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Altech Corporation NZ03B NEOZED DO3 FUSE BASE 1 SINGLEP 1
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DigiKey	NZ03B	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Amphenol PCD M85049-2914Z03B CONN BACKSH W/CLMP SZ14 15 BLK
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DigiKey	M85049-2914Z03B	Bag			25	1 - 10 - 100 $34.0436 1000 $34.0436 10000 $34.0436	Buy Now
Amphenol PCD M85049-1821Z03B CONN BACKSHELL W/CLMP SZ21 G BLK
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DigiKey	M85049-1821Z03B	Bag			25	1 - 10 - 100 $55.714 1000 $55.714 10000 $55.714	Buy Now
Amphenol PCD M85049-1915Z03B CONN BACKSHELL W/CLMP SZ15 D BLK
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DigiKey	M85049-1915Z03B	Bag			25	1 - 10 - 100 $48.4944 1000 $48.4944 10000 $48.4944	Buy Now
Amphenol PCD M85049-2121Z03B CONN BACKSHELL W/CLMP SZ21 G BLK
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DigiKey	M85049-2121Z03B	Bag			25	1 - 10 - 100 $38.63 1000 $38.63 10000 $38.63	Buy Now

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Z03B Datasheets (4)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
Z03B		National Semiconductor	3 Lead Molded TO-92		Original	PDF
Z03B-1		National Semiconductor	3 Lead Molded TO-92 NS Package Number Z03B		Original	PDF
Z03B-2		National Semiconductor	3 Lead Molded TO-92 NS Package Number Z03B		Original	PDF
Z03B-3		National Semiconductor	3 Lead Molded TO-92 NS Package Number Z03B		Original	PDF

Z03B Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
CEPO Abstract: A723 b537 533B P7A1 W316 Text: 532,- 5645 ;:A2< 7/>05694 <27/B 3FCQROFP S v/B167<5 @3:/G S baam AE7B167<5 1/>/07:7BG S m11=@27<5 B= uqo gcaff^dbk*oe Zo=<B/1Bke_f9mln3/@/0:3 :=/2kba9m :=/2^1C@@3<B[ S mo^D=:B/53 2@7D7<5 7A 43/A70:3 S e9+ 273:31B@71 AB@3<5B6 Z03BE33< 1=7: /<2 1=<B/1BA[ S q<D7@=<;3<B/: 4@73<2:G >@=2C1B Z\|=t} 1=;>:7/<B[	Original	43/A70 Z03BE33< 71/B7 2/B/A633B 317471/B7 AC0831B E6716 CAB71 CEPO A723 b537 533B P7A1 W316	PDF
Z03B Abstract: No abstract text available Text: 3 Lead Molded TO-92 NS Package Number Z03B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL	Original		PDF
CD Z44 Abstract: M1127 P7A1 A723 bca 07 BAA 9K 3B71 B637 Text: 532,- 5645 ;:A2< 7/>05694 <27/B 3FCQROFP S v/B167<5 @3:/G S baam AE7B167<5 1/>/07:7BG S m11=@27<5 B= uqo gcaff^dbk*oe Zo=<B/1Bke_f9mln3/@/0:3 :=/2kba9m :=/2^1C@@3<B[ S mo^D=:B/53 2@7D7<5 7A 43/A70:3 S e9+ 273:31B@71 AB@3<5B6 Z03BE33< 1=7: /<2 1=<B/1BA[ S q<D7@=<;3<B/: 4@73<2:G >@=2C1B Z\|=t} 1=;>:7/<B[	Original	43/A70 Z03BE33< 71/B7 2/B/A633B 317471/B7 AC0831B E6716 CAB71 CD Z44 M1127 P7A1 A723 bca 07 BAA 9K 3B71 B637	PDF
NATIONAL SEMICONDUCTOR TO-92 Abstract: transistor a 92 JAPAN transistor Z03A Z03B Z03C Z03D Z03E Z03G Z03H Text: Transistor Outline TO-92 3 Lead Molded TO-92 NS Package Number Z03A 2000 National Semiconductor Corporation MS101171 www.national.com Transistor Outline (TO-92) May 1999 Transistor Outline (TO-92) 3 Lead Molded TO-92 NS Package Number Z03B www.national.com	Original	MS101171 NATIONAL SEMICONDUCTOR TO-92 transistor a 92 JAPAN transistor Z03A Z03B Z03C Z03D Z03E Z03G Z03H	PDF
Z04B Abstract: MR27V6441L MARK Z04D MR27V6441L-xxxMP Z04D 48TSOP2 ST03 Text: OKI Semiconductor MR27V6441L PEDR27V6441L-02-03 Issue Date: April 4, 2005 Preliminary 64M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27V6441L is a 64 Mbit Production Programmed Read-Only Memory, which is configured as 67,108,864 word × 1-bit. The MR27V6441L supports a simple read operation using a single 3.3V power supply	Original	MR27V6441L PEDR27V6441L-02-03 MR27V6441L 33MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D MR27V6441L-xxxMP Z04D 48TSOP2 ST03	PDF
Z04B Abstract: MARK Z04D Text: FEDR27T1641L-02-H1 ＯＫＩ Semiconductor MR27T1641L This version : Feb.28, 2005 Previous version: -.- 8M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27T1641L is a 16 Mbit Production Programmed Read-Only Memory, which is configured as	Original	FEDR27T1641L-02-H1 MR27T1641L MR27T1641L 30MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D	PDF
SmD TRANSISTOR a42 Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2 Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages	Original		PDF
Z04B Abstract: MARK Z04D Text: OKI Semiconductor MR27V1641L FEDR27V1641L-02-H1 Issue Date: April 21, 2006 16M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27V1641L is a 16 Mbit Production Programmed Read-Only Memory, which is configured as 16,777,216 word × 1-bit. The MR27V1641L supports a simple read operation using a single 3.0V or 3.6V power	Original	MR27V1641L FEDR27V1641L-02-H1 MR27V1641L 30MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D	PDF
Z04B Abstract: MARK Z04D Z04D so-8 mark a18 MR27V3241L 40DIP 48TSOP2 CODE z04a Text: OKI Semiconductor MR27V3241L FEDR27V3241L-02-H2 Issue Date: April 4, 2005 32M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27V3241L is a 32 Mbit Production Programmed Read-Only Memory, which is configured as 33,554,432 word × 1-bit. The MR27V3241L supports a simple read operation using a single 3.3V power supply	Original	MR27V3241L FEDR27V3241L-02-H2 MR27V3241L 50MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D Z04D so-8 mark a18 40DIP 48TSOP2 CODE z04a	PDF
vjp44a Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages	Original	MS011798 vjp44a MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd	PDF
iso 1043-1 Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A	PDF
iso 1043-1 Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray	PDF
T03A Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages	Original		PDF