Micro-D Backshells
Abstract: 507-088
Text: Micro-D Backshells 507-088 Composite EMI/RFI Banding Backshell Round Cable Entry Save Weight and Eliminate Corrosion Damage with composite Micro-D backshells. These round cable entry backshells are injectionmolded with high strength Ultem 2300 fiberglass-reinforced
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507T088
Micro-D Backshells
507-088
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Untitled
Abstract: No abstract text available
Text: Micro-D Backshells EMI, Composite, Round Cable Entry 507-088 Save Weight and Eliminate Corrosion Damage with composite Micro-D backshells. These round cable entry backshells are injection-molded with high strength Ultem 2300 fiberglass-reinforced thermoplastic.
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17-7PH
507T088
06324/0CA77
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ultem 2300
Abstract: No abstract text available
Text: Micro-D Backshells Micro-D Backshells EMI, Composite, Round Cable Entry 507-088 A Save Weight and Eliminate Corrosion Damage with composite Micro-D backshells. These round cable entry backshells are injection-molded with high strength Ultem 2300 fiberglass-reinforced thermoplastic.
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06324/0CA77
ultem 2300
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ultem 2300
Abstract: No abstract text available
Text: Micro-D Backshells Composite EMI/RFI Banding Backshell with Round Cable Entry 507-088 Save Weight and Eliminate Corrosion Damage with composite Micro-D backshells. These round cable entry backshells are injection-molded with high strength Ultem 2300 iberglassreinforced thermoplastic.
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17-7PH
507T088
ultem 2300
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Production Capabilities
Abstract: ASTM-E595 ASTM-E-595 ryton r4-xt ULTEM Outgassing SAE AS85049 ultem 2300 AS85049 E595 Outgassing
Text: Introduction Glenair Composite Connector and Accessory Production Capabilities G lenair is the recognized leader in composite thermoplastic research and development for the interconnect accessory industry. In fact, no one else has tooled even a small fraction of the composite
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temperatures--500
Intro-17
Production Capabilities
ASTM-E595
ASTM-E-595
ryton r4-xt
ULTEM Outgassing
SAE AS85049
ultem 2300
AS85049
E595
Outgassing
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AE4L-87-3
Abstract: No abstract text available
Text: CostSaver Composite Marine Junction Boxes Most junction boxes are built to house terminal boards. Ours are built to save you money. G lenair is the recognized leader in composite therm oplastic research and developm entforthe interconnect accessory industry. Glenair's lightweight/high-strength CostSaver Composite Ma
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MIL-C-901C,
RTCA/DO160C
MIL-STD-167SHIPS.
AE4L-87-3,
AE4L-87-3
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Untitled
Abstract: No abstract text available
Text: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .
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AF111
AF111
1-1W-10,
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Composite Thermoplastic: Lightweight, Corrosion-Free Interconnect Solutions from Glenair
Abstract: ULTEM Outgassing Qwik Connect
Text: Qwik Connect GLENAIR APRIL 2008 VOLUME 12 Composite Thermoplastic: Lightweight, Corrosion-Free Interconnect Solutions From Glenair NUMBER 2 QwikConnect The Future is Here, and It’s Made of Plastic F or many people, “plastic” means “cheap and breakable.” But when engineers search for new
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Composite Backshells and Other Connector Accessories
Abstract: No abstract text available
Text: Composite Backshells Composite Backshells and Other Connector Accessories General Information Reduced Weight and Zero Corrosion for Harsh Environment Interconnect Applications Hundreds of Military Standard and Commercial Connector Accessories Tooled, Stocked and Ready for Shipment.
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ultem 2300
Abstract: glenair connector AS85049 E595 ASTM-E595 vibration
Text: Composite Backshells Composite Backshells and Other Connector Accessories General Information Reduced Weight and Zero Corrosion for Harsh Environment Interconnect Applications Hundreds of Military Standard and Commercial Connector Accessories Tooled, Stocked and Ready for Shipment.
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Series 79 Micro-Crimp Connectors for Space Flight
Abstract: ULTEM Outgassing ZZ-R-765
Text: Series 79 General Information Series 79 Micro-Crimp General Information Micro-Crimp Connectors for Space Flight Series 79 Micro-Crimp Connectors for Space Flight Micro-D connectors are a popular choice for space flight. Their small size and reduced weight, combined with excellent shock
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EEE-INST-002
Series 79 Micro-Crimp Connectors for Space Flight
ULTEM Outgassing
ZZ-R-765
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Step Eight
Abstract: Glenair CostSaver Composite EMI/RFI Junction Boxes
Text: Composite Junction Boxes Glenair CostSaver Composite EMI/RFI Junction Boxes Design Guide - Step Eight Bombardier Toxicity and Federal Railroad Adminiatration Flame Spread, Smoke Density and Toxicity This requirement covers material flammability and toxicty IAW with both aircraft and rail transportation
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2300-GY4001.
800-C
Step Eight
Glenair CostSaver Composite EMI/RFI Junction Boxes
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Untitled
Abstract: No abstract text available
Text: Introduzione agli accessori e connettori in composito termoplastico Introduzione agli Accessori e Connettori in Composito Termoplastico Immaginatevi lo space shuttle che decolla in un’esplosione di carburante criogenico dai suoi serbatoi esterni e dai suoi razzi, solca il cielo, entra nello spazio a velocità ipersonica e torna sulla Terra attraverso la bruciante frizione
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F117A
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MIL-A-46146
Abstract: Emerson Cuming Catalyst 11 Stycast 2651 Emerson Cuming 2651 ECCOBOND 104 7224 markem Markem 7224 Ink Emerson Cuming Catalyst 9 Cho-Seal ULTEM Outgassing
Text: General Information Series 79 Micro-Crimp Section C: General Information and Reference Series 79 Micro-Crimp Connectors for Space Flight Micro-D connectors are a popular choice for space flight. Their small size and reduced weight, combined with excellent shock and vibration performance,
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EEE-INST-002
04-July-2009
MIL-A-46146
Emerson Cuming Catalyst 11
Stycast 2651
Emerson Cuming 2651
ECCOBOND 104
7224 markem
Markem 7224 Ink
Emerson Cuming Catalyst 9
Cho-Seal
ULTEM Outgassing
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XG-BGA-5000
Abstract: No abstract text available
Text: 40 GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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363mm.
caXG-BGA-5000
XG-BGA-5000
725mm
025mm
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ultem 2300
Abstract: SG-BGA-7046 FR4 0.8mm thickness FR4 thickness
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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SG-BGA-7046
725mm
025mm
ultem 2300
FR4 0.8mm thickness
FR4 thickness
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SG-BGA-7044
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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475mm.
SG-BGA-7044
725mm
025mm
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7121
Abstract: SG-BGA-7121
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225 mm Easily removable swivel socket lid
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SG-BGA-7121
725mm
025mm
7121
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7121
Abstract: SG-BGA-7121
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225 mm Easily removable swivel socket lid
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475mm.
all121
SG-BGA-7121
725mm
025mm
7121
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3.5mm socket 4 pin
Abstract: PCB 3.5mm Socket SG-BGA-6072
Text: Top View Without Heatsink GHz BGA Socket - Direct mount, solderless 60.5mm 49mmSqr. 1.875mm 6.263mm Top View of Heat Sink Lid 3.5mm 6.5mm 30.935mm 6.638mm 3.5mm 2.25mm 0.375mm 30.56mm A A 53.5mm 60.5mm 40.225mmSqr. 30.56mm 0.375mm A1 orientation Mark Ø 0.8mm(x4)
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49mmSqr.
875mm
263mm
935mm
638mm
375mm
225mmSqr.
185mm
SG-BGA-6072
3.5mm socket 4 pin
PCB 3.5mm Socket
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SG-BGA-6080
Abstract: torque of 4-40 screw for pcb ultem 2300
Text: Top View Without Heatsink GHz BGA Socket - Direct mount, solderless 60.5mm 49mmSqr. 1.875mm 6.263mm Top View of Heat Sink Lid 3.5mm 6.5mm 30.935mm 6.638mm 3.5mm 2.25mm 0.375mm 30.56mm A A 53.5mm 60.5mm 40.225mmSqr. 30.56mm 0.375mm A1 orientation Mark Ø 0.8mm(x4)
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49mmSqr.
875mm
263mm
935mm
638mm
375mm
225mmSqr.
185mm
SG-BGA-6080
torque of 4-40 screw for pcb
ultem 2300
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"BR 8470"
Abstract: BR8470 BR 8470 MIL-STD-1310G trw 2015 MIL-STD-901D TBM84-3 ASTMD570-81 MIL-STD-1310 MIL-STD-901
Text: Composite Junction Boxes Glenair CostSaver Composite EMI/RFI Junction Boxes Design Guide - Step One Step One: Specification of a Junction Box Assembly Begins with the Selection of the Right Size Box—Both in Terms of the A Internal Volume and the External Package Size.
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Abstract: No abstract text available
Text: Qwik Connect GLENAIR n J an u ar y 2 0 13 n V o l u m e 17 n N u m b er 1 QwikConnect insulation, open-ended wire splices vulnerable to moisture, non-compliant repairs, deteriorated wiring, corrosion, improper installation, and contamination by metal shavings, dust, and flammable fluids.
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Untitled
Abstract: No abstract text available
Text: Qwik Connect GLENAIR n J an u ar y 2 0 13 n V o l u m e 17 n N u m b er 1 QwikConnect insulation, open-ended wire splices vulnerable to moisture, non-compliant repairs, deteriorated wiring, corrosion, improper installation, and contamination by metal shavings, dust, and flammable fluids.
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