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    VOICE FUNCTIONALITY IN CHIPSET Search Results

    VOICE FUNCTIONALITY IN CHIPSET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation

    VOICE FUNCTIONALITY IN CHIPSET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    VE880

    Abstract: LE88266 LE88286 JS-1001-XX Legerity GR-909 VE8820 LE88276 fxs line interface Legerity fxs
    Text: VE880 SERIES PRODUCT PREVIEW WORLD’S FIRST INTEGRATED SOLUTION FOR VOICE APPLICATIONS THAT IMPLEMENTS COMPLETE BORSCHT FUNCTIONALITY IN A SINGLE DEVICE. THE VE880 SOLUTION IS THE EASIEST AND MOST COST EFFECTIVE WAY TO ADD VOICE TO BROADBAND CONNECTIONS.


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    PDF VE880 VE8820 Le882xx) 9ZS178 LE88266 LE88286 JS-1001-XX Legerity GR-909 LE88276 fxs line interface Legerity fxs

    OPTICAL NETWORK TERMINAL

    Abstract: Le88266 LE88286 LE88276 GR-909 Le882xx VE880 VE8820 fxs line interface Legerity fxs
    Text: VE880 SERIES PRODUCT PREVIEW WORLD’S FIRST INTEGRATED SOLUTION FOR VOICE APPLICATIONS THAT IMPLEMENTS COMPLETE BORSCHT FUNCTIONALITY IN A SINGLE DEVICE. THE VE880 SOLUTION IS THE EASIEST AND MOST COST EFFECTIVE WAY TO ADD VOICE TO BROADBAND CONNECTIONS.


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    PDF VE880 VE8820 Le882xx) 10ZS161 OPTICAL NETWORK TERMINAL Le88266 LE88286 LE88276 GR-909 Le882xx fxs line interface Legerity fxs

    "Silicon Laboratories" -si3014 si3021

    Abstract: Si3016 S1184 DB9 Female / RJ11 cable RJ11 patch panel Si3021 Si3044 TMS320 TMS320C54CST SPRA859
    Text: Application Report SPRA859 - January 2003 www.spiritDSP.com/CST Client Side Telephony CST Chipset Mode Leonid Purto Maxim Silchev SPIRIT CORP ABSTRACT The purpose of this document is to provide information required to test the basic functionality of the C54CST data modem and voice applications in chipset mode. It is recommended that


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    PDF SPRA859 C54CST TMS320C54CST "Silicon Laboratories" -si3014 si3021 Si3016 S1184 DB9 Female / RJ11 cable RJ11 patch panel Si3021 Si3044 TMS320

    main distribution frame

    Abstract: pots to ADSL central splitter wiring 21789 transistor 21789 DSLAM configuration
    Text: ADSL Business Case: Integrated Voice-Data chipset enables 50% linecard cost savings in voice-ADSL systems By J. Eiblmeier Product Marketing Infineon 1. Introduction Today's method of deploying ADSL service by using an analog POTS splitter to separate the ADSL signal from the base-band voice signal and then routing


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    vdsl2 phy

    Abstract: DDR 2 RAM MIPS32 MSP7150 PM4380 MSP7140
    Text: MSP7140 VDSL2 Multi-service Processor Preliminary Product Brief PRODUCT OVERVIEW PRODUCT HIGHLIGHTS The MSP7140 multi-service processor is a cost-optimized VDSL2/ADSL2+ SoC and line interface solution for multi-service residential gateways RGs . The chipset addresses carrier multiservice requirements with superior performance, advanced QoS


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    PDF MSP7140 MSP7140 MSP7150. MSP7150 vdsl2 phy DDR 2 RAM MIPS32 PM4380

    btm 110 bluetooth

    Abstract: btm 110 module bc05 module BTM510 BLUETOOTH MODULE BTM bluetooth BC05 kalimba dsp BTM511 BC05 BTM510/511
    Text: BTM510/511 Bluetooth Multimedia Modules Innovative Technology for a Connected World The BTM510 and BTM 511 are low-power Bluetooth® modules designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide


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    PDF BTM510/511 BTM510 16-bit btm 110 bluetooth btm 110 module bc05 module BLUETOOTH MODULE BTM bluetooth BC05 kalimba dsp BTM511 BC05 BTM510/511

    BC05

    Abstract: kalimba dsp BLUETOOTH MODULE BTM BTM510 BTM511 bluetooth BC05 audio noise cancellation IC in headset DVK-BTM511 bc05 module kalimba
    Text: Bluetooth Audio Modules BTM510/511 Innovative Technology for a Connected World The BTM510 and BTM 511 are low-power Bluetooth® modules designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide


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    PDF BTM510/511 BTM510 BTM511, 16-bit BC05 kalimba dsp BLUETOOTH MODULE BTM BTM511 bluetooth BC05 audio noise cancellation IC in headset DVK-BTM511 bc05 module kalimba

    APTX

    Abstract: No abstract text available
    Text: Bluetooth Audio Modules BTM510/511 The BTM510 and BTM511 are low-power Bluetooth® modules from Laird Technologies are designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power


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    PDF BTM510/511 BTM510 BTM511 16-bit APTX

    coppercom

    Abstract: VIRATA virata helium ISOS
    Text: Azurite IAD Chipset Product Profile Data Sheet May 2000 KEY FEATURES Complete chipset and software for Integrated Access Device IAD applications The industry’s most powerful communications processors coupled with the most widely-used DSPs Includes ATM signaling, IP


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    PDF 17F-2, coppercom VIRATA virata helium ISOS

    Untitled

    Abstract: No abstract text available
    Text: Bluetooth Class II Multimedia Modules BTM510/511 The BTM510 and BTM511 are low-power Bluetooth® modules from Laird Technologies are designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power consumption with outstanding range. Supporting


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    PDF BTM510/511 BTM510 BTM511

    Le89010

    Abstract: le89900 VE8901 LE89116 Le89336 Le89136 SoC SLIC VE8911-HV VE8921 LE89810
    Text: VE890 SERIES PRODUCT PREVIEW The VE8910 , VE8910-HV, VE8901, VE8911, VE8911-HV and VE8921 chipsets are highly integrated, cost-effective FXS, FXO and FXS + FXO chipsets that are optimized for residential VoIP access devices. These chipsets implements a complete BORSCHT functionality by providing the


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    PDF VE890 VE8910 VE8910-HV, VE8901, VE8911, VE8911-HV VE8921 10ZS024 Le89010 le89900 VE8901 LE89116 Le89336 Le89136 SoC SLIC LE89810

    LE89116

    Abstract: LE89810 LE89316 Le89010 VE8901 le89900 PSTN DAA hybrid VE8911 LE89116 slac VE8921
    Text: VE890 SERIES PRODUCT PREVIEW The VE8910 , VE8901, VE8911, and VE8921 chipsets are highly integrated, costeffective FXS, FXO and FXS + FXO chipsets that are optimized for residential VoIP access devices. These chipsets implements a complete BORSCHT functionality


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    PDF VE890 VE8910 VE8901, VE8911, VE8921 Le89810 Le89316 Le89900 9ZS197 LE89116 LE89810 LE89316 Le89010 VE8901 le89900 PSTN DAA hybrid VE8911 LE89116 slac

    LE89116

    Abstract: LE89810 LE89316 VE890 VE8921 le89900 LE89116 slac Legerity fxs VE8911 PSTN DAA hybrid
    Text: VE890 SERIES PRODUCT PREVIEW The VE8910, VE8911, and VE8921 chipsets are highly integrated, cost-effective FXS and FXS + FXO chipsets that are optimized for residential VoIP access devices. These chipsets implements a complete BORSCHT functionality by providing the


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    PDF VE890 VE8910, VE8911, VE8921 Le89810 Le89316 Le89900 LE89116 LE89810 LE89316 le89900 LE89116 slac Legerity fxs VE8911 PSTN DAA hybrid

    PAM16

    Abstract: Metalink PAM-16 HDSL2 MTH2405 SDSL AFE
    Text: MtH2405 SDSL2/HDSL2 Dual Transceiver Product Brief Advanced Multi-Mode DSLTM Integration Key Features : Dual SDSL2/HDSL2 Transceiver Metalink’s MtH2405 Chipset Solution implements a low power Dual SDSL2/HDSL2 transceiver. Each transceiver implements PAM 4, 8, 16 line codes


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    PDF MtH2405 MtH2435 256-pin PAM16 Metalink PAM-16 HDSL2 SDSL AFE

    ESC614-1

    Abstract: AD1848 esc614 Digital ECHO microphone mixing circuit midi to game port cable sound card schematics sound blaster Voyetra pc multimedia speaker circuit diagram 512K DIGITAL ECHO IC
    Text: a Design Guide/Chipset for Personal SoundComm System IIa ADDG-815/AD20msp815 FEATURES RAM-Based Programmable Digital Signal Processor Architecture Provides Functional Extensions Through Software Algorithms EuPhonics EuSynth-1* FM Parameter Compatible Music Synthesis


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    PDF ADDG-815/AD20msp815 16-Bit C1953 MPU-401 ESC614-1 AD1848 esc614 Digital ECHO microphone mixing circuit midi to game port cable sound card schematics sound blaster Voyetra pc multimedia speaker circuit diagram 512K DIGITAL ECHO IC

    CODEC-SLIC

    Abstract: infineon slic PEB 4165 T RJ-11 4-C RJ11 diagram
    Text: T O O L B R I E F The SMART 31665 evaluation board supports a new generation of Infineon Technologies analog voice transmission ICs. The board is a versatile tool for evaluating, testing and demonstrating the MuSLIC chipset. A user-friendly software package is provided to


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    PDF B118-H7590-X-X-7600 CODEC-SLIC infineon slic PEB 4165 T RJ-11 4-C RJ11 diagram

    CX94615

    Abstract: TR-064 TR-098 ADSL DSL WIFI MODEM ADSL2 chipset vdsl2 phy ARM10 CX94410 cx5022x G992
    Text: Broadband Access - Client Side DSL Solutions High Speed ADSL2plus Chipset with Integrated Wireless LAN and Voice CX94615 Conexant’s portfolio includes a comprehensive suite of semiconductor solutions for broadband communications and the digital home. •


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    PDF CX94615 CX94615 CX94410 CX94610 PBR-201236 TR-064 TR-098 ADSL DSL WIFI MODEM ADSL2 chipset vdsl2 phy ARM10 CX94410 cx5022x G992

    modem 56k sram

    Abstract: md562x
    Text: MD562X Preliminary Product Bulletin March 1999 PCI 56K V.90 Controllerless Modem Chipset Family Features: • Data modulation — Data rates up to 56 kbps* — ITU-V.90 56K compliant — ITU-T V.34 33,600 to 2,400 kbps — ITU-T V.32 bis, V.23, V.22 bis, V.21


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    PDF MD562X IS-101 MD562XPreliminary modem 56k sram md562x

    TMS320TCI120

    Abstract: HSDPA FPGA TMS320TCI1x 3g hsdpa signal antenna Diagram qpsk transceiver GC5016 TCI100 TMS320TCI100 Front-End Processors 16QAM modulation
    Text: Channel Card Design for 3G Infrastructure Equipment Introduction The purpose of this paper is to describe the beneficial effects on the economics of 3G channel card design brought about by the introduction of TI’s high-density TMS320TCI1x UMTS Infrastructure Chipset. It will consider the current needs of the


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    PDF TMS320TCI1x TMS320TCI100 TMS320TCI110 TMS320TCI120 HSDPA FPGA 3g hsdpa signal antenna Diagram qpsk transceiver GC5016 TCI100 Front-End Processors 16QAM modulation

    Untitled

    Abstract: No abstract text available
    Text: 1 Overview The B-MuSLIC chipset Figure 1-1 is used in ADSL-Lite DSLAMs for Central Offices (COs) and Digital-Loop Carrier systems (DLCs). The B-MuSLIC (Broadband Multichannel Subscriber Splitterless G.Lite Applications) chipset comprises: Line-lnterface


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    PDF P-TQFP-144 -44H0 lA-BlDlCl144x