tqfp 44 thermal resistance
Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
Text: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.
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transistors BC 458
Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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ep600i
Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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EP20K100E
Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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49-pin
169-pin
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K300E
EP20K60E
EP20K100
0245 TQFP-208
208RQFP
280-PGA
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ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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100 PIN "PGA" ALTERA DIMENSION
Abstract: No abstract text available
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
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7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
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144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
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tqfp 44 thermal resistance datasheet
Abstract: plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance
Text: THERMAL MANAGEMENT Semiconductor devices dissipate heat while operating. Device junction temperature is a function of : 1 the amount of power dissipated in the circuit, and (2) the net thermal resistance between the heat source and a reference point such as the surrounding ambient of still air. It has been well
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200LFM
tqfp 44 thermal resistance datasheet
plcc junction to ambient resistance
EPAD-TQFP-64
tqfp 64 thermal resistance
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JESD51-8
Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.
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BR1568/D
JESD51-8
JESD51-2
JEDEC JESD51-8
qfn 44 PACKAGE footprint 9mm
surface mount package dimensions
FREESCALE PACKING
jesd51 8
JEDEC-STD-020
JEDEC-STD020
tqfp 44 PACKAGE footprint
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Untitled
Abstract: No abstract text available
Text: Preliminary GS880F18/36T-10/11/11.5/12/14 100 Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features • Flow through mode operation. • 3.3V +10%/-5% Core power supply. • 2.5V or 3.3V I/O supply. • LBO pin for linear or interleaved burst mode.
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GS880F18/36T-10/11/11
100-lead
GS880F18/36T1
K880F18/36T1
1/2000L
GS880F1836T
1/2000L;
3/2000N
-10Mhz
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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Abstract: No abstract text available
Text: Preliminary GS8150F18/32/36T-7/8/8.5/10/11 1M x 18, 512K x 32, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • Flow Through mode operation; Pin 14 = No Connect • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply
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GS8150F18/32/36T-7/8/8
100-Pin
100-lead
8150F18
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Untitled
Abstract: No abstract text available
Text: 3.3V 1:22 HIGH-PERFORMANCE, LOW VOLTAGE BUS CLOCK DRIVER Precision Edge SY89824L FINAL FEATURES • 3.3V core supply, 1.8V output supply for reduced power Precision Edge™ ■ LVPECL and HSTL inputs ■ 22 differential HSTL low-voltage swing output pairs
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SY89824L
SY89824L
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100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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Untitled
Abstract: No abstract text available
Text: Preliminary GS816018/32/36T-225/200/180/166/150/133 1M x 18, 512K x 32, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation
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GS816018/32/36T-225/200/180/166/150/133
100-Pin
GS18/362
2/2000E;
815xxx
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Untitled
Abstract: No abstract text available
Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus
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AT40K
AT94K
XC3000TM,
XC4000TM,
XC5200TM,
MPA1000
20-lead
44-lead
44-contained
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GS8150E18T-225
Abstract: 36T22
Text: Preliminary GS8150E18/32/36T-225/200/180/166/150/133 1M x 18, 512K x 32, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation
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GS8150E18/32/36T-225/200/180/166/150/133
100-Pin
100-lead
8150E18
GS8150E18T-225
36T22
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MAX9316
Abstract: MAX9322 MAX9322ECY MAX9322ETK 36CW
Text: 19-2544; Rev 1; 12/02 LVECL/LVPECL 1:15 Differential Divide-by-1/Divide-by-2 Clock Driver The MAX9322 low-skew 1:15 differential clock driver reproduces or divides one of two differential input clocks at 15 differential outputs. An input multiplexer selects from
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MAX9322
MAX9322
MAX9316
MAX9322ECY
MAX9322ETK
36CW
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Untitled
Abstract: No abstract text available
Text: Preliminary GS880E18/32/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 8Mb Sync Burst SRAMs 100 MHz–66 MHz 3.3 V VDD 3.3 V and 2.5 V I/O Features Flow Through / Pipeline Reads • FT pin for user-configurable flow through or pipelined operation
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GS880E18/32/36T-11/11
100-Pin
80Mhz
GS880E18/32/36T1
3/2000N;
3/2000O;
9/1999I
1999K880E18/32/36T1
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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Infrared Touch Control cooker
Abstract: HMCS404 HD4074224 hmcs42 HD404449 Series
Text: R e liab ility Test D a ta of M icro co m p u te r 1. Introduction M icrocomputers are required to provide higher reliability and quality with increasing functions for an enlarged scale for wide applications. To meet this demand, Hitachi is improving the quality by
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