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    WAFER MAP FORMAT Search Results

    WAFER MAP FORMAT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10114828-10108LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions Visit Amphenol Communications Solutions
    10114829-11109LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 9 Positions Visit Amphenol Communications Solutions
    10114829-11111LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 11 Positions Visit Amphenol Communications Solutions
    10114829-11113LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions Visit Amphenol Communications Solutions
    10114829-10107LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 7 Positions Visit Amphenol Communications Solutions

    WAFER MAP FORMAT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    G85-0703

    Abstract: g85 wafer G81-0703 G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2
    Text: TN-00-21: SEMI-Defined Wafer Map Format Introduction Technical Note SEMI -Defined Wafer Map Format Introduction Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International SEMI® . Using a mapping format defined by a worldwide


    Original     		TN-00-21: G81-0703 G85-0703 09005aef81d8ff80/Source: 09005aef81d8ff52 TN0021 g85 wafer G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2 PDF

    E5-1101

    Abstract: wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01
    Text: AN115013 SECS II wafer map format Rev. 1.3 — 1 July 2009 Application note Document information Info Content Keywords wafer mapping, SECS II format, electronic inking Abstract This document gives a short guideline how to interpret wafer maps in SECS II format delivered with wafers by Business Line Identification.


    Original     		AN115013 E5-1101 wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01 PDF

    62C02

    Abstract: H20-250-24 I2C/H20-250-24
    Text: Fairchild Semiconductor Serial EEPROM Die Handbook C oo nn tt ee nn tt ss TT aa bb ll ee oo ff C Page Introduction 1 Selection Guides 3 Product Family Fact Sheets 9 Die, Diagrams and Pad Location Data 15 Testing Flows 37 Ordering Information 41 Shipment Packaging


    Original     		AB-309/309A 62C02 H20-250-24 I2C/H20-250-24 PDF

    pin DIAGRAM OF IC 7400

    Abstract: data sheet IC 7400 str 6707 diagram guide ICS31 FUNCTIONAL DIAGRAM OF 7400 IC 4020 data sheet td 1410 59025 ascend map data sheet 7400 IC
    Text: INTEGRATED CIRCUITS SL1 ICS31 01 I•CODE1 Label IC 97pF Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors July 2000 Product Specification SL1 ICS31 01 Rev. 1.2 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4


    Original     		ICS31 pin DIAGRAM OF IC 7400 data sheet IC 7400 str 6707 diagram guide FUNCTIONAL DIAGRAM OF 7400 IC 4020 data sheet td 1410 59025 ascend map data sheet 7400 IC PDF

    ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

    Abstract: ICODE1 Label ICs wafer map
    Text: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors April 2000 I•CODE1 Chip Specification Rev. 2.1 April 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS


    Original     		ICS30 ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE ICODE1 Label ICs wafer map PDF

    ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

    Abstract: snw-fq-627 6C15
    Text: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors July 2000 Product Specification SL1 ICS31 01 Rev. 1.2 1 Contents 1 CONTENTS 2 2 DEFINITIONS


    Original     		ICS31 ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE snw-fq-627 6C15 PDF

    AN3018

    Abstract: E142 wafer format XML e142 GRS-3970-5b GRP-2620-5 MIL-STD-883 Method 2010 wafer map format E142 UV INK SPECIFICATION wafer map
    Text: Application Note AN3018 Known Good Die Delivery Specification Rev. V2 Scope Visual Inspection This application note describes M/A-COM’s standard Known Good Die KGD delivery practices for use in high volume commercial applications. All KGD are electrically tested, visually inspected, and delivered


    Original     		AN3018 MIL-STD-883, AN3018 E142 wafer format XML e142 GRS-3970-5b GRP-2620-5 MIL-STD-883 Method 2010 wafer map format E142 UV INK SPECIFICATION wafer map PDF

    data sheet IC 7400

    Abstract: pin DIAGRAM OF IC 7400 str 6707 diagram guide ICS30 IC chip 7400 td 1410 "reset quiet bit" IC 7400 data sheet internal circuit diagram of 7400 IC internal diagram of 7400 IC
    Text: INTEGRATED CIRCUITS SL1 ICS30 01 I•CODE1 Label IC Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors 2000-05-02 I•CODE1 Chip Specification Rev. 2.1 May 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4


    Original     		ICS30 data sheet IC 7400 pin DIAGRAM OF IC 7400 str 6707 diagram guide IC chip 7400 td 1410 "reset quiet bit" IC 7400 data sheet internal circuit diagram of 7400 IC internal diagram of 7400 IC PDF

    E142 wafer format

    Abstract: perfection grip ring 6 GRP-2620-5 wafer map format E142
    Text: Known Good Die Delivery Specification AN3018 V1 Scope Visual Inspection This application note describes M/A-COM’s standard Known Good Die KGD delivery practices for use in high volume commercial applications. All KGD are electrically tested, visually inspected, and delivered


    Original     		AN3018 MIL-STD-883, E142 wafer format perfection grip ring 6 GRP-2620-5 wafer map format E142 PDF

    amkor RDL

    Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
    Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    CSPNL

    Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
    Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    amkor flip

    Abstract: wlcsp inspection amkor RDL amkor Sip dS721
    Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    95Pb

    Abstract: FCCSP amkor RDL
    Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the


    Original     		PDF

    TI Wafermap format

    Abstract: No abstract text available
    Text: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents


    Original     		SCBU045 TI Wafermap format PDF

    TI Wafermap format

    Abstract: laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0
    Text: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007


    Original     		SCBU047 TI Wafermap format laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0 PDF

    laser barcode reader circuit

    Abstract: TI Wafermap format ti packing label tiris rfid 13.56 TI Assembly Factory Code ISO15693 TIRIS RFID systems map disco code marking ti map IC Lot Code Identification
    Text: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents


    Original     		SCBU045 laser barcode reader circuit TI Wafermap format ti packing label tiris rfid 13.56 TI Assembly Factory Code ISO15693 TIRIS RFID systems map disco code marking ti map IC Lot Code Identification PDF

    WLCSP flip chip

    Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
    Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters


    Original     		PDF

    TI Wafermap format

    Abstract: laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code ISO15693 RF-HDT-SJLC automotive transponder silica Tiris barcode reader circuit
    Text: Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU046 11-09-21-063 Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU046 (11-09-21-063) October 2007 Contents


    Original     		SCBU046 TI Wafermap format laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code ISO15693 RF-HDT-SJLC automotive transponder silica Tiris barcode reader circuit PDF

    ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

    Abstract: 6C15 SL1ICS3101 SL1ICS3101U SL1ICS3101W "i-code1" 2002 HP-4285A ICODE1 Label ICs philips application wafer map
    Text: INTEGRATED CIRCUITS DATA SHEET SL1ICS3101 I-CODE1 Label IC 97 pF Product specification Supersedes data of 2000 Jul 01 2002 May 23 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION


    Original     		SL1ICS3101 SCA74 613502/02/pp20 ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE 6C15 SL1ICS3101 SL1ICS3101U SL1ICS3101W "i-code1" 2002 HP-4285A ICODE1 Label ICs philips application wafer map PDF

    IC 723

    Abstract: ic 721 internal diagram of 7400 IC 6C15 SL1ICS3001 SL1ICS3001U SL1ICS3001W "i-code1" 2002
    Text: INTEGRATED CIRCUITS DATA SHEET SL1ICS3001 I-CODE1 Label IC Product specification Supersedes data of 2000 May 02 2002 May 23 Philips Semiconductors Product specification I-CODE1 Label IC SL1ICS3001 CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4


    Original     		SL1ICS3001 SCA74 613502/02/pp20 IC 723 ic 721 internal diagram of 7400 IC 6C15 SL1ICS3001 SL1ICS3001U SL1ICS3001W "i-code1" 2002 PDF

    Untitled

    Abstract: No abstract text available
    Text: SL2ICS5311EW/V7 Wafer addendum Rev. 3.0 — 8 May 2008 Product data sheet 131030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process


    Original     		SL2ICS5311EW/V7 C075EE PDF

    uv-tape

    Abstract: ICODE SLI-S SECS II wafer map format
    Text: SL2ICS5301EW/V7L Wafer addendum Rev. 3.0 — 19 March 2008 Product data sheet 153430 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process


    Original     		SL2ICS5301EW/V7L C075EE uv-tape ICODE SLI-S SECS II wafer map format PDF

    SECS II wafer map format

    Abstract: wafer map format uv-tape ICS53 LCR meter for ICs package
    Text: SL2 ICS53 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135830 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S Label ICs on an NXP C075EE process


    Original     		ICS53 C075EE ICS5301EW/V7 SECS II wafer map format wafer map format uv-tape ICS53 LCR meter for ICs package PDF

    SECS II wafer map format

    Abstract: C075EE UV-tape
    Text: SL2 ICS50 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136530 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L Label ICs on an NXP C075EE process


    Original     		ICS50 C075EE ICS5001EW/V7 SECS II wafer map format UV-tape PDF