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    TRAY 12X12 Search Results

    TRAY 12X12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    TRAY 12X12 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC FBGA

    Abstract: FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray
    Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 135.9 PPE 12.30 7 A' 135°C MAX. 16.40 10.55 FBGA12×12ESP-1 A 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.29) (6.35) 7.62 12.30 12.00 Applied Package Quantity (pcs) FBGA 12×12ESP-1 Tray 121-pin Plastic FBGA (12×12)


    Original     		PDF FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 209-pin 337-pin 397-pin JEDEC FBGA FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray

    JEDEC FBGA

    Abstract: fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray
    Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 12.30 7 135°C MAX. A' 12.30 15.50 10.25 294.5 315.0 322.6 Section A – A' (6.29) 12.30 12.00 (6.35) 7.62 16.40 FBGA12×12ESP-1 10.55 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 12×12 ESP-1 121-pin Plastic FBGA (12×12)


    Original     		PDF FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 204-pin 209-pin 337-pin 397-pin JEDEC FBGA fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray

    FBGA 12x12 TRAY

    Abstract: nec 1230 JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x20=160 135°C MAX. 16.40 A' 12.30 114.8 FBGA12×12B 10.55 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.35) (6.29) 12.30 12.00 7.62 135.9 PPE A Applied Package 209-pin Plastic FBGA (12×12) Quantity (pcs) 160 MAX. FBGA 12×12B


    Original     		PDF FBGA12 209-pin SSD-A-H7722-1 FBGA 12x12 TRAY nec 1230 JEDEC TRAY DIMENSIONS FBGA

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard TQFP JEDEC tray JEDEC tray standard TQFP TRAY DIMENSIONS TRAY CONTAINER tray container dimensions TQFP 100 PACKAGE TQFP 80 PACKAGE TRAY DIMENSIONS TQFP 64
    Text: TRAY CONTAINER 7 A' 14.7 17.90 14.30 14.7 135 °C MAX. 18.00 13.95 TOFP12x12×1.0 A NEC 108.0 135.9 PPE 7×17=119 UNIT : mm 286.4 315.0 322.6 SECTION A – A' 14.70 Applied Package 6.22 (6.35) 7.62 12.00 Quantity (pcs) 64-pin Plastic TQFP(1.0mm thick) 80-pin Plastic TQFP(1.0mm thick)


    Original     		PDF OFP12 80-pin 100-pin 64-pin SSD-A-H6567-1 JEDEC TRAY DIMENSIONS JEDEC tray standard TQFP JEDEC tray JEDEC tray standard TQFP TRAY DIMENSIONS TRAY CONTAINER tray container dimensions TQFP 100 PACKAGE TQFP 80 PACKAGE TRAY DIMENSIONS TQFP 64

    LQFP Package tray

    Abstract: JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)


    Original     		PDF LQFP12 64-pin 80-pin SSD-A-H7503 LQFP Package tray JEDEC TRAY DIMENSIONS

    b 0409 h

    Abstract: No abstract text available
    Text: Packing Name Mounting Pad JEDEC Tray PBGA 12x12 116 pin FBGA 12 × 12 A W S B B B 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D N M L K J H G F E D C B A P Index mark Q W S A J I R H S K S F E φM L M G S A B NOTES 1. Controlling dimension millimeter. 2. Each ball centerline is located within φ 0.08 mm (φ 0.003 inch) of


    Original     		PDF P116S1-YJC b 0409 h

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    Untitled

    Abstract: No abstract text available
    Text: VND5004B-E VND5004BSP30-E Double 4mΩ high-side driver with analog current sense for automotive applications Datasheet - production data PQFN 12x12 Power lead-less MultiPowerSO-30 Features Parameters Symbol Value Max transient supply voltage VCC 41 V Operating voltage range


    Original     		PDF VND5004B-E VND5004BSP30-E 12x12 MultiPowerSO-30 DocID15702

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    Untitled

    Abstract: No abstract text available
    Text: VND5E004A-E VND5E004ASP30-E Double 4mΩ high-side driver with analog current sense for automotive applications Datasheet - production data PQFN - 12x12 Power lead-less – Overtemperature shutdown with auto restart thermal shutdown – Inrush current active management by


    Original     		PDF VND5E004A-E VND5E004ASP30-E 12x12 MultiPowerSO-30 DocID17359

    K9F2G08U0C

    Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
    Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


    Original     		PDF BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0

    pin configuration of IC 1619

    Abstract: pin diagram for IC 1619 30 pin PEAK tray drawing dmc touch screen
    Text: Analog Resistive Touch Screen Controller TSC-30/IC product specification TSC-30/IC Product Specification Table of Contents 1. Products outline . 2


    Original     		PDF TSC-30/IC DER-S0052A pin configuration of IC 1619 pin diagram for IC 1619 30 pin PEAK tray drawing dmc touch screen

    K9HDG08U1A

    Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
    Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original     		PDF BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		PDF SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


    Original     		PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    color filter photodiode

    Abstract: Photodiode as light sensor tray 12X12 green light photodiode sensor
    Text: HDJD-S831-QT000 Color Sensor Module Data Sheet Description Avago Color Sensor is a high performance, small in size, cost effective light to voltage converting sensor. The sensor combines a photodiode array and three trans-impedance amplifiers in a single monolithic


    Original     		PDF HDJD-S831-QT000 QFN-16, 5989-2179EN 5989-3617EN color filter photodiode Photodiode as light sensor tray 12X12 green light photodiode sensor

    PHOTODIODE 4 CHANNEL ARRAY

    Abstract: No abstract text available
    Text: Agilent HDJD-S831-QT000 Color Sensor Module Data Sheet Description Agilent Color Sensor is a high performance, small in size, cost effective light to voltage converting sensor. The sensor combines a photodiode array and three trans-impedance amplifiers in a single monolithic


    Original     		PDF HDJD-S831-QT000 QFN-16, 5989-2179EN PHOTODIODE 4 CHANNEL ARRAY

    K4X2G323PD8GD8

    Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
    Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from


    Original     		PDF BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03

    VND5004B-E

    Abstract: VND5004B VND5004BSP30TR-E VND5004BSP30-E vnd5004bsp 12X12 12X12 pqfn 12X12 pqfn TRAY CDM-AEC-Q100-011 ISO7637
    Text: VND5004B-E VND5004BSP30-E Double 4mΩ high side driver with analog current sense for automotive applications Features Parameters Symbol Value Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Max on-state resistance RON 4 mΩ Current limitation typ


    Original     		PDF VND5004B-E VND5004BSP30-E 12x12 MultiPowerSO-30 VND5004B-E VND5004B VND5004BSP30TR-E VND5004BSP30-E vnd5004bsp 12X12 pqfn 12X12 pqfn TRAY CDM-AEC-Q100-011 ISO7637

    Untitled

    Abstract: No abstract text available
    Text: VND5004B-E VND5004BSP30-E Double 4mΩ high side driver with analog current sense for automotive applications Features Parameters Symbol Value Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Max on-state resistance RON 4 mΩ


    Original     		PDF VND5004B-E VND5004BSP30-E 12x12 MultiPowerSO-30

    Untitled

    Abstract: No abstract text available
    Text: VND5004B-E VND5004BSP30-E Double 4mΩ high side driver with analog current sense for automotive applications Features Parameters Symbol Value Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Max on-state resistance RON 4 mΩ Current limitation typ


    Original     		PDF VND5004B-E VND5004BSP30-E 12x12 MultiPowerSO-30