M3601
Abstract: G2800 M3602 G3503 wieson 4210
Text: WIESON TECHNOLOGIES CO., LTD. SPECIFICATION TYPE OF PRODUCT AND FPC Connectors PERFORMANCE TABLE OF CONTENT 1. Scope. ……………………………………………………………………………………. 2 2. Reference Documents ………. . …………………………………………………………… 2
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G3281-030201
GM3281-050304
WSC-WG-QU-148)
SS-00259
2002/95/EC)
M3601
G2800
M3602
G3503
wieson 4210
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manual motherboard canada ices 003 class b
Abstract: slim power sata pinout slim optical drive connector pinout AXX6DRV3GEXP usb to sata converter circuit diagram convert sata to usb cable diagram VSC7161 vsc410 SSI rev 3.61 IEC -320 C14 POWER INLET
Text: Intel Server Chassis SC5400 5U Kit Technical Product Specification Intel reference number D60250-001 Revision: 1.0 May, 2006 Enterprise Platforms and Services Division - Marketing Table of Contents Intel® Server Chassis SC5400 5U Kit TPS Revision History
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SC5400
D60250-001
manual motherboard canada ices 003 class b
slim power sata pinout
slim optical drive connector pinout
AXX6DRV3GEXP
usb to sata converter circuit diagram
convert sata to usb cable diagram
VSC7161
vsc410
SSI rev 3.61
IEC -320 C14 POWER INLET
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heat sensor with fan cooling using ic LM 741
Abstract: 9GV0412P3 smr 40100 San Ace 120L 109R0624J402 109R1212H101 121 M 221 03 9cr0412s sanyo denki brushless p3 Sanyo Denki dc fan 109r0612t4h12
Text: COOLING SYSTEM San Ace Products Information 2006 ver.2 C O N T E N T S Technical Material ･････････････････････ p.3 Product Guide Instruction Manual for Fan ‥‥‥‥‥ p.20 Part Numbering System ‥‥‥‥‥‥ p.22
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molex 2759T 08-50
Abstract: WIESON 2510c888-001 wire 1007 AWG24 Socket 754 C1100 AMD athlon socket 754 Dow Corning 340 heat sink socket 478 Dow Corning AMD Athlon 5000 k8
Text: FHS-A7015A40/FHS-A7015B40 Application: • Intel Socket 478 Prescott FMB1.5 Thermal & Mechanical Specification: · Thermal resistance: 0.28oC/W ref. · Heatsink Weight: 370 g (ref.) · Clipping Force: 32.0 Kgf (ref.) Component Specification: Noise (dBA) Thermal Resistance
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FHS-A7015A40/FHS-A7015B40
28oC/W
C1100
SC102
288A0404
molex 2759T 08-50
WIESON 2510c888-001
wire 1007 AWG24
Socket 754
AMD athlon socket 754
Dow Corning 340
heat sink socket 478
Dow Corning
AMD Athlon 5000 k8
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sl8z4
Abstract: diagram HANNSTAR k mv VDD256 hannstar j mv 1 g792 WISTRON diode c649 ST 1D05V M54-p PCI7412
Text: A B C D LWG2-D Block Diagram Discrete Mobile CPU CLK GEN. 4 IDT CV125PA Project code: 91.4Q801.001 PCB P/N : 55.4Q801.XXX REVISION : 06210-2 (Hannstar, ACCL) G792 Yonah 478 1.83G/2G/2.16G 4, 5 3 19 PCB STACKUP TOP TVO HOST BUS 400/533/667MHz LVDS DDR2 533/667MHz
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TPS51120
CV125PA
83G/2G/2
400/533/667MHz
4Q801
TPS51124
533/667MHz
TPS51100
sl8z4
diagram HANNSTAR k mv
VDD256
hannstar j mv 1
g792
WISTRON
diode c649 ST
1D05V
M54-p
PCI7412
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kb926
Abstract: kb925 FBMA-L11-201209-221LMA30T compal Compal Electronics foxconn Compal Merom RT8203 mobile 478 SOCKET PIN VSS256
Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Satna Rosa Platform 3 3 2007-07-24 REV:0.3 4 Compal Secret Data 2006/07/26 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
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SLG8SP553V
Abstract: KB926 LA4101P SP8K10 LM 4863 D FBMA-L11-201209-221LMA30T 4101p ich9 JMB385 compal notebook schematics
Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM+ICH9-M core logic 3 3 2008-01-01 4 4 Compal Secret Data Security Classification 2007/08/28 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
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4101P
SLG8SP553V
KB926
LA4101P
SP8K10
LM 4863 D
FBMA-L11-201209-221LMA30T
4101p
ich9
JMB385
compal notebook schematics
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LA-4082P
Abstract: G6179 XDR 1 NVIDIA schematics kb926 tps51125 Compal Electronics la-6121P Montevina compal notebook schematics FBMA-L11-201209-221LMA30T TPS2231
Text: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_PM+ICH9-M core logic 3 3 LA-4082P Vader Discrete NB9P-GS,NB9M-GE 2009-01-07 Rev 1.0_2F 4 4 2006/02/13 Issued Date Compal Electronics, Inc. Compal Secret Data
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LA-4082P
A4082
G6179
XDR 1
NVIDIA schematics
kb926
tps51125
Compal Electronics la-6121P Montevina
compal notebook schematics
FBMA-L11-201209-221LMA30T
TPS2231
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NS692405
Abstract: KB926 tps51125 KB926 sequence LA-4102p FBMA-L11-201209-221LMA30T kb926qf SLG8SP553 compal HP Keyboard KB 0316
Text: A B C D E 1 1 Compal confidential Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_PM+ICH9-M core logic 2 2 2008-02-25 3 3 www.kythuatvitinh.com 4 4 Compal Secret Data Security Classification 2008/02/25 Issued Date 2008/02/25 Deciphered Date Title
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LA-4102P
NS692405
KB926
tps51125
KB926 sequence
FBMA-L11-201209-221LMA30T
kb926qf
SLG8SP553
compal
HP Keyboard KB 0316
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l8730
Abstract: 109p0424h7 9wf0624h701 San "Ace 92" 109E17 9GV0412P3 9CRA0412G501 SDT 1000 thermistor 109p0624h 109R1212H1D01
Text: •DC San Ace DC COOLING FAN DC COOLING FAN ■ Precautions For Adoption Cautions ■precautions on the right may cause Failure to follow the moderate injury and property damage, or in some Sanyo Denki's ECO PRODUCTS are designed with the concept of lessening impact on the environment in the process from product development to waste.The product units
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4-03A/04
l8730
109p0424h7
9wf0624h701
San "Ace 92"
109E17
9GV0412P3
9CRA0412G501
SDT 1000 thermistor
109p0624h
109R1212H1D01
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Untitled
Abstract: No abstract text available
Text: 6 1 5 5 —5 2 SERIES PCI EXPRESS CONNECTOR £ GENERAL TOLERANCE ± 0 .2 5 m m GENERAL ANGLE TOLERANCE ±3° r- n 'SJy 1 REV DATE A 0 3 .1 1 .1 0 D E SC R IPTIO N NEW E C N NO. RELEASE NAME G -T H P A R T NO.: ^ WIESON VIESON ELECTRONIC CO., LTD *6155-52*
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UL94V-0.
WITH15
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Untitled
Abstract: No abstract text available
Text: 3501 SERIES USB A JACK HORIZONTAL TYPE SMD SINGLE PORT MATERIAL ^ HOUSING : THERMOPLASTIC U L 9 4 V -0 . HOUSING COLOR : SEE ORDER INFORMATION TERMINAL : COPPER ALLOY TERMINAL PLATING : SEE ORDER INFORMATION SHELL : COPPER ALLOY SHELL PLATING : SEE ORDER INFORMATION
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AK0406023
AK0407012
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Untitled
Abstract: No abstract text available
Text: Customer Drawing REV DATE DESCRIPTION 01 05.12.05 ECN NO. NAME NEW RELEASE Seam an 4 2 9 8 SERIES 0.4 BTB H1.5 FEMALE-CONNECTOR MATERIAL: 1.HOUSING: HIGH TEMPERATURE THERMOPLASTIC. U L 9 4 V -0 . 2.TERMINAL:COPPER ALL0Y,T=0.12 PLATING: S E E O RDER INFORMATION
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G4298â
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Untitled
Abstract: No abstract text available
Text: 1 1 1 DDR II S.O.DIMM SOCKET , 2 0 0 P I N , 5 . 2 m m HEIGHT 0.6 m m PITCH, 1 . 8 V RVS REV DATE DESCRIPTION A 06.03.13 NEW RELEASE B 06.09.13 C 0 7 .0 2 .0 8 A A ADD OPTION ECN NO. NAME wzjun CECR06001397 DELETE OPTION CECR07001664 wzjun ZYQ 66.80±0.1 ORDER INFORMATION
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CECR06001397
CECR07001664
P1267
AKH-2100-052-1
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Untitled
Abstract: No abstract text available
Text: 7 2 7 2 -0 7 SERIES 02.5 EARPHONE JACK REV DATE ECN NO. DESCRIPTION A 04.05.15 NEW RELEASE B 04.05.31 A MOLDFY AK0405016 C 04.06.15 A ADD GREEN OPTION AK0406013 D 04.08.06 A MOLDFY AK0408007 LOGO OPTION MATERIAL HOUSING : THERM0PLASTIC UL94 V -0 HOUSING COLOR: BLACK
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AK0405016
AK0406013
AK0408007
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Untitled
Abstract: No abstract text available
Text: 3281 S E R IE S DVI-D FEMALE VERTICAL TYPE REV D A TE D E S C R IP T IO N A 0 1 .0 7 .1 0 RELEASE B 0 1 .0 8 .1 5 MATERIAL SH ELL : ST E E L SIGNAL PIN : PHOSPHOR BRONZE GROUNDING LEG : B R A SS HOUSING : P B T + 3 0 % G .F . U L 9 4 V - 0 SCREW : ST E E L ALLOY , # 4 - 4 0 U N C - 2 B / 2 A
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Untitled
Abstract: No abstract text available
Text: 1 2 2 8 5 3 -1 0 SERIES 0.4 BTB H1.5 3 MALE-CONNECTOR MATERIAL: 1 .HOUSINGrHIGH TEMPERATURE THERMOPLASTIC. U L 9 4 V -0 . 2.TERM INALC0PPER A LLO Y ,T=0.12 PLATING:SEE ORDER INFORMATION NICKEL UNDER PLATED OVER ALL A ± 0 .0 5 ORDER INFORMATION: G 2 8 5 3 —10 * *
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Untitled
Abstract: No abstract text available
Text: REV DATE A 03.01.15 A 1013 SERIES DIN SOCKETS/MINIATURE CIRCULAR CONN. WITH FULL SHIELDING WITH HOOK 3P MATERIAL HOUSING: THERM< PLASTIC UL94V-0) HOUSING COLOR: SEE ORDER INFORMATION TERMINAL: COPPER ALLOY TERMINAL PLATING: SEE ORDER INFORMATION SHELL: COPPER ALLOY
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UL94V-0)
A1013
A1013-
P1014
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Untitled
Abstract: No abstract text available
Text: R E V DATE DESCRIPTION A 01.06.21 NET RELEASE B 02.08.21 A ADD P/N OPTION 3281 SERIES DVI-I FEMALE R /A WITH FORKLOCKS TYPE-11 MATERIAL SHELL : STEEL SIGNAL PIN : PHOSPHOR BRONZE RGB PIN : PHOSPHOR BRONZE GROUNDING PIN : BRASS FORKCLOCK LEG : BRASS HOUSING : THERMOPLASTIC UL 94V -0
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TYPE-11
120/xâ
100/xâ
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Untitled
Abstract: No abstract text available
Text: 6126 SERIES 1 .2 5 m m PICTH NON ZIF FOR FPC/FFC MATERIAL HOUSING : THERMOPLASTIC U L 9 4 V - 0 HOUSING COLOR : BLACK TERMINAL : COPPER ALLOY TERMINAL PLATING : S n /P b (FOR 6 1 2 6 - 1 9 * * * * ) OR Sn (FOR G 6 1 2 6 - 1 9 * * * * ) PLATED '- I ORDER INFORMATION
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P11006
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Untitled
Abstract: No abstract text available
Text: 1 Customer Drawing 1 REV 7273 SERIES 0 2 .5 EARPHONE JACK A B C D E F G MATERIAL HOUSING: THERMOPLASTIC U L94 V -O HOUSING COLOR: BLACK SHELL: COPPER ALLOY PIN1.PIN3.PIN4: COPPER ALLOY CONTACT&SHELL PLATING: SEE ORDER INFORMATION ORDER INFORMATION r 7273- 05 *
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AK0305008
AK0305010
AK0405002
AK0407012
AK0410023
AK0411023
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Untitled
Abstract: No abstract text available
Text: 1 J_ 2_ L RoHS Compliant MATERIAL: HOUSING HOUSING TERMINAL TERMINAL 3 2 8 1 SERIES D V I - I RIGHT ANGLE TYPE HIGH : SEE ORDER INFORMATION UL 9 4 V - 0 COLOR : SEE ORDER INFORMATION : COPPER ALLOY PLATING: SELECT Au IN CONTACT AREA, 1 0 0 u ”
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G3281
CA0009
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Untitled
Abstract: No abstract text available
Text: 7273 SEIRES 02.5mm EARPHONE JACK MATERIAL HOUSING : THERMOPLASTIC U L 9 4 V -0 HOUSING COLOR; BLACK TERMINAL : COPPER ALLOY T ER M IN A L PLATING : SEE ORDER INFO RM ATION ORDER INFORMATION NOTE: 1.P.C.B LAYOUT TOLERANCE;± 0 . 0 5mm 2.SM T COPLANARITY TOLERANCE 0.13m m
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AK0501020
25rnm
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Untitled
Abstract: No abstract text available
Text: REV A1060 SERIE S SLIM DIN S M T TY P E W /G R O U N D IN G 4 ,6 POS DATE DESCRIPTION A 99 .07.06 B 04.04.19 ECN NO. NAME A K 0404011 WSANMIN NEW RELEASE A CARTIS MODIFY 10.50 O 70 SOLDER RING 1 7 .3 zz REF 7 .4 0.8 ORDER INFORMATION A1060 - ” :NORMAL PRODUCT
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A1060
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