6619/KG/TP2N 32 Pin TQFP* The SL6619 is an advanced Direct Conversion FSK Data Receiver for operation up to 450 MHz. The device integrates all
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SL6619
SL6619
SL6619/KG/TP1N
SL6619/KG/TP1Q
SL6619/KG/TP2Q
SL6619/KG/TP2N
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LQFP
Abstract: No abstract text available
Text: Case Dimension Cross-Reference Tables Table 1. Clock Generators Device Table 3. Zero–Delay Buffers Package Case Number Page Package Case Number Page MPC930 32 TQFP 873A 638 MPC953 32 LQFP 873A 638 MPC931 32 TQFP 873A 638 MPC954 24 TSSOP 948H 640 MPC9315
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MPC930
MPC931
MPC9315
MPC932
MPC9350
MPC9351
MPC9352
MPC950
MPC951
MPC952
LQFP
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Untitled
Abstract: No abstract text available
Text: 19-2829; Rev 1; 7/03 Anything-to-LVDS Dual 2 x 2 Crosspoint Switches Ordering Information TEMP RANGE PIN-PACKAGE MAX9390EHJ PART -40°C to +85°C 32 TQFP MAX9390ETJ* -40°C to +85°C 32 Thin QFN MAX9391EHJ -40°C to +85°C 32 TQFP MAX9391ETJ* -40°C to +85°C
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MAX9390EHJ
MAX9390ETJ*
MAX9391EHJ
MAX9391ETJ*
TIA/EIA-644
MAX9390/MAX9391
32-pin
5x5x01
MAX9390/MAX9391
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Untitled
Abstract: No abstract text available
Text: PA-H8/338- T 80 Data Sheet 80 pin QFP(TQFP) socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Parts & Part Numbers These adapters allow EPROM programming of Hitachi H8/337 and H8/338 devices in their QFP or TQFP packages on 32 pin DIP programmers.
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PA-H8/338-
socket/32
H8/337
H8/338
H8/337,
H8/338
PA-H8/338-80
PA-H8/338-T80
80QG-02A
80QJ-808
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ADV0406
Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
Text: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold
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ADV0406
ADV0406
TQFP 32 PACKAGE
altera TQFP 32 PACKAGE
MS-026
MS-026 TQFP
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MAX3877
Abstract: MAX3877EHJ MAX3878 MAX3878EHJ
Text: 19-2062; Rev 0; 5/01 2.5Gbps, +3.3V Clock and Data Retiming ICs with Vertical Threshold Adjust Ordering Information TEMP. RANGE PIN-PACKAGE MAX3877EHJ PART -40°C to +85°C 32 TQFP-EP* MAX3877E/D* -40°C to +85°C DICE* MAX3878EHJ -40°C to +85°C 32 TQFP-EP*
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MAX3877EHJ
MAX3877E/D*
MAX3878EHJ
MAX3878E/D*
MAX3877/MAX3878
MAX3877
MAX3877EHJ
MAX3878
MAX3878EHJ
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Untitled
Abstract: No abstract text available
Text: 19-2062; Rev 0; 5/01 2.5Gbps, +3.3V Clock and Data Retiming ICs with Vertical Threshold Adjust Ordering Information TEMP. RANGE PIN-PACKAGE MAX3877EHJ PART -40°C to +85°C 32 TQFP-EP* MAX3877E/D* -40°C to +85°C DICE* MAX3878EHJ -40°C to +85°C 32 TQFP-EP*
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MAX3877/MAX3878
488Gbps
155MHz
MAX3877/MAX3878
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32-lead TQFP
Abstract: No abstract text available
Text: PACKAGE INFORMATION Micrel 32 LEAD TQFP DIE UP (T32-1) Rev. 01 Rev.: C 1 Amendment: 0 Issue Date: July, 1999
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T32-1)
32-lead TQFP
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W10625
Abstract: No abstract text available
Text: 1.6 in 32 pin TQFP to 28 pin DIP 0.22 in 0.5 in 0.1 in Part Number W10625 Top Package TQFP Top Pitch 0.8mm Bottom Package DIP Bottom Pitch 7.62mm 0.3" Top Pins 32 Bottom Pins 28 Programming Adapter: Supported Devices ATtiny28 - TQFP32 1.4 in 0.3 in All information contained in this document remains the interllectual property of Winslow Adaptics
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W10625
ATtiny28
TQFP32
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H321
Abstract: H32-1
Text: PACKAGE INFORMATION Micrel 32 LEAD EPAD-TQFP DIE UP (H32-1) Rev. 01 Rev.: A 1 Amendment: 0 Issue Date: February 2000
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H32-1)
H321
H32-1
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ATF-13136-TR1
Abstract: transistor tag 306 MARK A1 SOT-143 sot-23 6121 ATF13136-TR1 Amplifier Micro-X "marking code" D
Text: Tape and Reel Packaging for Semiconductor Devices Package Outlines 05, 08A, 36, 76, 84, 86, MSOP-3, SOIC-8, SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, SSOP-16, TQFP-32, and TQFP-48 Technical Data Description Related Standard This data sheet is intended to
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OT-23,
OT-143,
OT-323,
OT-343,
OT-363,
SSOP-16,
TQFP-32,
TQFP-48
RS481,
OT-143
ATF-13136-TR1
transistor tag 306
MARK A1 SOT-143
sot-23 6121
ATF13136-TR1
Amplifier Micro-X "marking code" D
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ATF-13136-TR1
Abstract: ATF13136 atf-13136 HPMX-5001 SSOP-16 TQFP-48 On semiconductor date Code sot-143 micro-x marking code E1 transistor tag 306
Text: Tape and Reel Packaging for Semiconductor Devices Package Outlines 05, 08A, 36, 76, 84, 86, MSOP-3, SOIC-8, SOT-23, SOT-143, SOT-323, SOT-363, SSOP-16, TQFP-32, and TQFP-48 Technical Data Description Related Standard This data sheet is intended to cover standards on tape and reel
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OT-23,
OT-143,
OT-323,
OT-363,
SSOP-16,
TQFP-32,
TQFP-48
RS481,
OT-143
ATF-13136-TR1
ATF-13136-TR1
ATF13136
atf-13136
HPMX-5001
SSOP-16
TQFP-48
On semiconductor date Code sot-143
micro-x marking code E1
transistor tag 306
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Untitled
Abstract: No abstract text available
Text: GS84018/32/36AGT/B*-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and
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GS84018/32/36AGT/B
GS84018/32/36A
840xxA
84018A
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LA-3A70B-1
Abstract: No abstract text available
Text: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 A A' 137.5±0.5 180±1.0 21.25±0.5 27.5±0.1 32±0.1 16.4 NEC LA–3A70B–1 HEAT PROOF 16.4 <SECTION A - A'> 16.4 5.8 6.8 8.8 13.0 Applied Package 100 pin Plastic TQFP Fine Pitch (1.0 mm thick) 120 pin Plastic TQFP (Fine Pitch)(1.0 mm thick)
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3A70B
LA-3A70B-1
SSD-A-H5617-1
LA-3A70B-1
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Untitled
Abstract: No abstract text available
Text: MAX5631/MAX5632/ MAX5633 16-Bit DACs with 32-Channel Sample-and-Hold Outputs General Description Ordering Information PART TEMP RANGE* MAX5631UCB+D 0°C to +85°C 64 TQFP MAX5631UTK+ 0°C to +85°C 68 TQFN-EP* 0°C to +85°C 64 TQFP MAX5632UTK+ 0°C to +85°C
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MAX5631/MAX5632/
MAX5633
16-Bit
32-Channel
MAX5631UCB
MAX5631UTK+
MAX5632UCB
MAX5632UTK+
MAX5633UCB
MAX5633UTK+
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LA-3A70B-1
Abstract: TQFP
Text: UNIT : mm 335±1.0 23.5±0.5 288±0.5 A A' 137.5±0.5 180±1.0 21.25±0.5 27.5±0.1 32±0.1 16.4 NEC LA–3A70B–1 HEAT PROOF 16.4 <SECTION A - A'> 16.4 5.8 6.8 8.8 13.0 Applied Package 100 pin Plastic TQFP Fine Pitch (1.0 mm thick) 120 pin Plastic TQFP (Fine Pitch)(1.0 mm thick)
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3A70B
LA-3A70B-1
LA-3A70B-1
TQFP
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HPMX-5001
Abstract: HPMX-3002 HPMX-3003 HPMX-5002 SSOP-28 TQFP-48 PA 3002
Text: Multi-Function RFICs Part Number Description Package Vcc V Ic (mA) Page No. HPMX-3002 HPMX-3003 HPMX-5001 HPMX-5002 SO-8 SSOP-28 TQFP-32 TQFP-48 6 3 3 3 160 5 / - / 450 39, 60 21 6-76 7-82 7-90 7-105 900 MHz integrated driver amplifier 1.5 - 2.5 GHz LNA / switch / PA
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HPMX-3002
HPMX-3003
HPMX-5001
HPMX-5002
SSOP-28
TQFP-32
TQFP-48
HPMX-5001
HPMX-3002
HPMX-3003
HPMX-5002
SSOP-28
TQFP-48
PA 3002
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tqfp 7x7
Abstract: W502 thermal conductivity
Text: Thermal Data TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C die attach silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C Frame options :
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063W/cm
tqfp 7x7
W502
thermal conductivity
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Untitled
Abstract: No abstract text available
Text: 19-2078; Rev 1; 2/02 1:10 Differential LVPECL/LVECL/HSTL Clock and Data Drivers Both devices are offered in space-saving, 32-pin 5mm ✕ 5mm TQFP, 5mm x 5mm QFN, and industry-standard 32-pin 7mm x 7mm LQFP packages. Applications Precision Clock Distribution
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MAX9311/MAX9313
1-to-10
5x5x01
MAX9311/MAX9313
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MAX9420
Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ QFN50
Text: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features
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MAX9420
MAX9423
32-pin
32-lead
500mV
336ps
MAX9421/MAX9423)
MAX9422/MAX9423)
MAX9420EHJ
MAX9421EHJ
MAX9420EHJ
MAX9421
MAX9421EHJ
MAX9422
MAX9422EHJ
MAX9423EHJ
QFN50
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mo135
Abstract: MO-135
Text: Revised January 1999 Package VBE032 32-Lead Thin Quad Flat Package TQFP , JEDEC MO-135, 7mm Square Package Number VBE032 1999 Fairchild Semiconductor Corporation vbe032.prf www.fairchildsemi.com Package VBE032 January 1999
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VBE032
32-Lead
MO-135,
vbe032
mo135
MO-135
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Untitled
Abstract: No abstract text available
Text: MAX5631/MAX5632/ MAX5633 16-Bit DACs with 32-Channel Sample-and-Hold Outputs General Description PART TEMP RANGE* MAX5631UCB+D 0°C to +85°C 64 TQFP MAX5631UTK+ 0°C to +85°C 68 TQFN-EP* 0°C to +85°C 64 TQFP MAX5632UTK+ 0°C to +85°C 68 TQFN-EP* MAX5633UCB+D
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MAX5631/MAX5632/
MAX5633
16-Bit
32-Channel
MAX5631/MAX5632/MAX5633
100kHz
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