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    WS1M32 Search Results

    WS1M32 Datasheets (165)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    WS1M32-100G3C White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3CA White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3CX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-100G3I White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3IA White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3IX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-100G3M White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3MA White Microelectronics 100ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-100G3MX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-120G3C White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3CA White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3CX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-120G3I White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3IA White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3IX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-120G3M White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3MA White Microelectronics 120ns 5V power supply 1 x 32 SRAM module Original PDF
    WS1M32-120G3MX White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-17G3C White Electronic Designs 1Mx32 SRAM MODULE Original PDF
    WS1M32-17G3C White Microelectronics 17ns 5V power supply 1M x 32 SRAM module Original PDF
    ...

    WS1M32 Datasheets Context Search

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    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28

    Untitled

    Abstract: No abstract text available
    Text: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES  Access Times of 17, 20, 25ns  3.3V Power Supply  84 lead, 28mm CQFP, Package 511  Low Power CMOS  Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O0-31 A0-18

    WS1M32-XG3X

    Abstract: No abstract text available
    Text: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as


    Original     		PDF WS1M32-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32-XG3X I/O31 I/O30 I/O29 I/O28

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28

    Untitled

    Abstract: No abstract text available
    Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as


    Original     		PDF WS1M32V-XG3X 1Mx32 WS1M32V-XG3X 512Kx32, 2Mx16 I/O31 I/O30 I/O29 I/O28

    WS1M32-XH2X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XH2X 1Mx32 SRAM MODULE FEATURES  Access Times of 20, 25ns  5V Power Supply  Packaging  Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP Package 402 *  Built-in Decoupling Caps and Multiple Ground Pins


    Original     		PDF 1Mx32 512Kx32, 2Mx16 WS1M32-XH2X WS1M32-XH2X I/O0-31 A0-19

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: WS1M32V-XG3X White Electronic Designs PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XH2X 1Mx32 SRAM MODULE FEATURES „ Access Times of 20, 25ns „ 5V Power Supply „ Packaging „ Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP Package 402 * „ Built-in Decoupling Caps and Multiple Ground Pins


    Original     		PDF WS1M32-XH2X 1Mx32 512Kx32, 2Mx16 WS1M32-XH2X I/O0-31 A0-19 512Kx32

    511S

    Abstract: WS1M32-XG3X ah55
    Text: WS1M32-XG3X 1Mx32 SRAM MODULE PRELIMINARY* FEATURES • Access Time of 70, 85, 100, 120ns ■ TTL Compatible Inputs and Outputs ■ 84 lead, 28mm CQFP, Package 511 ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8


    Original     		PDF WS1M32-XG3X 1Mx32 120ns 512Kx32, 1Mx16 I/O31 I/O30 I/O29 I/O28 511S WS1M32-XG3X ah55

    WS1M32-XG3X

    Abstract: S1M32
    Text: WS1M32-XXX White Electronic Designs 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging • 84 lead, 28mm CQFP, Package 511 ■ TTL Compatible Inputs and Outputs • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP


    Original     		PDF WS1M32-XXX 1Mx32 512Kx32, 2Mx16 WS1M32-XH2X* WS1M32-XG3X I/O15 I/O0-31 S1M32

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XXX 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply • 84 lead, 28mm CQFP, Package 511 Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)*


    Original     		PDF 1Mx32 512Kx32, 2Mx16 WS1M32-XXX WS1M32-XH2X* WS1M32-XG3X I/O10 512Kx32

    WS1M32-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES „ Access Times of 17, 20, 25ns „ Low Power CMOS „ Packaging „ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation „ Weight • 84 lead, 28mm CQFP, Package 511 „ Organized as two banks of 512Kx32, User


    Original     		PDF WS1M32-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32-XG3X I/O31 I/O30 I/O29 I/O28

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28

    WS1M32V-XG3X

    Abstract: No abstract text available
    Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES n Access Times of 17, 20, 25ns n 3.3 Volt Power Supply n 84 lead, 28mm CQFP, Package 511 n Low Power CMOS n Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8


    Original     		PDF WS1M32V-XG3X 1Mx32 512Kx32, 2Mx16 WS1M32V-XG3X I/O31 I/O30 I/O29 I/O28

    WS1M32-XG3X

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XG3X PRELIMINARY* 1Mx32 SRAM MODULE FEATURES Access Time of 70, 85, 100, 120ns 5V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8 Weight - WS1M32-XG3X - 20 grams typical


    Original     		PDF WS1M32-XG3X 1Mx32 120ns 512Kx32, 1Mx16 WS1M32-XG3X I/O31 I/O30 I/O29

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as


    OCR Scan     		PDF WS1M32-XG3X 1Mx32 WS1M32-XG3X AO-18 512Kx32

    Untitled

    Abstract: No abstract text available
    Text: WS1M32V-XG3X Hi-REUÄBiUTY PRODUCT 1Mx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Tim es of 17, 20, 25ns Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 B uilt-in Decoupling Caps and M ultiple G round Pins for Low Noise O peration ■ O rganized as two banks of 512Kx32, User C onfigurable as


    OCR Scan     		PDF WS1M32V-XG3X 1Mx32 512Kx32

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE PRELIMINARY * FEATURES • A c c e s s Tim e of 70, 85, 100, 120ns T T L Com patible Inputs and Outputs ■ 84 lead, 28mm CQFP, Packag e 511 5 V o lt P ow er Supply ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as


    OCR Scan     		PDF WS1M32-XG3X 1Mx32 120ns WS1M32-XG3X AO-18 512Kx32

    Untitled

    Abstract: No abstract text available
    Text: Z2 WS1M32-XG4TX WHITE /M ICROELECTRONICS 1Mx32 SRAM MODULE advanced* FEATURES • Access Times of 17, 20, 25ns ■ Low Power C M O S ■ 68 lead, 40mm Low Profile CQFP, 3.5mm 0.140" high (Package 502) ■ Built in Decoupling Caps and Multiple Ground Pins for Low


    OCR Scan     		PDF WS1M32-XG4TX 1Mx32 512Kx32

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG4DX WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE ADVANCED* FEATURES • A cce ss Tim es of 25, 35, 45nS ■ L ow P ow er CMOS ■ ■ B u ilt in D ecoupling Caps and M u lt ip le Ground Pins fo r Low N oise O peration 68 lead, 4 0m m 1.560" square H erm e tic CQFP, 5.2m m


    OCR Scan     		PDF WS1M32-XG4DX 1Mx32

    Untitled

    Abstract: No abstract text available
    Text: WS1M32V-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A ccess Tim es o f 17, 20, 25ns ■ Low P o w e r CMOS ■ 84 lead, 28m m CQFP, Package 511 ■ B uilt-in D ecoupling Caps and M u lt ip le Ground Pins fo r Low N oise O peration


    OCR Scan     		PDF WS1M32V-XG3X 1Mx32 2Kx32,

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns ■ Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 ■ Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 512 K x 3 2 , U ser C o nfig urable as


    OCR Scan     		PDF WS1M32-XG3X 1Mx32 I/O0-31 512Kx32 2Mx16

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 B uilt-in Decoupling Caps and M u ltip le Ground Pins fo r Low N oise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as


    OCR Scan     		PDF WS1M32-XG3X 1Mx32 512Kx32

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32V-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A ccess Tim es of 17, 20, 25ns ■ ■ 84 lead, 28m m CQFP, Package 511 ■ ■ B u ilt-in D ecoupling Caps and M u ltip le Ground Pins fo r Low N oise O peration O rganized as tw o banks of 512Kx32, User C o nfig ura ble as


    OCR Scan     		PDF WS1M32V-XG3X 1Mx32 512Kx32, WS1M32V-X