VNC2-32
Abstract: u1M code vnc2 ftdi spi example
Text: Future Technology Devices International Ltd. V2DIP1-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000163 Version 1.0 Issue Date: 2010-04-16 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-32
VNC2-32Q
V2DIP1-32
VNC2-32
u1M code
vnc2
ftdi spi example
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VNC2-64Q1A
Abstract: No abstract text available
Text: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-64
VNCL2-64Q
V2DIP1-64
VNC2-64Q1A
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IO24
Abstract: VNC2-48 Vinculum II
Text: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.0 Issue Date: 2010-04-15 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-48
VNC2-48
V2DIP1-48
IO24
Vinculum II
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J222
Abstract: VNCL2-64Q VNC2-64Q1A
Text: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-64
VNCL2-64Q
895-V2DIP1-64
V2DIP1-64
J222
VNC2-64Q1A
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V2DA
Abstract: VDIP1
Text: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.0 Issue Date: 2010-04-15 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-48
VNC2-48
895-V2DIP1-48
V2DIP1-48
V2DA
VDIP1
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Untitled
Abstract: No abstract text available
Text: Future Technology Devices International Ltd. V2DIP1-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000163 Version 1.01 Issue Date: 2010-05-25 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-32
VNC2-32Q
V2DIP1-32
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SPI NAND FLASH samsung k9
Abstract: No abstract text available
Text: KSZ9692PB Integrated Gigabit Networking and Communications Controller General Description Dual High-Speed USB 2.0 Interfaces The KSZ9692PB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the cost-sensitive, highperformance needs of a wide variety of high bandwidth
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KSZ9692PB
KSZ9692PB
32-bit
M9999-101408-1
SPI NAND FLASH samsung k9
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V2DIP1-32
Abstract: VNC2-32Q ftdi spi example usb flash drive circuit diagram t4 3570 datasheet Vdip1 VDIP2 VNC1L VNC2
Text: Future Technology Devices International Ltd. V2DIP1-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000163 Version 1.01 Issue Date: 2010-05-25 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-32
VNC2-32Q
V2DIP1-32
ftdi spi example
usb flash drive circuit diagram
t4 3570 datasheet
Vdip1
VDIP2
VNC1L
VNC2
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ARM processor
Abstract: SPI NAND FLASH samsung k9
Text: KSZ8692PB Integrated Networking and Communications Controller General Description Dual High-Speed USB 2.0 Interfaces The KSZ8692PB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the cost-sensitive, highperformance needs of a wide variety of high bandwidth
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KSZ8692PB
KSZ8692PB
32-bit
M9999-101408-1
ARM processor
SPI NAND FLASH samsung k9
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V2DIP1-64
Abstract: J222 J226 J214 J119 VNC2-64 vnc2-48l1a Vdip1 J121 J227
Text: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.01 Issue Date: 2010-05-25 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-64
VNCL2-64Q
V2DIP1-64
J222
J226
J214
J119
VNC2-64
vnc2-48l1a
Vdip1
J121
J227
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KSZ8692XPB
Abstract: ksz8692
Text: KSZ8692MPB/KSZ8692XPB Integrated Networking and Communications Controller General Description The KSZ8692MPB/KSZ8692XPB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the costsensitive, high-performance needs of a wide variety of high
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KSZ8692MPB/KSZ8692XPB
KSZ8692MPB/KSZ8692XPB
32-bit
KSZ8692MPB
M9999-101408-1
KSZ8692XPB
ksz8692
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Untitled
Abstract: No abstract text available
Text: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.01 Issue Date: 2010-05-24 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-48
VNC2-48
V2DIP1-48
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V2DIP1-48
Abstract: Vdip1 vnc2-48l1a usb flash drive circuit diagram vinculum VNC2-48 usb male connector pcb mounted Vinculum II
Text: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.01 Issue Date: 2010-05-24 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
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V2DIP1-48
VNC2-48
V2DIP1-48
Vdip1
vnc2-48l1a
usb flash drive circuit diagram
vinculum
usb male connector pcb mounted
Vinculum II
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Untitled
Abstract: No abstract text available
Text: KSZ9692MPB/KSZ9692XPB Integrated Gigabit Networking and Communications Controller General Description The KSZ9692MPB/KSZ9692XPB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the costsensitive, high-performance needs of a wide variety of high
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KSZ9692MPB/KSZ9692XPB
KSZ9692MPB/KSZ9692XPB
32-bit
KSZ9692MPB
M9999-101408-1
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digit 3000
Abstract: DIGIT2000 dti2260 ddp3310 PVPU FBL 00 010
Text: ADVANCE INFORMATION CIP 3250A Component Interface Processor MICRONAS Edition Oct. 9, 1996 6251-403-3AI CIP 3250A ADVANCE INFORMATION Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction Block Diagram System Configurations 7 7 7 7 7 8 8 8 8 9 9 10 10
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6251-403-3AI
digit 3000
DIGIT2000
dti2260
ddp3310
PVPU
FBL 00 010
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DIGIT2000
Abstract: DDP3310B digit 3000 PVPU Usat BRY 300 chroma processor u1M code CIP3250A 1996 yuv rgb conversion frame buffer
Text: ADVANCE INFORMATION CIP 3250A Component Interface Processor MICRONAS Edition Oct. 9, 1996 6251-403-3AI CIP 3250A ADVANCE INFORMATION Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction Block Diagram System Configurations 7 7 7 7 7 8 8 8 8 9 9 10 10
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6251-403-3AI
DIGIT2000
DDP3310B
digit 3000
PVPU
Usat
BRY 300
chroma processor
u1M code
CIP3250A
1996 yuv rgb conversion frame buffer
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digit2000
Abstract: GL494 chroma processor Hsync Vsync analog to digital convert CIP3250A DDP3310B BRY 72 PVPU
Text: ADVANCE INFORMATION CIP 3250A Component Interface Processor Edition Oct. 9, 1996 6251-403-3AI MICRONAS CIP 3250A ADVANCE INFORMATION Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction Block Diagram System Configurations 7 7 7 7 7 8 8 8 8 9 9 10 10
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6251-403-3AI
digit2000
GL494
chroma processor
Hsync Vsync analog to digital convert
CIP3250A
DDP3310B
BRY 72
PVPU
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rk903
Abstract: DTC34LM85A CE7121MM33 ALC5631 DTC34LM85 ESDA6V8 DTC34LM85AL CM3217 QFN48 6x6 ALC5631Q
Text: 5 4 C B 2 1 PCB POWER WIRE WIDTH INDICATE CONTENT INDEXING D 3 01. INDEX 02.Modify note 03.Block Diagram 04.SYSTEM POWER DIAGRAM 05.DC/CHARG 06.SYSTEM POWER 07.USB OTG/VIB 08.DDR3 09.FLASH/SD 10.GPIO 11.AUDIO 12.LCD PANEL 13.TOUCH PANEL 14.HDMI/ATSC 15.CAMERA/G_SENSOR/KEY/COMP/IR
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94MIL
R0402
RK3066
BCM4751
BGA100-7X7
rk903
DTC34LM85A
CE7121MM33
ALC5631
DTC34LM85
ESDA6V8
DTC34LM85AL
CM3217
QFN48 6x6
ALC5631Q
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FCI smd rj45 Connector
Abstract: IXF1104 panasonic rx-d17 J18A harness MCP860 RXA25 stpa smd E25 SMD diode RGMII Intel MDIO mark b14 smd diode
Text: Intel IXD1104 Demo Board Development Kit Manual August 2003 Document Number: 278809 Revision Number: 001 Revision Date: August 21, 2003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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IXD1104
SN74LVTH162244
SSOP48)
SN74LVTH162245
CON\MICTOR\43P)
SN74HC11D
EP1K50TC144-2
NC7SZ125M5
EPM7064AETC44
FCI smd rj45 Connector
IXF1104
panasonic rx-d17
J18A harness
MCP860
RXA25
stpa smd
E25 SMD diode
RGMII Intel MDIO
mark b14 smd diode
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8e1111
Abstract: PWR1014A VITA-57 Vishay to277 ASP-134486-01 VITA57 PWR1014 TO277 16TQC100M TO-277
Text: LatticeECP3 AMC Evaluation Board – Revision B User’s Guide September 2010 Revision: EB56_01.0 LatticeECP3 AMC Evaluation Board – Revision B User’s Guide Lattice Semiconductor Introduction The LatticeECP3 AMC Evaluation Board allows designers to investigate and experiment with the features of the
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R76C2D"
R85C2D"
R112C2D"
R121C2D"
R60C2D"
8e1111
PWR1014A
VITA-57
Vishay to277
ASP-134486-01
VITA57
PWR1014
TO277
16TQC100M
TO-277
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GL3AR2
Abstract: slb 3802 GL9PR23 GL9PR2 GL-5AR1 LT 5233 GL3AR GL-9PR2 SLB-26VR LTL2251AL
Text: CROSS REFERENCE GUIDE FOR: H .P ./TE LE FU N K E N /S IE M E N S /M A TS U S H ITA /R O H M /S H A R P /S TA N LE Y /Q TC / TOSHIBA LED LAMPS In o r d e r to d e s ig n a te th e s im ila r it y b e tw e e n th e o th e r m a n u f a c t u r e r s ’ d e v ic e a n d th e n e a re s t L IT O N e q u iv a le n t.
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OCR Scan
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MV5T54A/MV6154Â
MV5754
/MV6754A
MV53123
MV54123
MV57123
HLMP-OS03/0504
HLMP-0300/
ITL-3233A,
LTL-3223Â
GL3AR2
slb 3802
GL9PR23
GL9PR2
GL-5AR1
LT 5233
GL3AR
GL-9PR2
SLB-26VR
LTL2251AL
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TMM24256P
Abstract: AF150 TC54256P TTL af tc54256ap
Text: TOSHIBA MOS MEMORY PRODOCTS TC54256AP/AF-150 DESCRIPTION The TC54256AP/AF is a 32,768 wo r d x 8 bit one time programmable read only memory, and molded in a 28 pin plastic package. The TC54256AP/AF's access time is 150ns and has low power standby mode which reduces the power dissipation without increasing access
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TC54256AP/AF-150
TC54256AP/AF
150ns
TC57256AD
30mA/6
150ns
TC54256AP
TMM24256P
AF150
TC54256P
TTL af
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Untitled
Abstract: No abstract text available
Text: XC7236A 36-Macrocell CMOS EPLD HXILINX Product Specifications Features The functional versatility of the traditional programmable logic array architecture is enhanced through additional gating and control functions available in an Arithmetic Logic Unit ALU in each Macrocell. Dedicated fast arith
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XC7236A
36-Macrocell
44-Pin
XC7236A
00054bb
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28f512a
Abstract: GE capacitor 28f TMS28F512A TEXAS INSTRUMENTS
Text: TMS28F512A 524288-BIT F L A S H M E M O R Y S M JS 514B - FEBRUARY 1 9 9 4 - REVISED MARCH 1996 • O r g an iz a t io n . . . 64K x 8-Bit Flash M e m o r y • All I n p u t s / O u t p u t s T T L - C o m p a t i b l e • V qq Tolerance ±10% PM P A C K A G E
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TMS28F512A
524288-BIT
28FS1
28f512a
GE capacitor 28f
TMS28F512A TEXAS INSTRUMENTS
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