Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TQFP SHIPPING TRAYS Search Results

    TQFP SHIPPING TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UE36C1620005011 Amphenol Communications Solutions 1x1 QSFP-DD cage with the clip ship loose, no heat sink Visit Amphenol Communications Solutions
    10067847-001TLF Amphenol Communications Solutions 10067847-001TLF-SD CARD TRAY PACKAGING Visit Amphenol Communications Solutions
    U77A11282001 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A11282021 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A61142001 Amphenol Communications Solutions SFP 1X6 CAGE NI TRAY Visit Amphenol Communications Solutions

    TQFP SHIPPING TRAYS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    IC51-0804-394

    Abstract: yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP
    Text: FIFO Surface-Mount Package Information First-In, First-Out Technology Tom Jackson and Mary Helmick Advanced System Logic – Semiconductor Group SSPA001A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		SSPA001A IC51-0804-394 yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP PDF

    ipc-sm-786A

    Abstract: Yamaichi IC51-0804-808 Yamaichi TQFP yamaichi IC51-0562-1387 IC51-0644-807 Enplas drawings IC51-0562 socket IC51-0644-807 Datasheet Yamaichi TQFP 120 DIMENSIONS PQFP 132
    Text: Medium-Pin-Count Surface-Mount Package Information First-In, First-Out FIFO Technology SSPA001B February 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		SSPA001B 44-pin 56-pin IC51-0562-1387 64-pin IC51-0644-807 68-pin IC51-0684-390 80-pin IC51-0804-394 ipc-sm-786A Yamaichi IC51-0804-808 Yamaichi TQFP yamaichi IC51-0562-1387 IC51-0644-807 Enplas drawings IC51-0562 socket IC51-0644-807 Datasheet Yamaichi TQFP 120 DIMENSIONS PQFP 132 PDF

    tqfp 7x7 tray

    Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
    Text: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1


    OCR Scan     		A40553. A40626. tqfp 7x7 tray DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10 PDF

    TQFP Shipping Trays

    Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
    Text: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity


    Original     		PB1084 1-888-ISP-PLDS TQFP Shipping Trays LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel PDF

    TQFP Shipping Trays

    Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
    Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will


    Original     		PB1083 1-888-ISP-PLDS TQFP Shipping Trays MQFP Shipping Trays PB1083 Lattice PLSI PDF

    28 TSSOP JEDEC Thin Matrix Tray outlines

    Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		0637D 09/99/xM 28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x PDF

    texas instruments packing label

    Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
    Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make


    Original     		7150M CDC582 CDC586 CDC2582 CDC2586 SN250056 SN74ACT2235-XX SN74ACT7807-XX SN74ACT7808-XX SN10067 texas instruments packing label SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64 PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP PDF

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    sandisk flash controller

    Abstract: SANDISK flash ID code sandisk date code X32C 08051C103KATMA sandisk flash chipset Sandisk Flash memory SanDisk controller qualitek "Humidity Indicator Card"
    Text: Flash ChipSet Product Manual 13.0 Flash ChipSet Manufacturabiltv Specifications 13.1 H ow the Flash ChipSet LCC is Received The Flash ChipSet LCC is shipped in packages that each contain 360 pieces in 4 trays with 90 pieces in each tray. The LCC trays are dry packed and vacuum sealed with a desiccant in a moisture barrier bag.


    OCR Scan     		60pSet. RB471E 60Hz1 sandisk flash controller SANDISK flash ID code sandisk date code X32C 08051C103KATMA sandisk flash chipset Sandisk Flash memory SanDisk controller qualitek "Humidity Indicator Card" PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    MOTOROLA TOP MARK

    Abstract: L002
    Text: Pin-out and Package PQFP Top View Pin-out and Package Information 18 Orientation Mark chamfered edge (Top View) 51 84 GNDD D21 D20 VCCD D19 D18 GNDD D17 D16 D15 D14 GNDD D13 D12 VCCD D11 D10 GNDD GNDQ VCCQ D9 D8 D7 D6 GNDD D5 D4 VCCD D3 D2 GNDD D1 D0 DR


    Original     		132-pin DSP56002/L002 MOTOROLA TOP MARK L002 PDF

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		3027b 56mm carrier tape 28 pin ic TM 1628 PDF

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A PDF

    SZZA002

    Abstract: 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91
    Text: Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits SZZA002 April 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		SZZA002 B827-92, B825-92, B810-91, ANSI/EIA-638, SZZA002 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91 PDF

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray PDF