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    TSOP 48 STACKED DIE PACKAGE Search Results

    TSOP 48 STACKED DIE PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 48 STACKED DIE PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    48-PIN

    Abstract: LRS1338A 1338a2
    Text: LRS1338A Data Sheet Stacked Chip 8M Flash Memory and 2M SRAM FEATURES PIN CONFIGURATION • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP TSOP48-P-1014 plastic package 48-PIN TSOP TOP VIEW S-A16/F-A15 1 48 S-A17/F-A16 S-A15/F-A14


    Original     		LRS1338A 48-pin TSOP48-P-1014) S-A16/F-A15 S-A17/F-A16 S-A15/F-A14 I/O15 S-A14/F-A13 S-A13/F-A12 LRS1338A 1338a2 PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024 PDF

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH-DENSITY PACKAGE • TCP/COB/CSP/STACKED PACKAGE igh density packages, TCP and COB are designed to respond to the demands for thinner, more compact and lower cost of systems. They are superior to conventional packages in space requirements, thickness and cost as


    OCR Scan     		ITI111 PDF

    q1257

    Abstract: Q1129 Q4331 TSOP66 Q4311 tsop 4021 tsop ddr2 ram DDR RAM 512M DRAM spectrum infineon TSOP-66
    Text: 2002791-D-RAM–hoch17 11.09.2003 15:07 Uhr Seite 1 Product Information 2003 / 2004 DRAM SPECTRUM www.infineon.com Never stop thinking. 2002791-D-RAM–hoch17 11.09.2003 15:07 Uhr Seite 2 Introduction September 2003. This edition of the DRAM Spectrum has been developed


    Original     		2002791-D-RAM hoch17 DDR400 PC3200) B112-H6731-G10-X-7600 q1257 Q1129 Q4331 TSOP66 Q4311 tsop 4021 tsop ddr2 ram DDR RAM 512M DRAM spectrum infineon TSOP-66 PDF

    Untitled

    Abstract: No abstract text available
    Text: V437464S24VD 3.3 VOLT 64M x 72 HIGH PERFORMANCE UNBUFFERED ECC SDRAM MODULE Features Description • 168 Pin Unbuffered ECC 67,108,864 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S


    Original     		V437464S24VD TSOPII-54 -75PC, -10PC, PDF

    sdram pcb layout gerber

    Abstract: 512M ProMOS
    Text: V437432S24VD 3.3 VOLT 32M x 72 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM ECC MODULE Features Description • 168 Pin Unbuffered ECC 33,554,432 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S


    Original     		V437432S24VD PC133 TSOPII-54 sdram pcb layout gerber 512M ProMOS PDF

    128 DDR PC400

    Abstract: V8266
    Text: V826632K24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features Description • 184 Pin Unbuffered 33,554,432 x 64 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages ■ Single +2.5V ± 0.2V Power Supply


    Original     		V826632K24SA TSOPII-66 DDR400 128 DDR PC400 V8266 PDF

    DPDD64MX16XCY8

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit CMOS DDR SDRAM DPDD64MX16XCY8 DESCRIPTION: DuraStack uses DPAC's innovative technology patent pending to stack memory devices with a direct lead-on-lead, creating a metallurgical bond. As no substrate interface material is required, the length and width of the stack is comparable to a TSOP type-II


    Original     		DPDD64MX16XCY8 MO-238 30A263-00 DPDD64MX16XCY8 PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF

    Untitled

    Abstract: No abstract text available
    Text: V826664K24SA 64M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features Description • 184 Pin Unbuffered 67,108,864 x 64 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages ■ Single +2.5V ± 0.2V Power Supply


    Original     		V826664K24SA TSOPII-66 DDR400 PDF

    ddr2 laptop pin

    Abstract: DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333
    Text: Product Information 2004 MEMORY DRAM Modules Including DDR2 Modules w w w. i n f i n e o n . c o m / m e m o r y Never stop thinking. Introduction One-Stop-Shopping for DRAM Modules J U N E 2 0 0 4 . As a leading memory products supplier, we offer an extensive range of leading-edge DRAM modules.


    Original     		B166-H8412-X-X-7600 ddr2 laptop pin DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333 PDF

    S34ML08G

    Abstract: S34ML08G2 S34ML04G2 S34ML04G s34ml01g S34ML08G201 NAND FLASH BGA
    Text: S34ML08G2 NAND Flash Memory for Embedded 8 Gb, 4-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G2 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G2 S34ML08G2 S34ML08G S34ML04G2 S34ML04G s34ml01g S34ML08G201 NAND FLASH BGA PDF

    S34ML08G

    Abstract: S34ML08G2 Spansion S34ML08G2 s34ml Spansion NAND Flash slc NAND FLASH BGA NAND Flash Memory 2013
    Text: S34ML08G2 NAND Flash Memory for Embedded 8 Gb, 4-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G2 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G2 S34ML08G2 S34ML08G Spansion S34ML08G2 s34ml Spansion NAND Flash slc NAND FLASH BGA NAND Flash Memory 2013 PDF

    RISC-Processor s3c2410

    Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
    Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH


    Original     		BR-04-ALL-005 BR-04-ALL-004 RISC-Processor s3c2410 MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B PDF

    microDIMM

    Abstract: UGM32T66G6LA-PL NC143 VSS75
    Text: UGM32T66G6LA-PL Data sheets can be downloaded at www.unigen.com 256M Bytes 32M x 64 bits SYNCHRONOUS DRAM MODULE PC133 SDRAM Unbuffered MicroDIMM based on 4 pcs 32M x 16 Stacked SDRAM with LVTTL, 4 banks & 8K Refresh PIN ASSIGNMENT (Front View) 144-Pin MicroDIMM


    Original     		UGM32T66G6LA-PL PC133 144-Pin UGM32T66G6LA-PL 32Mbits microDIMM NC143 VSS75 PDF

    S34ML08G101

    Abstract: S34ML08G S34ML08G1 VBM063 Spansion NAND Flash DIE S34ML01G1_04g1 S34ML Spansion NAND S34ML01G1 S34ML04G
    Text: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G1 S34ML08G1 S34ML08G101 S34ML08G VBM063 Spansion NAND Flash DIE S34ML01G1_04g1 S34ML Spansion NAND S34ML01G1 S34ML04G PDF

    DDR2 SDRAM DIMM

    Abstract: No abstract text available
    Text: V826632G24SA 256 MB 200-PIN DDR UNBUFFERED SODIMM 32M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 33,554,432 x 64 bit organization. ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages


    Original     		V826632G24SA 200-PIN TSOPII-66 DDR400 DDR2 SDRAM DIMM PDF

    S34ML08G1

    Abstract: 48 - tsop1 pcb layout S34ML08G Spansion NAND Flash DIE JEDEC TRAY TSOP1 jedec mo-142 footprint Spansion NAND Flash S34ML01G1 nand flash ONFI 3.0 NAND Flash Qualification Reliability Spansion NAND Flash
    Text: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G1 S34ML08G1 48 - tsop1 pcb layout S34ML08G Spansion NAND Flash DIE JEDEC TRAY TSOP1 jedec mo-142 footprint Spansion NAND Flash S34ML01G1 nand flash ONFI 3.0 NAND Flash Qualification Reliability Spansion NAND Flash PDF

    SF 150 U11 4K

    Abstract: No abstract text available
    Text: V826664G24SA 512 MB 200-PIN DDR UNBUFFERED SODIMM 64M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 67,108,864 x 64 bit organization. ■ Utilizes High Performance 32M x 8 DDR SDRAM in SOC Packages


    Original     		V826664G24SA 200-PIN DDR400 SF 150 U11 4K PDF

    jedec mo-142

    Abstract: No abstract text available
    Text: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O, 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G1 S34ML08G1 jedec mo-142 PDF

    Untitled

    Abstract: No abstract text available
    Text: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O, 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S34ML08G1 S34ML08G1 PDF

    Untitled

    Abstract: No abstract text available
    Text: V826632M24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MICRODIMM MODULE Features Description • 172 Pin Unbuffered 33,554,432 x 64 bit Organization DDR MICRODIMM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in SOC Packages ■ Single +2.5V ± 0.2V Power Supply


    Original     		V826632M24SA DDR400 PDF

    S25FL256

    Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
    Text: Spansion Product Selector Guide April 2012 Spansion ® Products Portfolio Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including:


    Original     		128Mb 256Mb 512Mb 43715C S25FL256 S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K PDF