WLCSP Search Results

WLCSP Result Highlights (5)

Part	Manufacturer	Description
ISL91302B22-EVZ	Renesas Electronics Corporation	ISL91302B Evaluation Board 1, 2+2 PMIC, WLCSP RoHS Compliant
ISL91302B40-EVZ	Renesas Electronics Corporation	ISL91302B Evaluation Board 1, 4+0 PMIC, WLCSP RoHS Compliant
ISL91302B31-EVZ	Renesas Electronics Corporation	ISL91302B Evaluation board 1, 3+1 PMIC, WLCSP RoHS compliant
ISL9123II4Z-T	Renesas Electronics Corporation	Ultra-Low IQ Buck Regulator with Bypass, WLCSP-BP, /Reel
ISL9123IINZ-T	Renesas Electronics Corporation	Ultra-Low IQ Buck Regulator with Bypass, WLCSP-BP, /Reel

WLCSP Price and Stock

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Qualcomm DK-QCC5141-WLCSP94-A-0 DEV KIT, DK-QCC5141-WLCSP94-A-0
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DK-QCC5141-WLCSP94-A-0	Bulk	16		1	1 $851.2 10 $851.2 100 $851.2 1000 $851.2 10000 $851.2	Buy Now
Qualcomm DK-QCC3001-WLCSP-CE752-1A DEV KIT QC33001 WLCSP WT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DK-QCC3001-WLCSP-CE752-1A	Box	7		1	1 $800 10 $800 100 $800 1000 $800 10000 $800	Buy Now
Qualcomm DK-QCC3002-WLCSP-CE751-1A DEV KIT QC33002 WLCSP BT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DK-QCC3002-WLCSP-CE751-1A	Box	7		1	1 $800 10 $800 100 $800 1000 $800 10000 $800	Buy Now
Qualcomm DK-QCC3046-WLCSP94-A-0 DEV KIT, DK-QCC3046-WLCSP94-A-0
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DK-QCC3046-WLCSP94-A-0	Bulk	3		1	1 $800 10 $800 100 $800 1000 $800 10000 $800	Buy Now
Qualcomm DB-QCC5141-WLCSP94-A-0 DEV KIT, DB-QCC5141-WLCSP94-A-0
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DB-QCC5141-WLCSP94-A-0	Bulk	3		1	1 $200 10 $200 100 $200 1000 $200 10000 $200	Buy Now

Find more WLCSP price and stock on Findchips.com

WLCSP Datasheets (17)

Part	Manufacturer	Description	Datasheet Type	PDF
WLCSP	NXP Semiconductors	Guideline for the laser marking layout of WLCSP devices	Original	PDF
WLCSP12	NXP Semiconductors	Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm	Original	PDF
WLCSP12	NXP Semiconductors	Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm	Original	PDF
WLCSP12	NXP Semiconductors	WLCSP12: wafer level chip-scale package; 12 bumps	Original	PDF
WLCSP15	NXP Semiconductors	Wafer-level chip-size package; 15 bumps; (4 x 4 - C2)	Original	PDF
WLCSP16	NXP Semiconductors	Wafer level chip-size package; 16 bumps	Original	PDF
WLCSP16	NXP Semiconductors	Wafer level chip-size package; 16 bumps	Original	PDF
WLCSP17	NXP Semiconductors	Wafer level chip-size package; 17 bumps (6-5-6)	Original	PDF
WLCSP20	NXP Semiconductors	Wafer level chip-size package; 20 bumps	Original	PDF
WLCSP25	NXP Semiconductors	WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1)	Original	PDF
WLCSP25217X232	NXP Semiconductors	WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1)	Original	PDF
WLCSP39	NXP Semiconductors	Wafer level chip-scale package; 39 balls	Original	PDF
WLCSP4	NXP Semiconductors	Wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included)	Original	PDF
WLCSP4	NXP Semiconductors	Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm	Original	PDF

WLCSP49	NXP Semiconductors	Wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm	Original	PDF
WLCSP5	NXP Semiconductors	Wafer level chip-size package; 5 bumps (2-1-2)	Original	PDF
WLCSP6	NXP Semiconductors	Wafer level chip-size package; 6 bumps (2 x 3)	Original	PDF

WLCSP Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCC064GWZ-3 General Description BRCC064GWZ-3 is a serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 Completely conforming to the world standard I C BUS. All controls available by 2 ports of serial clock	Original	PDF	BRCC064GWZ-3 BRCC064GWZ-3 UCSP30L1 400KHz
Untitled Abstract: No abstract text available Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCA016GWZ-W 16Kbit General Description BRCA016GWZ-W series is a serial EEPROM of I2C BUS Interface Method. Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Completely conforming to the world standard I2C BUS. All controls available by 2 ports of serial clock (SCL)	Original	PDF	BRCA016GWZ-W 16Kbit) BRCA016GWZ-W 400KHz
RF6280 Abstract: RD6280 Text: RF6280 Preliminary POWER MANAGEMENT IC Package Style: 15-Bump WLCSP, 4 x 4 Array, 2 mm x 2 mm Features Peak Efficiency Up To 96% High Efficiency Over Various Loads Transient Response < 10 s 650 mA Current Capability	Original	PDF	RF6280 15-Bump RF6280 DS090304 RD6280
LQM18PN1R0 Abstract: CBMF1608 LQM18PN 953-MHz ADP2139 Text: Compact, 800 mA, 3 MHz, Step-Down DC-to-DC Converter ADP2138/ADP2139 Data Sheet FEATURES GENERAL DESCRIPTION Input voltage: 2.3 V to 5.5 V Peak efficiency: 95% 3 MHz fixed frequency operation Typical quiescent current: 24 A Very small solution size 6-lead, 1 mm x 1.5 mm WLCSP package	Original	PDF	ADP2138/ADP2139 ADP2138 ADP2139 CB-6-12 LQM18PN1R0 CBMF1608 LQM18PN 953-MHz
Untitled Abstract: No abstract text available Text: Package outline WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm A E NVT4555UK B A2 ball A1 index area A A1 D detail X e1 e ZE2 C Øv Øw b C A B C y D e C B ZE1 ball A1 index area e2 1/2 e A 1 ZD1 2 3 X ZD2 2 mm scale Dimensions mm are the original dimensions	Original	PDF	WLCSP12: NVT4555UK wlcsp12 nvt4555 nvt4555uk
Untitled Abstract: No abstract text available Text: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.53 mm A B D NX20P3xxUK ball A1 index area A2 E A A1 detail X e1 C e C A B C Øv Øw b y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions	Original	PDF	WLCSP16: NX20P3xxUK wlcsp16 nx20p3xxuk
Untitled Abstract: No abstract text available Text: Package outline WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm B D LPC1768UK A ball A1 index area A2 A A1 E detail X e1 1/2 e e Øv Øw b C A B C C y K e J H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 3 mm	Original	PDF	WLCSP100: LPC1768UK wlcsp100 lpc1768uk
Untitled Abstract: No abstract text available Text: Package outline WLCSP4: wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm Backside coating included A B D NX3P1107/NX3P1108 A2 ball A1 index area A A1 E detail X e 1/2 e C A B C Øv Øw b C y B 1/2 e e A ball A1 index area 1 2 X 1 mm scale Dimensions (mm are the original dimensions)	Original	PDF	NX3P1107/NX3P1108 nx3p1107-8
WLCSP15 Abstract: No abstract text available Text: Package outline WLCSP15: wafer-level chip-size package; 15 bumps; 4 x 4 - C2 D bump A1 index area A2 E A A1 detail X e1 e b D e C e2 B A 1 2 3 4 X European projection wlcsp15_4x4-c2_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not	Original	PDF	WLCSP15: wlcsp15
Untitled Abstract: No abstract text available Text: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm Backside coating included B A D NX5P1000 A2 ball A1 index area A E A1 detail X e1 1/2 e e C A B C Øv Øw b C y C e B e2 A ball A1 index area 1 2 3 4 X 2 mm scale	Original	PDF	WLCSP12: NX5P1000 wlcsp12 nx5p1000
Untitled Abstract: No abstract text available Text: Reflow soldering footprint WLCSP17: wafer level chip-size package; 17 bumps 6-5-6 D bump A1 index area A2 A E A1 detail X e 1/2 e b C e1 B1 B B2 B3 B4 B5 e2 A 1 2 3 e3 4 5 6 X European projection wlcsp17_6-5-6_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not	Original	PDF	WLCSP17: wlcsp17
SOLDERRM Abstract: WLCSP10 156BSC Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.56x1.05 CASE 567BH−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.	Original	PDF	WLCSP10, 567BH-01 567BH SOLDERRM WLCSP10 156BSC
WLCSP10 Abstract: No abstract text available Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 2.46x0.96 CASE 567BG−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	WLCSP10, 567BG-01 567BG WLCSP10
SOLDERRM Abstract: WLCSP15 Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 2.47x1.05 CASE 567BR−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È 0.05 C A 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	WLCSP15, 567BR-01 567BR SOLDERRM WLCSP15

567AZ-01 Abstract: No abstract text available Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP5, 0.94x1.41 CASE 567AZ−01 ISSUE O SCALE 4:1 D 2X A ÈÈ PIN A1 REFERENCE DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	567AZ-01 567AZ 567AZ-01
143X1 Abstract: wlcsp8 footprint Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.43x1.41 CASE 567BE−01 ISSUE O SCALE 4:1 D PIN A1 REFERENCE 2X A ÈÈ DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	567BE-01 567BE 143X1 wlcsp8 footprint
Untitled Abstract: No abstract text available Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP4, 0.96x0.96 CASE 567AW−01 ISSUE O SCALE 4:1 ÈÈ ÈÈ D PIN A1 REFERENCE 2X A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	567AW-01 567AW
WLCSP20 Abstract: No abstract text available Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.27x1.13 CASE 567BW−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER	Original	PDF	WLCSP20, 567BW-01 567BW WLCSP20
567BM-01 Abstract: WLCSP10 Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E e TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER	Original	PDF	WLCSP10, 567BM-01 567BM 567BM-01 WLCSP10
WLCSP-20 Abstract: 16X1 WLCSP20 Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.16x1.05 CASE 567BU−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER	Original	PDF	WLCSP20, 567BU-01 567BU WLCSP-20 16X1 WLCSP20
WLCSP10 Abstract: 567BL Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.96x1.33 CASE 567BL−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X ÈÈ D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL	Original	PDF	WLCSP10, 567BL-01 567BL WLCSP10 567BL
portable dvd player schematic diagram of video Abstract: 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK Text: SA58671 1.2 W/channel stereo class-D audio amplifier Rev. 02 — 24 October 2008 Product data sheet 1. General description The SA58671 is a stereo, filter-free class-D audio amplifier which is available in a 16 bump WLCSP Wafer Level Chip-Size Package . The SA58671 features independent shutdown controls for each channel. The gain can be	Original	PDF	SA58671 SA58671 portable dvd player schematic diagram of video 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK
Untitled Abstract: No abstract text available Text: BlueNRG Bluetooth low energy wireless network processor Datasheet - production data • On-chip non-volatile Flash memory  AES security co-processor  Low power modes  16 or 32 MHz crystal oscillator  12 MHz ring oscillator WLCSP34 QFN32  32 kHz crystal oscillator	Original	PDF	WLCSP34 QFN32 CFR47 STD-T66 DocID025108
A2 diode Abstract: No abstract text available Text: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W6x6.36 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID D TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 b 0.270 ±0.030	Original	PDF

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WLCSP Search Results

WLCSP Result Highlights (5)

WLCSP Price and Stock

Qualcomm DK-QCC5141-WLCSP94-A-0

Qualcomm DK-QCC3001-WLCSP-CE752-1A

Qualcomm DK-QCC3002-WLCSP-CE751-1A

Qualcomm DK-QCC3046-WLCSP94-A-0

Qualcomm DB-QCC5141-WLCSP94-A-0

WLCSP Datasheets (17)

WLCSP Datasheets Context Search

Untitled

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RF6280

LQM18PN1R0

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WLCSP15

Untitled

Untitled

SOLDERRM

WLCSP10

SOLDERRM

567AZ-01

143X1

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WLCSP20

567BM-01

WLCSP-20

WLCSP10

portable dvd player schematic diagram of video

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A2 diode