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    DFC21R57P002HHA

    Abstract: TRAY DIMENSIONS
    Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING m u R n ta /n n crctfo r in F te cù w ics REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the


    OCR Scan     		PDF DFC21R57P002HHA TA2210 TypeTA2110: 178mm TA2210: 330mm TRAY DIMENSIONS

    DFC21R57P002HHA

    Abstract: No abstract text available
    Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING tn u ffn tn /kA cm tcr in Gec&m/& REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the


    OCR Scan     		PDF DFC21R57P002HHA TA2210 TypeTA2110 178mm TA2210: 330mm CG01-H DFC21R57P002HHA

    DFC21R57P002HHA

    Abstract: DFc21r57
    Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the maximum time in Figure 1 should be accumulated time.


    OCR Scan     		PDF DFC21R57P002HHA TA2210 TypeTA2110: 178mm TA2210: 330mm CG01-J DFC21R57P002HHA DFc21r57